Richard Donald Townsend

US Patent:

20060040112, Feb 23, 2006

Filed:

Jul 15, 2003

Appl. No.:

10/519337

Inventors:

Nancy Dean - LIiberty Lake WA, US
Richard Townsend - Post Falls ID, US
Paula Knoll - San Diego CA, US
Colin Edie - Spokane WA, US
My Nguyen - Poway CA, US
Dan Curran - Mountain View CA, US

International Classification:

B32B 9/04
B32B 15/04

US Classification:

428447000, 428457000, 361704000, 156307700

Abstract:

Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component. A method for forming the thermal interface components disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the thermal interface component A suitable interface material can also be produced that comprises at least one solder material. Additionally, a suitable interface material can be produced that comprises at least one solder material and at least one resin component.

US Patent:

20070051773, Mar 8, 2007

Filed:

Sep 2, 2005

Appl. No.:

11/218973

Inventors:

Brian Ruchert - Newman Lake WA, US
James Flint - Mead WA, US
Richard Townsend - Post Falls ID, US

International Classification:

A47J 36/02

US Classification:

228101000

Abstract:

Thermal interface materials are described herein that include at least one phase change material, and at least one solvent, solvent mixture or combination thereof, wherein the at least one solvent, solvent mixture or combination thereof at least partially solvates the at least one phase change material. Methods of producing thermal interface materials are also described that include providing at least one phase change material; providing at least one solvent, solvent mixture or combination thereof, wherein the at least one solvent, solvent mixture or combination thereof at least partially solvates the at least one phase change material; and physically coupling the at least one phase change material and the at least one solvent, solvent mixture or combination thereof.

US Patent:

20070164424, Jul 19, 2007

Filed:

Mar 31, 2004

Appl. No.:

10/551305

Inventors:

Nancy Dean - Liberty Lake WA, US
Richard Townsend - Post Falls ID, US
Paula Knoll - San Diego CA, US
Colin Edie - Spokane WA, US
My Nguyen - Poway CA, US
Dan Curran - Mountain View CA, US
Ignatius Rasiah - Singapore, SG

International Classification:

H01L 23/34

US Classification:

257707000, 257E23087

Abstract:

Components and materials, including thermal transfer materials, contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component. Methods of forming a thermal solution/package and/or IC package includes: a) providing the thermal transfer material described herein; b) providing at least one adhesive component; c) providing at least one surface or substrate; d) coupling the at least one thermal transfer material and/or material with the at least one adhesive component to form an adhesive unit; e) coupling the adhesive unit to the at least one surface or substrate to form a thermal package; f) optionally coupling an additional layer or component to the thermal package.

US Patent:

20150151387, Jun 4, 2015

Filed:

Nov 26, 2014

Appl. No.:

14/554126

Inventors:

- Morristown NJ, US
David E. Steele - Spokane WA, US
Richard G. Townsend - Post Falls ID, US
Kevin B. Albaugh - Liberty Lake WA, US
Xiaodan Wu - Spokane Valley WA, US

International Classification:

B23K 35/28
C22C 18/04

Abstract:

Electronic packaging arrangements having lead-free solders are disclosed. In particular, lead-free solder compositions and lead frame constructs for use therewith are disclosed. The lead-free solder compositions may be zinc-based and may include zinc, aluminum, and germanium as major components and gallium and magnesium as minor components. The lead-free, zinc-based solder compositions may exhibit desirable melting properties, mechanical properties, and wetting properties, for example.