Peter H Farmer

US Patent:

6742249, Jun 1, 2004

Filed:

Nov 21, 2001

Appl. No.:

09/990615

Inventors:

L. Pierre deRochemont - Dover NH 03821-1899
Peter H. Farmer - Dover NH 03821-1899

International Classification:

H05K 330

US Classification:

29841, 29832, 29855, 174252, 257707, 257713, 428209, 428901

Abstract:

Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

US Patent:

20040194305, Oct 7, 2004

Filed:

Apr 15, 2004

Appl. No.:

10/824723

Inventors:

L. deRochemont - Hampton NH, US
Peter Farmer - Longmeadow MA, US

Assignee:

L. Pierre deRochemont d/b/a C2 Technologies

International Classification:

H01L023/06
H05K003/30

US Classification:

029/854000, 029/832000

Abstract:

Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member (may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

US Patent:

20060200958, Sep 14, 2006

Filed:

May 8, 2006

Appl. No.:

11/430152

Inventors:

L. deRochemont - Hampton NH, US
Peter Farmer - Longmeadow MA, US

International Classification:

H01G 7/00
H05K 3/20
H05K 3/30

US Classification:

029025410, 029832000, 029831000, 029841000

Abstract:

Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

US Patent:

48145297, Mar 21, 1989

Filed:

Nov 24, 1986

Appl. No.:

6/933837

Inventors:

George E. Cartier - Springfield MA
Peter H. Farmer - Longmeadow MA

International Classification:

C08F 800

US Classification:

525 61

Abstract:

Polyvinyl butyral (PVB) resin lightly cross-linked through stable intermolecular linkages developed, for example, through use of a dialdehyde or trialdehyde, to selectively increase PVB molecular weight and the modulus of a plasticized sheet formed therefrom intended for use in laminated safety glass assemblies.

US Patent:

42525195, Feb 24, 1981

Filed:

Nov 16, 1979

Appl. No.:

6/095177

Inventors:

Peter H. Farmer - Springfield MA
Timothy J. Fowler - Des Peres MO
John C. Hoagland - Longmeadow MA

Assignee:

Monsanto Company - St. Louis MO

International Classification:

B29F 304

US Classification:

425466

Abstract:

An improved slit die for extruding thermoplastic sheet and having the capacity for fine gauge control comprises a die blade and an opposed surface in which the local separation between the two is variable by the generation of localized expansion and contraction forces in the body of the die blade while isolating the die blade lip from temperature variations by the provision of a heat barrier means.

US Patent:

54784123, Dec 26, 1995

Filed:

Jun 7, 1993

Appl. No.:

8/070366

Inventors:

Robert H. M. Simon - Longmeadow MA
Peter H. Farmer - Longmeadow MA

Assignee:

Monsanto Company - St. Louis MO

International Classification:

B32B 300

US Classification:

428142

Abstract:

A plastic sheet, preferably of plasticized partial polyvinyl butyral, for a laminated safety glazing, having means dispersed on its surface, preferably comprising a multiplicity of spaced projections, capable of resisting adhesion to a rigid panel, such as glass, of such a glazing when the sheet is laminated to the panel, the area of the sheet surface without such dispersed means having high affinity for adhesion. The projections physically block adhesion of a dispersed area of the sheet to the panel in that the means on the sheet surface have no or weak interfacial adhesion. The multiplicity of space projections also have low or no affinity for adhesion when in blocking contact with each other or with another plasticized partial polyvinyl butyral surface and thereby increase blocking resistance.

US Patent:

63235498, Nov 27, 2001

Filed:

Jun 25, 1999

Appl. No.:

9/344682

Inventors:

L. Pierre deRochemont - Hampton NH
Peter H. Farmer - Longmeadow MA

International Classification:

H01L 2306
H01L 2310
H01L 2315

US Classification:

257703

Abstract:

A composite wiring structure (10) for use with at least one semiconductor device (16). The composite wiring structure having a first conductive member (12) upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member (20), made of ceramic or organo-ceramic composite material, is bonded to the first conductive member (12) and contains embedded therein a conductive network (24) and a thermal distribution network (26). A second conductive member (32) may be incorporated with the composite wiring structure, with a capacitor (64) being electrically connected between the conductive network (24) and the second conductive member (32). Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

US Patent:

48748145, Oct 17, 1989

Filed:

Feb 27, 1989

Appl. No.:

7/316564

Inventors:

George E. Cartier - Springfield MA
Peter H. Farmer - Longmeadow MA

Assignee:

Monsanto Company - St. Louis MO

International Classification:

C08F 800

US Classification:

525 61

Abstract:

Polyvinyl butyral (PVB) resin lightly cross-linked through stable intermolecular linkages developed, for example, through use of a dialdehyde or trialdehyde, to selectively increase PVB molecular weight and the modulus of a plasticized sheet formed therefrom intended for use in laminated safety glass assemblies.