Peter A Stenger

US Patent:

6975267, Dec 13, 2005

Filed:

Feb 5, 2003

Appl. No.:

10/358278

Inventors:

Peter A. Stenger - Woodbine MD, US
Fred C. Kuss - Elkridge MD, US
Kevin LaCour - Laurel MD, US
Craig Heffner - Ellicott City MD, US
Robert Sisk - Annapolis MD, US
Carl D. Wise - Severna Park MD, US
Joseph Paquin - Columbia MD, US
Tujuana Hinton - Baltimore MD, US
Andrew Walters - Elkridge MD, US
David Krafcsik - Crownsville MD, US
Brian T. McMonagle - Woodstock MD, US
Steven D. Block - Pikesville MD, US
Steven S. Handley - Severna Park MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01Q003/22
H01Q003/24
H01Q003/26
G01S013/00

US Classification:

342371, 342147, 342157, 342175, 342368, 342372

Abstract:

A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together. The waveguide relocator panel and the beam control tiles are designed to route RF signals to and from a respective transceiver module of four transceiver modules and a quadrature array of antenna radiators matched to free space formed in the faceplate. Planar type metal spring gaskets are provided between the interfacing layers so as to provide and ensure interconnection between mutually facing waveguide ports and to prevent RF leakage from around the perimeter of the waveguide ports.

US Patent:

7132990, Nov 7, 2006

Filed:

Feb 18, 2005

Appl. No.:

11/060774

Inventors:

Peter A. Stenger - Woodbine MD, US
Fred C. Kuss - Elkridge MD, US
Kevin LaCour - Laurel MD, US
Craig Heffner - Ellicott City MD, US
Robert Sisk - Annapolis MD, US
Carl D. Wise - Severna Park MD, US
Joseph Paquin - Columbia MD, US
Tujuana Hinton - Baltimore MD, US
Andrew Walters - Elkridge MD, US
David Krafcsik - Crownsville MD, US
Brian T. McMonagle - Woodstock MD, US
Steven D. Block - Pikesville MD, US
Steven S. Handley - Severna Park MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01Q 19/06

US Classification:

343754, 333125

Abstract:

A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together. The waveguide relocator panel and the beam control tiles are designed to route RF signals to and from a respective transceiver module of four transceiver modules and a quadrature array of antenna radiators matched to free space formed in the faceplate. Planar type metal spring gaskets are provided between the interfacing layers so as to provide and ensure interconnection between mutually facing waveguide ports and to prevent RF leakage from around the perimeter of the waveguide ports.

US Patent:

7420436, Sep 2, 2008

Filed:

Mar 14, 2006

Appl. No.:

11/373983

Inventors:

Peter A. Stenger - Woodbine MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01P 5/107

US Classification:

333 26, 333 34

Abstract:

In one aspect, an embodiment of the invention provides a transition from a planar substrate/chip circuit microwave transmission line to waveguide transmission media on the back of the substrate/chip. The transition enables planar waveguide fed MMW ESA architectures to be realized within the tight grid spacing required for emerging MMW ESAs.

US Patent:

7479841, Jan 20, 2009

Filed:

Feb 15, 2005

Appl. No.:

11/057127

Inventors:

Peter A. Stenger - Woodbine MD, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01P 5/107

US Classification:

333 26, 333 33

Abstract:

An MMIC chip is disclosed that includes a planar substrate having a first surface and a second surface, a conductive layer having an opening on the first surface, a transmission line on the second surface, at least one conductor extending from the conductive layer to the second surface defining a waveguide around the opening, wherein the transmission line is connected to the at least one conductor such that a signal traveling along the transmission line is guided toward the opening in the first side by the at least one conductor.

US Patent:

8476757, Jul 2, 2013

Filed:

Oct 2, 2009

Appl. No.:

12/572476

Inventors:

Peter A. Stenger - Woodbine MD, US
Mark E. Schneider - Millersville MD, US
Thomas A. Andersen - Catonsville MD, US

Assignee:

Northrop Grumman Systems Corporation - Falls Church VA

International Classification:

H01L 23/34

US Classification:

257728, 257E23021

Abstract:

A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.

US Patent:

55176879, May 14, 1996

Filed:

Feb 9, 1994

Appl. No.:

8/194199

Inventors:

Edward C. Niehenke - Baltimore MD
Marvin Cohn - Baltimore MD
Peter A. Stenger - Woodbine MD

Assignee:

Westinghouse Electric Corporation - Pittsburgh PA

International Classification:

H04B 126

US Classification:

455325

Abstract:

A subharmonic image rejection and image enhancement mixer for mixing millimeter wavelength signals using a low conversion loss technique is described. A local oscillator frequency from an external source is fed to a first subharmonic mixer and through a phase shifter to a second subharmonic mixer. The phase shifter delays the local oscillator signal by (90. degree. /n), where n is the multiple of the subharmonic mixers and is greater than 1. The first and second subharmonic mixers mix the local oscillator frequency with an input signal, which includes a desired frequency and an image frequency, to produce an intermediate frequency having a desired component and an image component at a select phase. A 0. degree. -90. degree. hybrid separates and terminates the image component of the intermediate frequency. The input port that feeds the input signal to each subharmonic mixer is dimensioned so as to provide a virtual image short termination or an image short termination to a self-generated image signal from each subharmonic mixer, thereby decreasing the conversion loss of the frequency mixer.