Peng Zhang

US Patent:

6641986, Nov 4, 2003

Filed:

Aug 12, 2002

Appl. No.:

10/218068

Inventors:

Peng Zhang - Quakertown PA
Danielle Megan King - Emmaus PA
Eugene Joseph Karwacki - Orefield PA
Leslie Cox Barber - Cave Creek AZ

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

G03F 730

US Classification:

430325, 4302711, 430327, 430331, 510175, 510176, 510421, 516204, 568616, 568855

Abstract:

Aqueous solutions comprising one or more acetylenic diol type surfactants are used to improve the wettability of a substrate surface by lowering the contact angle of the aqueous developer solution are enclosed herein. In one embodiment, the aqueous solution is used to prepare the surface of the substrate prior to development of the resist coating layer.

US Patent:

7097705, Aug 29, 2006

Filed:

Mar 29, 2002

Appl. No.:

10/112537

Inventors:

Carrington Duane Smith - Slatington PA, US
Evelyn Jennifer Lin Paulsen - Macungie PA, US
Peng Zhang - Whitehall PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C09K 3/00
C09K 101/00
C08K 5/17
C08K 5/3462
C09D 11/10

US Classification:

1062873, 524186, 524236, 523160

Abstract:

This invention provides water-based compositions, particularly coating, ink, adhesive, fountain solution and agricultural compositions, manifesting reduced equilibrium and dynamic surface tension by the incorporation of a surface tension reducing amount of a mixture of a non-fluorinated anionic compound and a non-fluorinated weak base cationic compound, the mixture demonstrating a dynamic surface tension (DST) which is less than the DST of the individual anionic and cationic compounds and less than 45 dynes/cm, at a concentration of ≦5 wt % in water at 23 C. and 20 bubbles/second or less than 40 dynes/cm at a concentration of ≦0. 03M in water at 23 C. and 0. 1 bubbles/second according to the maximum-bubble pressure method.

US Patent:

7129199, Oct 31, 2006

Filed:

Jul 10, 2003

Appl. No.:

10/616662

Inventors:

Peng Zhang - Quakertown PA, US
Danielle Megan King Curzi - Center Valley PA, US
Leslie Cox Barber - Cave Creek AZ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 7/32

US Classification:

510175, 510176

Abstract:

Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.

US Patent:

7208049, Apr 24, 2007

Filed:

Oct 20, 2003

Appl. No.:

10/689402

Inventors:

Peng Zhang - Quakertown PA, US
Brenda Faye Ross - Whitehall PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C23G 1/00

US Classification:

134 3, 134 2, 134 254, 134 26, 134 28, 134 29, 134 30, 134 34, 134 36, 134 41, 134902

Abstract:

Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

US Patent:

7348300, Mar 25, 2008

Filed:

Feb 1, 2005

Appl. No.:

11/048576

Inventors:

Kevin Rodney Lassila - Westford MA, US
Paula Ann Uhrin - Allentown PA, US
Peng Zhang - Quakertown PA, US
Danielle Megan King Curzi - San Francisco CA, US
Leslie Cox Barber - Cave Creek AZ, US
Brenda Faye Ross - Whitehall PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 7/30

US Classification:

510175, 510421, 510506

Abstract:

Disclosed herein are process solutions, which may be aqueous-based, non-aqueous-based, and combinations thereof, that contain at least one alkoxylated acetylenic diol surfactant. In one aspect, the process solution comprises water and an alkoxylated acetylenic diol surfactant having the formula A:.

US Patent:

7452426, Nov 18, 2008

Filed:

Sep 12, 2006

Appl. No.:

11/519476

Inventors:

Peng Zhang - Quakertown PA, US
Brenda Faye Ross - Whitehall PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C23G 1/00

US Classification:

134 3, 134 2, 134 254, 134 26, 134 28, 134 29, 134 30, 134 34, 134 36, 134 41, 134902

Abstract:

Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

US Patent:

7521405, Apr 21, 2009

Filed:

Mar 19, 2004

Appl. No.:

10/804513

Inventors:

Peng Zhang - Quakertown PA, US
Danielle Megan King Curzi - Center Valley PA, US
Leslie Cox Barber - Cave Creek AZ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 7/50

US Classification:

510175, 510176, 134 3

Abstract:

Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.

US Patent:

7591270, Sep 22, 2009

Filed:

Sep 14, 2006

Appl. No.:

11/520971

Inventors:

Peng Zhang - Quakertown PA, US
Danielle Megan King Curzi - Center Valley PA, US
Leslie Cox Barber - Cave Creek AZ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

B08B 3/08
C11D 7/32

US Classification:

134 13, 134902, 510175, 510176, 430331, 430322

Abstract:

Process solutions comprising one or more surfactants are used to reduce the number of pattern collapse defects on a plurality of photoresist coated substrates during the manufacture of semiconductor devices.