Philip R Lacourt

US Patent:

7022402, Apr 4, 2006

Filed:

Jul 14, 2003

Appl. No.:

10/620089

Inventors:

Philip Roland Lacourt - Chillicothe OH, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

B32B 1/00
B32B 7/12
B32B 15/02
B32B 27/08

US Classification:

428215, 428336, 428337, 428380, 428422, 4284735

Abstract:

An asymmetric multi-layer insulative film of improved internal adhesive strength is made by combining a layer of polyimide and a high-temperature bonding layer, the high-temperature bonding layer being derived from a high temperature base polymer made of poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (PFA) and optionally blended with from 0–60 weight percent poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP). The polyimide and high-temperature bonding layer laminate optionally also contains a layer of unsintered, partially sintered, or totally sintered polytetrafluoroethylene (PTFE) bonded directly to the high-temperature bonding layer. In addition, the polyimide high-temperature bonding layer laminate may be adhered to a poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) adhesive primer layer to more effectively bond the polyimide core layer to the high-temperature bonding layer. This type of primer layer may also be used as a polyimide-to-metal bonding layer to assist bonding of the polyimide to a metal wire or metal layer.

US Patent:

20090229809, Sep 17, 2009

Filed:

Feb 12, 2009

Appl. No.:

12/369771

Inventors:

Brian C. AUMAN - Pickerington OH, US
Carl HAEGER - Reynoldsburg OH, US
Philip Roland LACOURT - Chillicothe OH, US
Mark Elliott MCALEES - Circleville OH, US
Stanley Duane MERRITT - Bear DE, US
George Wyatt PREJEAN - ORANGE TX, US
Harland Lee TATE - Golden CO, US

Assignee:

E. I. DU PONT DE NEMOURS AND COMPANY - Wilmington DE

International Classification:

F28F 7/00

US Classification:

165185

Abstract:

The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both.

US Patent:

20090297858, Dec 3, 2009

Filed:

May 29, 2008

Appl. No.:

12/128689

Inventors:

DANNY E. GLENN - Circleville OH, US
BRIAN C. AUMAN - Pickerington OH, US
KUPPUSAMY KANAKARAJAN - Dublin OH, US
PHILIP ROLAND LACOURT - Chillicothe OH, US

Assignee:

E. I. DU PONT DE NEMOURS AND COMPANY - Wilmington DE

International Classification:

B32B 27/00

US Classification:

428421

Abstract:

The present disclosure relates to a multilayer insulation structure having superior abrasion resistance. The multilayer insulation structure has a first polyimide outer layer, a polyimide core layer and an optional second polyimide outer layer. The first and second polyimide outer layers contain a fluoropolymer micropowder. The first and second polyimide outer layers have a combined weight of from 10 to 80 weight % of the total weight of the multilayer insulation structure. The abrasion resistance of the multilayer insulation structure is from 1500 to 18300 scrape cycles. The multilayer insulation structure is useful as wire or cable insulation wrap.

US Patent:

20100108140, May 6, 2010

Filed:

Oct 30, 2009

Appl. No.:

12/609271

Inventors:

Brian C. Auman - Pickerington OH, US
Carl Haeger - Reynoldsburg OH, US
Philip Roland Lacourt - Chillicothe OH, US
Mark Elliott McAlees - Circleville OH, US
Stanley Duane Merritt - Bear DE, US
George Wyatt Prejean - Orange TX, US
Harland Lee Tate - Golden CO, US

Assignee:

E. I. DU PONT DE NEMOURS AND COMPANY - Wilmington DE

International Classification:

H01L 31/042

US Classification:

136256

Abstract:

The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic based polymer. The adhesive layers and the substrate may contain thermally conductive fillers, light absorbing pigments or mixtures of both.

US Patent:

53994345, Mar 21, 1995

Filed:

Dec 21, 1993

Appl. No.:

8/170842

Inventors:

Morton Katz - Columbus OH
Philip R. LaCourt - Chillicothe OH

Assignee:

E. I. Du Pont de Nemours and Company - Wilmington DE

International Classification:

B32B 2708
H01B 344

US Classification:

428421

Abstract:

Laminar structures having a polyimide core layer, inner fluorinated ethylenepropylene copolymer (FEP) layers, intermediate polytetrafluoroethylene homopolymer (PTFE) and fluorinated ethylenepropylene copolymer (FEP) blend layers and outer fluorinated ethylenepropylene copolymer (FEP) layers for use in the form of narrow tapes as an insulating wire or cable wrap.