Qian L Wang

Address:

7939 Montague Mnr Ln, Houston, TX 77072

VIN:

3VWEF71K57M063838

Make:

VOLKSWAGEN

Model:

JETTA

Year:

2007

US Patent:

7000141, Feb 14, 2006

Filed:

Nov 14, 2001

Appl. No.:

10/295554

Inventors:

Magnus Karlsson - Mountain View CA, US
Qian Wang - State College PA, US
John Wilkes - Palo Alto CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G06F 11/00

US Classification:

714 4, 709201

Abstract:

A technique for data placement in a distributed system that takes into account fault tolerance. Data placement is performed in which data objects, and possibly replicas thereof, are assigned to nodes within the distributed system. The resulting placement is then tested to determine whether the system provides desired performance under various different fault scenarios. If not, the distributed system is altered such as by altering its capacity or its capacity allocations. Performing data placement, testing for fault-tolerance and altering capacity or capacity allocations are performed repetitively, thereby increasing the system's ability to provide the desired performance under the fault scenarios. Preferably, a system and placement are eventually determined that provide the desired performance under the given fault scenarios.

US Patent:

20050161750, Jul 28, 2005

Filed:

Mar 20, 2003

Appl. No.:

10/508362

Inventors:

Hongjie Dai - Sunnyvale CA, US
Nathan Franklin - Santa Barbara CA, US
Qian Wang - Mountain View CA, US

International Classification:

H01L027/14

US Classification:

257414000

Abstract:

A carbon nanotube is formed on at least one Molybdenum-based electrode. In one embodiment, a carbon-nanotube device includes a pair of Molybdenum-based electrodes over respective terraces. Using a catalyst on the Molybdenum-based material of at least one electrode, a carbon nanotube is grown over a gap that separates the terraces to connect the Molybdenum-based electrodes. Yet other aspects of the present invention employ carbon nanotubes extending (suspended) from respective Molybdenum-based structures for use in electrically addressable devices. The nanotubes can also be formed by patterned growth to bridge such Molybdenum-based electrodes. A particular method for manufacturing this device does not require post-growth processing. Applications include, among many others, scalable nanotube transistors/switches nano-electromechanical systems.

US Patent:

20060226550, Oct 12, 2006

Filed:

Mar 27, 2006

Appl. No.:

11/389927

Inventors:

Hongjie Dai - Sunnyvale CA, US
Nathan Franklin - Santa Barbara CA, US
Qian Wang - Mountain View CA, US

Assignee:

Board to Trustees of the Leland Stanford Junior University - Palo Alto CA

International Classification:

H01L 23/48

US Classification:

257763000

Abstract:

A carbon nanotube is formed on at least one Molybdenum-based electrode. In one embodiment, a carbon-nanotube device includes a pair of Molybdenum-based electrodes over respective terraces. Using a catalyst on the Molybdenum-based material of at least one electrode, a carbon nanotube is grown over a gap that separates the terraces to connect the Molybdenum-based electrodes. Yet other aspects of the present invention employ carbon nanotubes extending (suspended) from respective Molybdenum-based structures for use in electrically addressable devices. The nanotubes can also be formed by patterned growth to bridge such Molybdenum-based electrodes. A particular method for manufacturing this device does not require post-growth processing. Applications include, among many others, scalable nanotube transistors/switches nano-electromechanical systems.

US Patent:

20070045756, Mar 1, 2007

Filed:

Jul 18, 2006

Appl. No.:

11/488465

Inventors:

Jean-Christophe Gabriel - Pinole CA, US
Alexander Star - Pittsburgh PA, US
Christian Valcke - Orinda CA, US
Qian Wang - Mountain View CA, US

International Classification:

H01L 29/82

US Classification:

257414000

Abstract:

A nanoelectronic sensing device includes a substrate, a nanostructure element disposed adjacent the substrate, and at least a conductive element electrically connected to the nanostructure element. The device is configured to heat at least a portion of the sensor structure including the nanostructure element. In certain embodiments, the nanostructure element comprises at least one nanotube, the nanotube being electrically connected to at least two conductors so as to permit an electric current on the order of 10 microAmps or greater to be passed through the nanotube, causing the nanotube to heat up relative to the substrate. In alternative embodiments, the sensing device includes a platform or membrane which is at least partially thermally isolated by one or more cavities, the platform supporting at least the nanostructure element adjacent to a microheater element. The heating of the sensor structure may be employed, for example, for thermoregulation, to accelerate and/or increase sensor response, and to improve other sensor characteristics.

US Patent:

20140066469, Mar 6, 2014

Filed:

Aug 21, 2013

Appl. No.:

13/972614

Inventors:

Qian Wang - Palo Alto CA, US
Heidi H. Wong - San Francisco CA, US
Mark C. Genovese - Sunnyvale CA, US

International Classification:

A61K 31/4706
A61K 45/06
A61K 31/40

US Classification:

514275, 514313

Abstract:

Compositions and methods are provided for preventing or treating the pre-clinical early-stages of inflammatory diseases, including autoimmune diseases, degenerative inflammatory diseases, metabolic inflammatory diseases, chronic infection associated with inflammation, cancer associated with inflammation, and other inflammatory diseases by administration to an individual of an effective dose of a synergistic combination of active agents comprising or consisting essentially of an aminoquinoline, e.g. hydroxychloroquine, and a statin, e.g. atorvastatin. Each or both of the active agents can be formulated in various ways, including without limitation a solid oral dosage form.

US Patent:

20220382678, Dec 1, 2022

Filed:

Aug 12, 2022

Appl. No.:

17/886718

Inventors:

- Shenzhen, CN
Qian Wang - Santa Clara CA, US
Xingyu Jiang - Palo Alto CA, US

Assignee:

Huawei Technologies Co., Ltd. - Shenzhen

International Classification:

G06F 12/0802

Abstract:

The disclosure relates to technology for up-evicting cache lines. An apparatus comprises a hierarchy of caches comprising a first cache having a first cache controller and a second cache having a second cache controller. The first cache controller is configured to store cache lines evicted from a first processor group to the first cache and to down-evict cache lines from the first cache to the second cache. The second cache controller is configured to store cache lines evicted from a second processor group into the second cache, to up-evict a first cache line from the second cache to the first cache in response to an eviction of a second cache line from the second processor group to the second cache, and to provide the up-evicted first cache line from the first cache to the second processor group in response to a request from the second processor group.

US Patent:

20220301891, Sep 22, 2022

Filed:

Mar 22, 2021

Appl. No.:

17/208322

Inventors:

- Palo Alto CA, US
Qian Wang - Mountain View CA, US
Eugene M. Chow - Palo Alto CA, US

International Classification:

H01L 21/56
H01L 23/532
H01L 23/31
H01L 23/29

Abstract:

A release layer is formed on a surface of an integrated circuit wafer. The surface is passivated and includes metal contact materials. A stress-engineered film having an intrinsic stress profile is deposited over the release layer. The stress-engineered film is patterned and the release layer is undercut etched so that a released portion of the patterned stress-engineered film is released from the surface while leaving an anchor portion fixed to the surface. The intrinsic stress profile in the stress-engineered film biases the released portion away from the surface. The released portion is placed entirely within an area defined by the metal contact material.

US Patent:

20220301996, Sep 22, 2022

Filed:

Mar 22, 2021

Appl. No.:

17/208332

Inventors:

- Palo Alto CA, US
Qian Wang - Mountain View CA, US
Yu Wang - Union City CA, US
Eugene M. Chow - Palo Alto CA, US

International Classification:

H01L 23/498
H01L 23/31
H01L 23/00

Abstract:

An electronic assembly and methods of making the assembly are disclosed. The electronic assembly includes a substrate with an elastic member having an intrinsic stress profile. The elastic member has an anchor portion on the surface of the substrate; and a free end biased away from the substrate via the intrinsic stress profile to form an out of plane structure. The substrate includes one or more spacers on the substrate. The electronic assembly includes a chip comprising contact pads. The out of plane structure on the substrate touches corresponding contact pads on the chip, and the spacers on the substrate touch the chip forming a gap between the substrate and the chip.