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Richard J Sadey

age ~93

from Independence, OH

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Also known as:
  • Richard James Sadey
  • Richard R Sadey
  • Dick J Sadey
  • Rick J Sadey
Phone and address:
5474 Beacon Hill Ct, Cleveland, OH 44131
(216)7413145
Related to:
Connected to:

Richard Sadey Phones & Addresses

  • 5474 Beacon Hill Ct, Independence, OH 44131 • (216)7413145
  • 2717 Commonwealth Ave, Cleveland, OH 44134 • (440)8864875
  • Parma, OH

Work

  • Company:
    Parma city school district
    Oct 2003
  • Position:
    Maintenance foreman

Skills

Iso • Operations Management • Lean Manufacturing • Process Improvement • Kaizen • Continuous Improvement • Root Cause Analysis • Supervisory Skills • 5S • Inventory Management • Six Sigma • Quality Management • Maintenance Management • Manufacturing

Industries

Primary/Secondary Education

Resumes

Richard Sadey Photo 1

Maintenance Foreman

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Location:
Cleveland, OH
Industry:
Primary/Secondary Education
Work:
Parma City School District
Maintenance Foreman
Gould Electronics 1983 - 2003
Supervisor
Ford 1992 - 1995
Supervisor
Skills:
Iso
Operations Management
Lean Manufacturing
Process Improvement
Kaizen
Continuous Improvement
Root Cause Analysis
Supervisory Skills
5S
Inventory Management
Six Sigma
Quality Management
Maintenance Management
Manufacturing

Us Patents

  • Metal Foil With Improved Peel Strength And Method For Making Said Foil

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  • US Patent:
    60427116, Mar 28, 2000
  • Filed:
    Aug 29, 1997
  • Appl. No.:
    8/920405
  • Inventors:
    Richard J. Sadey - Parma OH
    Dennis M. Zatt - Concord OH
  • Assignee:
    Gould Electronics, Inc. - Eastlake OH
  • International Classification:
    C25D 510
    C25D 512
    C25D 706
  • US Classification:
    205111
  • Abstract:
    A metallic foil with improved peel strength is disclosed which has on a surface thereof two superimposed electrodeposited layers, the first layer adjacent to said surface comprising a dusty dendritic deposit comprising a major amount of a first metal and the second layer comprising a metal flash uniformly deposited over said first layer comprising a major amount of a second metal other than said first metal. A method for making such foil is disclosed which comprises (A) electrodepositing a first metal on one surface of said foil to produce a dusty dendritic metal deposit and (B) electrodepositing on the dendritic deposit of (A) a uniform metal flash. The improved foil is useful for a wide range of applications that benefit from the improved bonding to substrates, including electronic applications such as laminated electronic devices, such as printed circuit boards, and solid state switches.
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