Richard D Arnold

US Patent:

6720780, Apr 13, 2004

Filed:

Aug 2, 2001

Appl. No.:

09/921169

Inventors:

Reynaldo M. Rincon - Richardson TX
Jerry Broz - Longmont CO
Lester Wilson - Sherman TX
Richard W. Arnold - McKinney TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01R 3102

US Classification:

324754

Abstract:

A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.

US Patent:

6970005, Nov 29, 2005

Filed:

Jul 26, 2001

Appl. No.:

09/915919

Inventors:

Reynaldo M. Rincon - Richardson TX, US
Richard W. Arnold - McKinney TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01R031/06

US Classification:

324754, 324761

Abstract:

A probe card assemblage for simultaneously testing one or more integrated circuit chips including an interposer having on one surface a plurality of protruding contact elements for electrically contacting one or more chips of a wafer positioned atop a layer of compliant material, and arrayed in a pattern corresponding to a chip pads, a series of conductive vias through the electrically insulating interposer which connect the chip contact elements with an arrangement of leads terminating in a universal arrangement of connectors on the second surface, and a probe card with connectors mating to those on the interposer. The connectors on the interposer is secured are secured to those on the probe card, thereby providing a vertical probe assemblage which makes use of ultrasonic energy to minimize scrub or over travel. The universal probe card is specific to a tester configuration and common to a family of circuits to be tested.

US Patent:

7026833, Apr 11, 2006

Filed:

Aug 26, 2005

Appl. No.:

11/213236

Inventors:

Reynaldo M. Rincon - Richardson TX, US
Richard W. Arnold - McKinney TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01R 31/02

US Classification:

324754, 324761

Abstract:

A probe card assemblage for simultaneously testing one or more integrated circuit chips including an interposer having on one surface a plurality of protruding contact elements for electrically contacting one or more chips of a wafer positioned atop a layer of compliant material, and arrayed in a pattern corresponding to a chip pads, a series of conductive vias through the electrically insulating interposer which connect the chip contact elements with an arrangement of leads terminating in a universal arrangement of connectors on the second surface, and a probe card with connectors mating to those on the interposer. The connectors on the interposer is secured are secured to those on the probe card, thereby providing a vertical probe assemblage which makes use of ultrasonic energy to minimize scrub or over travel. The universal probe card is specific to a tester configuration and common to a family of circuits to be tested.

US Patent:

20030094962, May 22, 2003

Filed:

Nov 21, 2001

Appl. No.:

09/992065

Inventors:

Reynaldo Rincon - Richardson TX, US
Richard Arnold - McKinney TX, US
Lester Wilson - Sherman TX, US
Scott Mitchell - Plano TX, US

International Classification:

G01R031/02

US Classification:

324/754000

Abstract:

A probe card having multiple planes with continuous metal traces from a high density of small, robust probe contacts to peripheral vias which enable connection to a test head is fabricated using technology from the printed circuit card industry. The card includes a relatively small, centrally located recessed plane having a plurality of probe contacts precisely patterned to mate with chip contacts, an array of continuous conductive traces, the substrate is folded at specific crease locations, and formed upward to a second array of creases at which the substrate is bent to form a raised plane parallel to the first. Integrated single unit construction, coupled with adaptability for rapid pattern design or changes in conductors readily enables a low inductance probe card, and its low cost, automated method of manufacture is compatible with tight pitch and high performance requirements of integrated circuits both in current production, and those in plans for the future.

US Patent:

20040169521, Sep 2, 2004

Filed:

Jan 20, 2004

Appl. No.:

10/761825

Inventors:

Reynaldo Rincon - Richardson TX, US
Jerry Broz - Longmont CO, US
Lester Wilson - Sherman TX, US
Richard Arnold - McKinney TX, US

International Classification:

G01R031/02

US Classification:

324/754000

Abstract:

A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.