Richard H Smart

US Patent:

20160274321, Sep 22, 2016

Filed:

Mar 19, 2016

Appl. No.:

15/075126

Inventors:

- Saxonburg PA, US
Aravanan Gurusami - Morgan Hill CA, US
Richard Smart - Santa Clara CA, US
Mark H. Garrett - Morgan Hill CA, US
Mark Filipowicz - Scotts Valle CA, US

Assignee:

II-VI Incorporated - Saxonburg PA

International Classification:

G02B 6/42
G02B 6/36
G02B 6/12

Abstract:

Optical modules as used in various types of communication systems are formed to include a flexible substrate to support various optical, electronic, and opto-electronic module components in a manner that can accommodate various packaging constraints. The flexible substrate is formed of a polyimide film is known to exhibit excellent electrical isolation properties, even though the films are generally relatively thin (on the order of 10-100 μms, in most cases). The flexible polyimide film is sized to accommodate the constraints of a given package “footprint”; more particularly, sized to fit an open ‘floor area’ within package, allowing for a populated film to be placed around various other “fixed-in-place” elements . The polyimide film is easily cut and trimmed to exhibit whatever topology is convenient, while providing enough surface area to support the affixed components and associated optical fiber traces.

Address:

249 Ancona Dr, Long Beach, CA 90803

Phone:

(562)4395933

VIN:

WMWMF735X7TL91700

Make:

MINI

Model:

COOPER

Year:

2007