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Raymond A Cady

age ~60

from Elmira, NY

Also known as:
  • Raymond Cady
  • Raymond Charlene Cady
  • Ray Cady
  • Raymonda Cady
209 James St, Elmira, NY 14904(607)8462522

Raymond Cady Phones & Addresses

  • 209 James St, Elmira, NY 14904 • (607)8462522
  • Waverly, NY

Resumes

Raymond Cady Photo 1

Levy Keeper With Los Angeles County Sheriff

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Position:
Levy Keeper at Los Angeles County Sheriff's Department
Location:
La Verne, California
Industry:
Financial Services
Work:
Los Angeles County Sheriff's Department since Feb 2010
Levy Keeper

World Financial Group Sep 2008 - Feb 2009
Senior Associate

MDX Portable X-Ray 2002 - 2008
Director of Operations

HealthCare Partners Affiliates Medical Group 1995 - 2000
Senior Contract Manager
Raymond Cady Photo 2

Raymond Cady

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Location:
United States
Raymond Cady Photo 3

Raymond Cady

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Location:
United States

Us Patents

  • Apparatus For Forming A Slurry Polishing Pad

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  • US Patent:
    7927092, Apr 19, 2011
  • Filed:
    Dec 31, 2007
  • Appl. No.:
    11/967818
  • Inventors:
    Raymond Charles Cady - Horseheads NY,
    Michael John Moore - Corning NY,
    Mark Alex Shalkey - Corning NY,
    Mark Andrew Stocker - Market Harborough,
  • Assignee:
    Corning Incorporated - Corning NY
  • International Classification:
    B29C 43/36
  • US Classification:
    425389, 100211, 425398, 4254052, 425423, 451548
  • Abstract:
    Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
  • Force Monitoring Methods And Apparatus

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  • US Patent:
    8047085, Nov 1, 2011
  • Filed:
    May 27, 2009
  • Appl. No.:
    12/472840
  • Inventors:
    Raymond C. Cady - Horseheads NY,
    James P. Peris - Horseheads NY,
    G. Clinton Shay - Moneta VA,
  • Assignee:
    Corning Incorporated - Corning NY
  • International Classification:
    G01L 5/12
  • US Classification:
    7386249
  • Abstract:
    Methods and apparatus () for monitoring the tension () and pinch force () associated with the contact of angled stub rollers () with a glass ribbon () are provided. The apparatus () includes a support member () which supports the shaft () of the stub roller (). The support member () undergoes linear displacement () in response to tension () in the glass ribbon () and rotation () in response to a pinch force (). The linear displacement () and rotation () are detected and converted to force values by a calibration procedure. By monitoring these forces, glass attributes such as residual stress can be improved which is of importance in glass sheets used in such applications as the manufacture of liquid crystal displays.
  • Methods Of Fabricating A Honeycomb Extrusion Die From A Die Body

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  • US Patent:
    8419508, Apr 16, 2013
  • Filed:
    May 28, 2010
  • Appl. No.:
    12/789896
  • Inventors:
    Raymond Charles Cady - Horseheads NY,
    Mihir Mahendra Shah - Elmira NY,
    Aric Bruce Shorey - Painted Post NY,
    Kevin Lee Wasson - Elmira NY,
  • Assignee:
    Corning Incorporated - Corning NY
  • International Classification:
    B21K 5/20
  • US Classification:
    451 48, 29558, 700172, 761071
  • Abstract:
    A method for screening abrasive wheels for fabricating a honeycomb extrusion die from a die body, and methods for fabricating a honeycomb extrusion die using an abrasive wheel assembly. One method for fabricating a honeycomb extrusion die includes measuring at least one of runout and thickness of each of a plurality of abrasive blades while rotating the blades, selecting a subset of the plurality of blades that have a measured runout or a measured thickness within a predetermined range, and mounting the subset of blades spaced from one another and concentrically aligned along a rotation axis of the abrasive wheel assembly.
  • Methods And Apparatus For Forming A Slurry Polishing Pad

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  • US Patent:
    8500934, Aug 6, 2013
  • Filed:
    Mar 15, 2011
  • Appl. No.:
    13/048399
  • Inventors:
    Raymond Charles Cady - Horseheads NY,
    Michael John Moore - Corning NY,
    Mark Alex Shalkey - Corning NY,
    Mark Andrew Stocker - Market Harborough,
  • Assignee:
    Corning Incorporated - Corning NY
  • International Classification:
    B24B 7/00
  • US Classification:
    156214, 451540
  • Abstract:
    Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
  • High Temperature Anodic Bonding Apparatus

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  • US Patent:
    20070246450, Oct 25, 2007
  • Filed:
    May 3, 2006
  • Appl. No.:
    11/417445
  • Inventors:
    Raymond Cady - Horseheads NY,
    Alexander Lakota - Kanona NY,
    William Lock - Horseheads NY,
    John Thomas - Elmira NY,
    John Costello - Painted Post NY,
  • International Classification:
    D06F 75/26
  • US Classification:
    219250000, 438455000
  • Abstract:
    An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.
  • Bonding Plate Mechanism For Use In Anodic Bonding

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  • US Patent:
    20070249098, Oct 25, 2007
  • Filed:
    Apr 11, 2007
  • Appl. No.:
    11/786307
  • Inventors:
    Raymond Charles Cady - Horseheads NY,
    Alexander Lakota - Kanona NY,
    William Edward Lock - Horseheads NY,
    John Christopher Thomas - Elmira NY,
    John Joseph Costello - Lake Elmo MN,
  • International Classification:
    H01L 21/00
    H01L 21/30
  • US Classification:
    438119, 438455
  • Abstract:
    A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600° C. or greater is achieved in less than about one-half hour.
  • Roll Mechanics For Enabling Printed Electronics

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  • US Patent:
    20110030569, Feb 10, 2011
  • Filed:
    Aug 10, 2009
  • Appl. No.:
    12/538589
  • Inventors:
    Robert Addison Boudreau - Corning NY,
    Douglas Edward Brackley - Horseheads NY,
    Raymond Charles Cady - Horseheads NY,
    Gary Edward Merz - Rochester NY,
    James Paul Peris - Horseheads NY,
    Kevin Lee Wasson - Elmira NY,
  • International Classification:
    B41F 5/00
    B41L 3/02
  • US Classification:
    101216, 101486
  • Abstract:
    A print press system and a method are described herein that print an electronic circuit onto a material (e.g., glass substrate, plastic film, plastic film-glass substrate laminate). In exemplary applications, the print press system can print an electronic circuit onto a material to form, for instance, a flexible Liquid Crystal Display, a retail point of purchase sign and an e-book.
  • Machine Tool Tailstock

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  • US Patent:
    52824020, Feb 1, 1994
  • Filed:
    Apr 14, 1992
  • Appl. No.:
    7/868165
  • Inventors:
    Raymond C. Cady - Horseheads NY
    Terrence M. Sheehan - Elmira NY
    James P. Peris - Horseheads NY
    Robert D. Allington - Wellsburg NY
  • Assignee:
    Hardinge Brothers, Inc. - New York NY
  • International Classification:
    B23B 300
    B23B 2100
    B23B 2300
  • US Classification:
    82117
  • Abstract:
    A machine tool comprises a base, a spindle operably associated with the base, a work holder operably associated with the spindle for securing a workpiece to the spindle, and a tailstock operably secured to the base. The tailstock includes a slideway and a tailstock body slidably secured to the slideway. The tailstock body is movable on the slideway between a home position away from the workpiece and a work engaging position. A limit switch and trip members associated with the tailstock, and a hydrulic circuit are provided for controlling the movement of the tailstock body from the home position to an intermediate position prior to the work engaging position at an initial feed rate and from the intermediate position to the work engaging position at a subsequent feed rate where the initial feed rate is greater than the subsequent feed rate.

Classmates

Raymond Cady Photo 4

Raymd Cady La Mirada Hig...

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Raymond Cady 1966 graduate of La Mirada High School in La mirada, CA is on Memory Lane. Get caught up with Raymond and other high school alumni from La
Raymond Cady Photo 5

Raymond Cady

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Schools:
St. Clement School Toledo OH 1952-1960
Community:
Paul Manol, James Welch, Carol Gonci

Mylife

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Raymd Cady Chesapeake VA

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Raymd Cady Punta Gorda F...

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Myspace

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Raymond Cady

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Locality:
Walnut, CA
Gender:
Male
Birthday:
1904

Facebook

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Raymond R Cady

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Raymond Cady

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Raymond Cady

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