Qiang Fu

US Patent:

20070062917, Mar 22, 2007

Filed:

Nov 30, 2005

Appl. No.:

11/290208

Inventors:

Qiang Fu - Baxter MN, US
Joel Cardoso - Bandra Mumbai, IN

Assignee:

Quantronix Corporation - East Setauket NY

International Classification:

B23K 26/38
B23K 26/06

US Classification:

219121670, 219121730

Abstract:

Laser cutting and sawing can be performed on a variety of materials, transparent or non-transparent, including quartz, sapphire, glass, semiconductors, and diamonds. By direct generation of a special laser beam from a laser cavity and/or by shaping of a laser beam, unique characteristics of the beam in X- and Y-axes are utilized in the cutting and sawing of materials. Such a method and apparatus can reduce breakage and weight loss of the processed material while maintaining or increasing the cutting/sawing throughput.