Richard C Hong

US Patent:

6376807, Apr 23, 2002

Filed:

Jul 9, 1999

Appl. No.:

09/350619

Inventors:

Richard Hong - San Jose CA
James H. Tsung - San Jose CA
Gunnar Vatvedt - Los Gatos CA
Peijun Ding - San Jose CA
Arvind Sundarrajan - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05B 338

US Classification:

2194441

Abstract:

The present invention generally provides a substrate processing system having a thermally conductive and electrically insulative member coupled to a heated member that provides for heat dissipation from the heated member. In a preferred embodiment, the present invention provides for heat dissipation through thermal conductance of an electrically insulated coil in an IMP reaction chamber.

US Patent:

6580057, Jun 17, 2003

Filed:

Dec 10, 2001

Appl. No.:

10/016350

Inventors:

Richard Hong - San Jose CA
James H. Tsung - San Jose CA
Gunnar Vatvedt - Los Gatos CA
Peijun Ding - San Jose CA
Arvind Sundarrajan - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05B 368

US Classification:

2194441, 118723 I

Abstract:

The present invention generally provides a substrate processing system having a thermally conductive and electrically insulative member coupled to a heated member that provides for heat dissipation from the heated member. In a preferred embodiment, the present invention provides for heat dissipation through thermal conductance of an electrically insulated coil in an IMP reaction chamber.

US Patent:

20100157491, Jun 24, 2010

Filed:

Dec 18, 2008

Appl. No.:

12/338056

Inventors:

Richard J.K. HONG - Sunnyvale CA, US

Assignee:

SANDISK CORP. - Milpitas CA

International Classification:

H02H 9/04

US Classification:

361 56

Abstract:

Methods and devices of the invention include an electrostatic discharge (ESD) protection circuit. This circuit includes rise time dependent activation circuitry capable of detecting a slew rate of an input signal and capable of determining whether the slew rate of the input signal is greater than a threshold value. For an ESD event said activation circuitry generates a trigger signal. Additionally, the activation circuitry is coupled with the ESD dissipation duration control circuitry which is further coupled with an ESD dissipation circuit. This arrangement enabling the duration control circuit to be activated by the trigger signal which responds by producing an activation signal that activates the ESD dissipation circuitry and that controls the length of time the dissipation circuit remains active. The ESD dissipation circuitry includes a shunt that redirects the ESD energy away from the protected internal circuit. The ESD dissipation duration circuitry further configured to maintain shunting of the energy for a period of time sufficient to discharge of the ESD energy without damaging the protected circuitry.

US Patent:

20100212358, Aug 26, 2010

Filed:

Feb 26, 2009

Appl. No.:

12/393875

Inventors:

DHRUV GAJARIA - Sunnyvale CA, US
Hanzhong Zhang - Cupertino CA, US
Richard Hong - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C03B 20/00

US Classification:

65 2912, 65158

Abstract:

The present disclosure relates to methods for automated inspection of the orientation of a glass substrate () having a side that is coated and/or impregnated with a non-glass material (e.g., tin). One method () includes: picking up the glass substrate () by using an automatic lifting assembly (); inspecting a side of the glass substrate () with a sensor () so as to determine whether the inspected side is coated or impregnated with the non-glass material; determining whether the glass substrate () is correctly oriented based upon the inspection results; and using the automated lifting assembly () to place the glass substrate () on a conveyor () in response to determining that the glass substrate () is correctly oriented.

US Patent:

20120127618, May 24, 2012

Filed:

Jan 10, 2012

Appl. No.:

13/347395

Inventors:

Richard J.K. HONG - Sunnyvale CA, US

Assignee:

SANDISK TECHNOLOGIES INC. - Plano TX

International Classification:

H02H 9/04

US Classification:

361 56

Abstract:

Methods of the invention include an electrostatic discharge (ESD) protection method capable of detecting a slew rate of an input signal and capable of determining whether the slew rate of the input signal is greater than a threshold value. For an ESD event having a slew rate in excess of the threshold value said method generates a trigger signal which generates an activation signal that activates the ESD dissipation circuitry and that controls the length of time the dissipation circuit remains active. The method further comprises shunting the ESD energy away from a protected internal circuit. The method maintaining the shunting of the energy for a period of time sufficient to discharge of the ESD energy without damaging the protected circuitry.

US Patent:

61497762, Nov 21, 2000

Filed:

Nov 12, 1998

Appl. No.:

9/191253

Inventors:

Howard Tang - San Jose CA
Imran Hashim - San Jose CA
Richard Hong - San Jose CA
Peijun Ding - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 1434

US Classification:

20419212

Abstract:

The present invention generally provides an apparatus and a method for physical vapor deposition of a metal onto a substrate comprising a physical vapor deposition chamber and a target disposed in an upper portion of the chamber. The target comprises a backing plate having a central portion and a flange portion attachable to the physical vapor deposition chamber, a sputterable portion extending from the central portion of the backing plate, and an annular ridge disposed on a surface of the flange portion. Preferably, the sputterable portion of the target includes a restriction side wall that restricts entry of plasma and back-scattered particles into the dark space gap between an upper shield and the target.

US Patent:

62771981, Aug 21, 2001

Filed:

Jun 4, 1999

Appl. No.:

9/326395

Inventors:

Allen Thompson - San Carlos CA
Peijun Ding - San Jose CA
Richard Hong - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B05C 1300
B05C 1302
B05C 2100

US Classification:

118503

Abstract:

A method and apparatus is provided for clamping and shielding the edge of a substrate useful in electronic device fabrication. A shadow ring is formed by an inward radial extension of the top surface of a generally annular shaped clamp ring. The shadow ring portion overhangs but does not contact the top surface of a substrate being processed. A smoothly tapered substrate contact surface extending from the outer diametrical extent of the shadow ring bottom surface to the bottom surface of the clamp ring is sized and adapted to engage the outer edge of a substrate. The substrate contact surface aligns the clamp ring to a substrate support member and a substrate to the substrate support member and the clamp ring as the substrate is lifted vertically.

US Patent:

20170329464, Nov 16, 2017

Filed:

Nov 10, 2016

Appl. No.:

15/348166

Inventors:

- Walldorf, DE
Richard Hong - San Jose CA, US

International Classification:

G06F 3/0482
G06F 3/0484
G06F 3/0484
G06T 13/80

Abstract:

In an example embodiment, a dynamic button user interface element is rendered in a graphical user interface, the dynamic button corresponding to an application action when selected by a user via the graphical user interface. In response to detection of selection of the dynamic button by the user via the graphical user interface, the dynamic button user interface element is caused to change from a first shape to a second shape and display two or more sub-buttons within the dynamic button user interface element. In response to detection of selection of a first of the sub-buttons by the user via the graphical user interface, the application action is caused to be executed, the two or more sub-buttons are caused to disappear from within the dynamic button user interface element, and the dynamic button user interface element is caused to change from the second shape to the first shape.