Randy H Lo

US Patent:

56172974, Apr 1, 1997

Filed:

Sep 25, 1995

Appl. No.:

8/533118

Inventors:

Randy Lo - Campbell CA
Hem P. Takiar - Fremont CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H05K 114
H05K 103

US Classification:

361737

Abstract:

A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package, whereas the molding compound includes organic polymer fibers. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the organic polymer fibers includes at least one selected from the group consisting of cotton, cellulose, polyester and nylon. In another preferred embodiment, the portable peripheral card is a PCMCIA card.

US Patent:

57738769, Jun 30, 1998

Filed:

Nov 6, 1996

Appl. No.:

8/744681

Inventors:

Boonmi Mekdhanasarn - Sunnyvale CA
Randy Hsiao-Yu Lo - Campbell CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H01L 2348

US Classification:

257665

Abstract:

A lead frame having protection against electrostatic discharge is disclosed. The lead frame having protection against electrostatic discharge includes a multiplicity of leads and an electrostatic discharge protection device. The electrostatic discharge protection device includes a conductive layer and a protection layer. The protection layer is arranged to contact a plurality of leads and is formed from an electrostatic discharge protection material, which insulates the leads from the conductive layer at voltages below a predefined threshold voltage and establishes an electrical connection between the leads and the conductive layer at voltages above the threshold voltage.

US Patent:

57965706, Aug 18, 1998

Filed:

Sep 19, 1996

Appl. No.:

8/724305

Inventors:

Boonmi Mekdhanasarn - Sunnyvale CA
Randy Hsiao-Yu Lo - Campbell CA
Steve M. Ichikawa - Fremont CA
Abdul Rahim Ahmed - Morgan Hill CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H02H 100

US Classification:

361126

Abstract:

Described is a circuit board having protection against electrostatic discharge. The board includes a plurality of interconnect traces and an electrically conductive ground plane formed on a substrate such that a gap is created between the interconnect traces and the ground plane. A resistive electrostatic discharge protection material is positioned to bridge the gaps between the ground plane and the interconnect traces, such that the electrostatic discharge protection material electrically insulates the interconnect traces from the ground plane at voltages below a predefined threshold voltage and establishes an electrical connection between the interconnect traces and the conductive plane at voltages above the threshold voltage. A process of manufacturing the circuit board includes forming interconnect traces and a ground plane such that there is a gap between the ground plane and the interconnect traces. A resistive electrostatic discharge protection material is placed in the gap between the ground plane and the traces for protection against electrostatic discharge.

US Patent:

58917608, Apr 6, 1999

Filed:

Mar 25, 1998

Appl. No.:

/047884

Inventors:

Boonmi Mekdhanasarn - Sunnyvale CA
Randy Hsiao-Yu Lo - Campbell CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438123

Abstract:

A lead frame having protection against electrostatic discharge is disclosed. The lead frame having protection against electrostatic discharge includes a multiplicity of leads and an electrostatic discharge protection device. The electrostatic discharge protection device includes a conductive layer and a protection layer. The protection layer is arranged to contact a plurality of leads and is formed from an electrostatic discharge protection material, which insulates the leads from the conductive layer at voltages below a predefined threshold voltage and establishes an electrical connection between the leads and the conductive layer at voltages above the threshold voltage.