Peter C Farmer

US Patent:

20040194305, Oct 7, 2004

Filed:

Apr 15, 2004

Appl. No.:

10/824723

Inventors:

L. deRochemont - Hampton NH, US
Peter Farmer - Longmeadow MA, US

Assignee:

L. Pierre deRochemont d/b/a C2 Technologies

International Classification:

H01L023/06
H05K003/30

US Classification:

029/854000, 029/832000

Abstract:

Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member (may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

US Patent:

20060200958, Sep 14, 2006

Filed:

May 8, 2006

Appl. No.:

11/430152

Inventors:

L. deRochemont - Hampton NH, US
Peter Farmer - Longmeadow MA, US

International Classification:

H01G 7/00
H05K 3/20
H05K 3/30

US Classification:

029025410, 029832000, 029831000, 029841000

Abstract:

Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

US Patent:

63235498, Nov 27, 2001

Filed:

Jun 25, 1999

Appl. No.:

9/344682

Inventors:

L. Pierre deRochemont - Hampton NH
Peter H. Farmer - Longmeadow MA

International Classification:

H01L 2306
H01L 2310
H01L 2315

US Classification:

257703

Abstract:

A composite wiring structure (10) for use with at least one semiconductor device (16). The composite wiring structure having a first conductive member (12) upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member (20), made of ceramic or organo-ceramic composite material, is bonded to the first conductive member (12) and contains embedded therein a conductive network (24) and a thermal distribution network (26). A second conductive member (32) may be incorporated with the composite wiring structure, with a capacitor (64) being electrically connected between the conductive network (24) and the second conductive member (32). Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

US Patent:

61434329, Nov 7, 2000

Filed:

Jan 9, 1998

Appl. No.:

9/004928

Inventors:

L. Pierre de Rochemont - Hampton NH
Peter H. Farmer - Longmeadow MA

International Classification:

B32B 900
B32B 300

US Classification:

428689

Abstract:

A ceramic composite having a substrate bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880. degree. C. , and ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, and higher level assemblies including such devices.