Paul Soloman

US Patent:

8247904, Aug 21, 2012

Filed:

Aug 13, 2009

Appl. No.:

12/540759

Inventors:

Sarunya Bangsaruntip - Yorktown Heights NY, US
Daniel C. Edelstein - Yorktown Heights NY, US
William D. Hinsberg - San Jose CA, US
Steven Koester - Yorktown Heights NY, US
Paul M. Soloman - Yorktown Heights NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/48

US Classification:

257773, 257775, 257E21017, 438618

Abstract:

An interconnection between a sublithographic-pitched structure and a lithographic pitched structure is formed. A plurality of conductive lines having a sublithographic pitch may be lithographically patterned and cut along a line at an angle less than 45 degrees from the lengthwise direction of the plurality of conductive lines. Alternately, a copolymer mixed with homopolymer may be placed into a recessed area and self-aligned to form a plurality of conductive lines having a sublithographic pitch in the constant width region and a lithographic dimension between adjacent lines at a trapezoidal region. Yet alternately, a first plurality of conductive lines with the sublithographic pitch and a second plurality of conductive lines with the lithographic pitch may be formed at the same level or at different.