Richard S Koenig

US Patent:

56046650, Feb 18, 1997

Filed:

Jun 30, 1995

Appl. No.:

8/497579

Inventors:

Gregory M. Chrysler - Poughkeepsie NY
Richard C. Chu - Poughkeepsie NY
Richard M. Koenig - Gardiner NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361703

Abstract:

An integrated coolant fluid supply and exhaust distribution pathdefining structure is employed to provide a substantially planar cooling system for an electronic assembly which includes a substrate having electronic modules or electronic chips disposed thereon. The pathdefining structure includes interleaved supply and exhaust channels with the supply channels including apertures disposed adjacent to heat sink shafts which are connected to planar heat sink structures in thermal contact with chips or modules being cooled. The pathdefining structure produces a fluid flow path which is initially aligned with the surface area enhancing heat sink shafts and which exits therefrom in a plurality of directions which ultimately lead to the exhaust channels provided in the path-defining structure. The assembly, which includes an exterior housing and the substrate, provides a compact cooling mechanism for electronic components. The cooling structure is both compact and permits high density placement of electronic chips or modules.