Randall Vann Redd

US Patent:

6639787, Oct 28, 2003

Filed:

Nov 6, 2001

Appl. No.:

10/012187

Inventors:

Jonathon L. Kimmel - Audubon PA
Randall V. Redd - Phoenixville PA

Assignee:

Cabot Corporation - Boston MA

International Classification:

H01G 904

US Classification:

361508, 361528, 419 10, 419 19, 419 30, 419 35, 419 38, 419 39, 419 65, 419 66, 75228, 75229, 75232, 75245, 428472, 428702, 4235921, 42359417, 29 2503

Abstract:

Pressed material such as anodes are described and formed from oxygen reduced oxide powders using additives, such as binders and/or lubricants. Methods to form the pressed material are also described, such as with the use of atomizing, spray drying, fluid bed processing, microencapsulation, and/or coacervation.

US Patent:

7220397, May 22, 2007

Filed:

Sep 2, 2003

Appl. No.:

10/653520

Inventors:

Jonathon L. Kimmel - Audubon PA, US
Randall V. Redd - Phoenixville PA, US

Assignee:

Cabot Corporation - Boston MA

International Classification:

C01G 31/02
C01G 33/00
C01G 35/00
C01G 23/04
C01F 7/02

US Classification:

4235921, 42359417, 423608, 423625

Abstract:

Pressed material such as anodes are described and formed from oxygen reduced oxide powders using additives, such as binders and/or lubricants. Methods to form the pressed material are also described, such as with the use of atomizing, spray drying, fluid bed processing, microencapsulation, and/or coacervation.

US Patent:

7806994, Oct 5, 2010

Filed:

May 4, 2005

Appl. No.:

11/579413

Inventors:

Ronald W. Smith - Blue Bell PA, US
Randall Redd - Phoenixville PA, US

Assignee:

S-Bond Technologies, LLC - Lansdale PA

International Classification:

C22C 13/00

US Classification:

148400, 420555, 420557, 420562

Abstract:

An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, or tantalum; between about 0. 1 and 5% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); between about 0. 01 and 1% by weight of gallium up to about 10% by weight of silver; up to about 2% by weight of magnesium; and a remainder consisting of tin, bismuth, indium, cadmium, or a mixture of two or more of these elements. The alloy enables low-temperature (less than about 180 C. ) soldering within relatively narrow melting ranges (less than about 10 C. ).

US Patent:

61067539, Aug 22, 2000

Filed:

Apr 10, 1997

Appl. No.:

8/838788

Inventors:

Randall Vann Redd - Wilmington DE
Don Boyd Schiewetz - Wilmington DE
Donald Mark Cyron - New London Township PA

Assignee:

Environmental Packing LP - Bridgewater NJ

International Classification:

B29C 5142
B29C 5112
B29C 4318
B29B 1510

US Classification:

264112

Abstract:

A method for making shaped articles at room ambient temperatures without the addition of extraneous heat comprising the sequential steps: (1) forming a plurality of particles comprising a foamed admixture of starch, biodegradable polymer and water; (2) at room ambient temperature, applying to the surface of the particles finely divided drops of unheated water to effect wetting and softening of the outer surfaces of the particles; (3) without the addition of heat, compressing the surfaces of the surface softened particles to effect cohesion between the wetted outer surfaces of the particles, densification of the particles and formation of a shaped article; and (4) without the addition of heat, maintaining the particles under such compression for a time sufficient to render the outer surface of the particles nontacky by adsorption of water into the particles and by evaporation of water from the surface of the particles and (5) forming a protective skin on the outer surface of the compressed, non-tacky particles by heating the walls of the mold cavity and thus melting the outer surface of the shaped article having contact with the walls of the mold parts.

US Patent:

55524613, Sep 3, 1996

Filed:

Dec 30, 1994

Appl. No.:

8/366652

Inventors:

Randall V. Redd - Wilmington DE
Paul W. Bacon - Hockessin DE

Assignee:

Environmental Packing L.P. - Wilmington DE

International Classification:

C08L 300
C08L 8900
C09D 400

US Classification:

524 47

Abstract:

A method for improving the extrusion characteristics of finely divided aqueous starch-polymer mixtures comprising subjecting the admixture to deaeration and compaction to form a hard shaped form therefrom, milling the hard shaped form of starch and polymer admixture to form granules. Granules of selected size are then coated with a lubricating compound.

US Patent:

57309124, Mar 24, 1998

Filed:

May 30, 1996

Appl. No.:

8/656118

Inventors:

Randall Vann Redd - Wilmington DE
Joseph L. Sell - Beaverdam WI

Assignee:

M-Cap Technologies International - Wilmington DE

International Classification:

B05D 100
B05D 102

US Classification:

264 4

Abstract:

The invention is directed to a method for the encapsulation of liquids within a continuous impervious coating of thermoplastic material. The method is carried out with continuous agitation during which the adsorbent and adsorbate are coated with a plurality of sprayed layers of thermoplastic coating material while maintaining the adsorbent in free-flowing powder consistency during the coating steps. The method is especially advantageous for the encapsulation of volatile liquids.

US Patent:

20210301048, Sep 30, 2021

Filed:

Oct 12, 2018

Appl. No.:

16/648580

Inventors:

- Houston TX, US
Rajeev Kumar - Houston TX, US
George Pappas - Galveston TX, US
James A. Hopson - Humble TX, US
Michael O. Nutt - Pearland TX, US
Peggy J. Macatangay - League City TX, US
Randall V. Redd - Spring TX, US

International Classification:

C08F 210/12
C08F 2/00
C08F 236/08
C08F 212/08
C08F 4/14
C08F 2/01

Abstract:

Non-random isobutylene copolymer includes repeat units derived from isobutylene and one or more comonomers selected from isoprene, butadiene, cyclopentadiene, dicyclopentadiene, limonene, substituted styrenes, and C4 to C10 dienes other than isoprene, butadiene, limonene, cyclopentadiene, or dicyclopentadiene, wherein the molar ratio of isobutylene derived repeat units to the comonomer derived repeat units is from 75:1 to 1.5:1. The non-random copolymers have a molecular weight, Mn, of from 200 to 20,000 Daltons and typically have a high double bond content and a high vinylidene double bond content when diene monomers are utilized.

US Patent:

20200231724, Jul 23, 2020

Filed:

Oct 12, 2018

Appl. No.:

16/648488

Inventors:

- Houston TX, US
André M. Gobin - Pearland TX, US
George Pappas - Galveston TX, US
James A. Hopson - Humble TX, US
Michael O. Nutt - Pearland TX, US
Peggy J. Macatangay - League City TX, US
Randall V. Redd - Spring TX, US

International Classification:

C08F 210/10
C08F 236/08
C08F 236/06
C08F 212/08
C08F 2/01

Abstract:

Isobutylene copolymer includes repeat units derived from isobutylene and one or more comonomers selected from isoprene, butadiene, cyclopentadiene, dicyclopentadiene, limonene, substituted styrenes, and C4 to C10 dienes other than isoprene, butadiene, limonene, cyclopentadiene, or dicyclopentadiene, wherein the molar ratio of isobutylene derived repeat units to the comonomer derived repeat units is from 75:1 to 1.5:1. The copolymers have a molecular weight, Mn, of from 200 to 20,000 Daltons and typically have a high double bond content and a high vinylidene double bond content when diene monomers are utilized.