Richard F Granitz

US Patent:

50731181, Dec 17, 1991

Filed:

Dec 8, 1988

Appl. No.:

7/281566

Inventors:

Dimitry G. Grabbe - Middletown PA
Richard F. Granitz - Harrisburg PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H01R 909

US Classification:

439 71

Abstract:

An electronic component (16, 18) having contact pads (20) is surface mounted to a circuit board (27) by means of electrical terminals (1) each comprising a head (2) having a flat, contact pad engaging, face (6) and a shank (4), which may be in form of a compliant pin, extending normally of the pad engaging face (6). Each pad engaging surface (6) has a gold covering provided by electroplating or by inlaying. The circuit board (27) has metal lined through holes (30) in the same pattern as the pads (20) of the electronic component (16, 18). The shank (4) of each terminal (1) is inserted into the metal lining (36) of a respective hole (30) in the circuit board (27) so that the head (2) of the terminal (1) lies against a land (38) of one of the linings (36), after which the electronic component (16, 18) is seated on the circuit board (27) with each contact pad (20) of the electronic component (16, 18) in engagement with the gold covered face (6) a respective terminal (1). Another embodiment of the invention includes an array (50) of contacts interposed between the components (16, 17) and the circuit board (27) so that the contacts (52) are electrically in between the pads (20) and the respective gold covered faces (6).

US Patent:

48955361, Jan 23, 1990

Filed:

Jul 19, 1988

Appl. No.:

7/221481

Inventors:

David J. Gingerich - Swatara PA
Richard F. Granitz - Harrisburg PA
William H. Rose - Harrisburg PA
David T. Shaffer - Harrisburg PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H01R 924

US Classification:

439885

Abstract:

A lead frame assembly comprises a stamped and formed lead frame having spaced pairs of electrical terminals and other contact sections. Severable sections initially interconnect potential electrical circuit sections of the lead frame separating the lead frame into separate metal members defining discrete electrical circuits if severed. A dielectric covering is molded over the lead frame exposing the pairs of terminals and other contact sections for termination or electrical engagement. Openings are formed in the housing exposing the severable sections of the lead frame for severing, to be selectively severed creating separate electrical circuit sections, or to be retained unsevered, as desired. After the molding of the covering over the lead frame, the article thus fabricated can be customized by selective severing and connecting of components as desired.

US Patent:

48387983, Jun 13, 1989

Filed:

Jun 15, 1988

Appl. No.:

7/207411

Inventors:

William R. Evans - Mooresville NC
Richard F. Granitz - Harrisburg PA
George R. Schmedding - Hummelstown PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H01R 909

US Classification:

439 61

Abstract:

A high density interconnection system (2) is configured to provide a reliable interconnection between boards (4, 6). In order to accommodate space restrictions, the circuit boards (4, 6) are placed in a three-dimensional arrangement. The electrical interconnections between boards (4, 6) are provided by electrical connectors (10) rather than by a mother board. The use of electrical connectors (10) enables the signal paths length between the boards to be minimized, thereby allowing for high speed signal transmission.

US Patent:

59905735, Nov 23, 1999

Filed:

Feb 4, 1998

Appl. No.:

9/018808

Inventors:

Richard Francis Granitz - Harrisburg PA
Andrew Michael Hunt - Elizabethtown PA
Lang Thanh Le - Camp Hill PA
Aern Evert Rider - late of Hanover PA

Assignee:

The Whitaker Corporation - Wilmington DE

International Classification:

B60L 100

US Classification:

307 101

Abstract:

The invention is directed to an electrical distribution system for an automobile having a power distribution bus and a signal distribution bus. An area module has an electrical connection with the power distribution bus and the signal distribution bus. The area module has connections to individual feature modules. The feature modules have power and signal distribution for electrical components. The area and the feature modules distribute power and signal to the electrical components from the power distribution bus and the signal distribution bus.

US Patent:

48466999, Jul 11, 1989

Filed:

Dec 2, 1987

Appl. No.:

7/127992

Inventors:

Douglas W. Glover - Harrisburg PA
Richard F. Granitz - Harrisburg PA
Donald R. Harner - Camp Hill PA
Earl R. Kreinberg - Phoenix AZ
Paul Vinson - Carefree AZ
John W. Wanat - Duncannon PA
James P. Wolowicz - Harrisburg PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H05K 114

US Classification:

439 64

Abstract:

A connector system for distributing power to daughter cards in a card cage includes a power connector for each card mounted on framework of the card cage. Each power connector has individual terminals connected to power conductors connected to a power supply and at least one terminal connected to a return path conductor. Each power connector includes a channel along which an active edge of the card is inserted and moved longitudinally from an open end, opposed from another channel aligned therewith, until the daughter card is fully inserted into the card cage, and signal transmission connectors along the back card edge mate with connectors of the backplane of the card cage. The daughter card is then locked in position; its power connector is then actuated, camming contact sections of its terminals into electrical engagement with contacts along the active edge of the daughter card. Each daughter card is thus powered and correspondingly disconnectable independently of the other daughter cards. An interference arrangement prevents the power connector from being actuated unless the card is locked in position, and prevents unlocking and removal of the card unless the power connector is deactuated.

US Patent:

45823740, Apr 15, 1986

Filed:

Oct 26, 1981

Appl. No.:

6/314601

Inventors:

Jack S. Conrad - Harrisburg PA
Richard F. Granitz - Harrisburg PA
Joseph L. Lockard - Harrisburg PA
William H. Rose - Harrisburg PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H05K 100

US Classification:

339 17M

Abstract:

A high density interconnect system is described which comprises a laminated board including a conductive power plane and a ground plane insulated from each other and containing a series of holes therethrough. Signal contacts, ground contacts, power contacts, data bus interconnect contacts, and feed-through contacts are selectively mounted in the series of holes with the ground contacts and power contacts connected to the respective ground plane and conductive power plane and the other contacts insulated therefrom. Front contact housings are secured against the laminated board means and contain spring-loaded contacts in openings therein for electrical engagement with the signal contacts and for electrical engagement with pins of a signature board. Rear contact housings house contact sections of the signal, power, ground, and data bus interconnect contacts to which input/output connectors of computer boards are connected for supplying power thereto, and operating signals from the computer boards are transmitted via the signal contacts to the signature board which conducts tests on the board under test to test the same. A cam-operative apparatus moves a platen carrying the signature board so that the pins of the signature board are moved into electrical engagement with the spring-loaded contacts.

US Patent:

48467278, Jul 11, 1989

Filed:

Apr 11, 1988

Appl. No.:

7/179589

Inventors:

Douglas W. Glover - Harrisburg PA
Richard F. Granitz - Harrisburg PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H01R 13648

US Classification:

439608

Abstract:

A reference conductor for improving signal integrity in connectors and connector systems. More particularly the reference conductor includes a conductive plate positioned between adjacent rows of signal conductors in a connector and which is electrically connected to reference circuits on substrates associated with the connector to provide a low inductance signal return path.

US Patent:

46738371, Jun 16, 1987

Filed:

Nov 12, 1985

Appl. No.:

6/807775

Inventors:

David J. Gingerich - Swatara PA
Richard F. Granitz - Harrisburg PA
William H. Rose - Harrisburg PA
David T. Shaffer - Harrisburg PA

Assignee:

AMP Incorporated - Harrisburg PA

International Classification:

H02K 1300

US Classification:

310239

Abstract:

A motor brush assembly comprises a stamped and formed lead frame including electrical terminals at spaced locations and a dielectric housing member secured onto the lead frame with the electrical terminals being exposed and accessible for electrical termination to electrical power wires and lead wires of capacitors and inductors. Cavities are located in the housing member in which the inductors are disposed. Metal brush holders are positioned in brush holder locations on the housing member and lugs thereof are electrically stapled onto the lead frame. Openings are located in the housing member exposing severable sections of the lead frame separating the lead frame into separate brush circuits. If inductors are to be disposed in the circuit path between the terminated power leads and the brush holder locations, the respective severable sections are also severed which interconnect the lead frame between the associated pairs of terminals corresponding to each inductor. A ground terminal extends outwardly from the housing member.