Richard Loi

US Patent:

20140034716, Feb 6, 2014

Filed:

Aug 1, 2012

Appl. No.:

13/564542

Inventors:

Dason Cheung - Fremont CA, US
Murad Kurwa - San Jose CA, US
Richard Loi - San Jose CA, US
Mario Lopez Ruiz - Zapopan Jal, MX

Assignee:

FLEXTRONICS AP, LLC - Broomfield CO

International Classification:

B23K 31/02
B23K 3/04

US Classification:

228232, 228 57, 228 46

Abstract:

A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.