Richard J Chu

US Patent:

20130068423, Mar 21, 2013

Filed:

Nov 14, 2012

Appl. No.:

13/676198

Inventors:

International Business Machines Corporation - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Roger R. SCHMIDT - Poughkeepsie NY, US
Robert E. SIMONS - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H05K 7/20

US Classification:

16510414, 165 804, 62 96

Abstract:

A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

US Patent:

20130068441, Mar 21, 2013

Filed:

Nov 14, 2012

Appl. No.:

13/676212

Inventors:

INTERNATIONAL BUSINESS MACHINES CORP - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Roger R. SCHMIDT - Poughkeepsie NY, US
Robert E. SIMONS - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H05K 7/20

US Classification:

165249, 16510413

Abstract:

A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

US Patent:

20130070420, Mar 21, 2013

Filed:

Nov 14, 2012

Appl. No.:

13/676227

Inventors:

International Business Machines Corporation - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Robert E. SIMONS - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H02K 7/20

US Classification:

361700

Abstract:

A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

US Patent:

20130077246, Mar 28, 2013

Filed:

Nov 14, 2012

Appl. No.:

13/676242

Inventors:

International Business Machines Corporation - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Robert E. SIMONS - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H05K 7/20

US Classification:

361700

Abstract:

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

US Patent:

20130077247, Mar 28, 2013

Filed:

Nov 14, 2012

Appl. No.:

13/676313

Inventors:

International Business Machines Corporation - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Robert E. SIMONS - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H05K 7/20

US Classification:

361700

Abstract:

A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

US Patent:

20130091693, Apr 18, 2013

Filed:

Dec 3, 2012

Appl. No.:

13/692196

Inventors:

International Business Machines Corporation - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Robert E. SIMONS - Poughkeepsie NY, US
Prabjit SINGH - New Paltz NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H01L 23/373
H01L 23/367

US Classification:

295921, 2989003

Abstract:

A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

US Patent:

20130091706, Apr 18, 2013

Filed:

Dec 3, 2012

Appl. No.:

13/692177

Inventors:

International Business Machines Corporation - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Robert E. SIMONS - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H05K 7/20

US Classification:

2989003

Abstract:

A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s).

US Patent:

20130091868, Apr 18, 2013

Filed:

Dec 3, 2012

Appl. No.:

13/692215

Inventors:

INTERNATIONAL BUSINESS MACHINES CORP - Armonk NY, US
Richard C. CHU - Hopewell Junction NY, US
Milnes P. DAVID - Fishkill NY, US
Madhusudan K. IYENGAR - Foster City CA, US
Robert E. SIMONS - Poughkeepsie NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

F25B 21/02

US Classification:

62 32

Abstract:

Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.