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Robbie John Jorgenson

age ~56

from Minneapolis, MN

Also known as:
  • Robbie J Jorgenson
  • Robert John Jorgenson
  • Rob Jorgenson
  • Robin Jean Jorgenson
  • Robbie John Jorgensen
  • Rob J Jongenson
  • Robert J Woore

Robbie Jorgenson Phones & Addresses

  • Minneapolis, MN
  • San Jose, CA
  • San Diego, CA
  • Eagan, MN
  • Scottsdale, AZ
  • Edina, MN
  • 2442 Rice St LOT 97, Saint Paul, MN 55113

Work

  • Position:
    Precision Production Occupations

Us Patents

  • Iii-Nitride Light-Emitting Devices With One Or More Resonance Reflectors And Reflective Engineered Growth Templates For Such Devices, And Methods

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  • US Patent:
    7915624, Mar 29, 2011
  • Filed:
    Aug 3, 2007
  • Appl. No.:
    11/882730
  • Inventors:
    Robbie J. Jorgenson - Scottsdale AZ, US
  • Assignee:
    Lightwave Photonics, Inc. - Encinitas CA
  • International Classification:
    H01L 29/22
  • US Classification:
    257 94
  • Abstract:
    A light emitter includes a first mirror that is an epitaxially grown metal mirror, a second mirror, and an active region that is epitaxially grown such that the active region is positioned at or close to, at least, one antinode between the first mirror and the second mirror.
  • Iii-Nitride Light-Emitting Devices With Reflective Engineered Growth Templates And Methods Of Manufacture

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  • US Patent:
    8253157, Aug 28, 2012
  • Filed:
    Mar 29, 2011
  • Appl. No.:
    13/075104
  • Inventors:
    Robbie J. Jorgenson - San Diego CA, US
  • Assignee:
    Lightwave Photonics, Inc. - Encinitas CA
  • International Classification:
    H01L 29/20
    H01L 33/60
  • US Classification:
    257 98
  • Abstract:
    A light emitter includes a first mirror that is an epitaxially grown metal mirror, a second mirror, and an active region that is epitaxially grown such that the active region is positioned at or close to, at least, one antinode between the first mirror and the second mirror.
  • Current-Injecting/Tunneling Light-Emitting Device And Method

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  • US Patent:
    20090212278, Aug 27, 2009
  • Filed:
    Feb 25, 2009
  • Appl. No.:
    12/393029
  • Inventors:
    Robbie J. Jorgenson - San Diego CA, US
    David J. King - Eagan MN, US
  • Assignee:
    LIGHTWAVE PHOTONICS, INC. - Encinitas CA
  • International Classification:
    H01L 33/00
    H05K 13/00
  • US Classification:
    257 13, 438 29, 29729, 257 14, 257E33008, 257E33068
  • Abstract:
    An apparatus and method for making it. Some embodiments include a light-emitting device having a light-emitting active region; a tunneling-barrier (TB) structure facing adjacent the active region; a TB grown-epitaxial-metal-mirror (TB-GEMM) structure facing adjacent the TB structure, wherein the TB-GEMM structure includes at least one metal is substantially lattice matched to the active region; and a conductivity-type III-nitride crystal structure adjacent facing the active region opposite the TB structure. In some embodiments, the active region includes an MQW structure. In some embodiments, the TB-GEMM includes an alloy composition such that metal current injectors have a Fermi energy potential substantially equal to the sub-band minimum energy potential of the MQW. Some embodiments further include a second mirror (optionally a GEMM) to form an optical cavity between the second mirror and the TB-GEMM structure. In some embodiments, at least one of the GEMM is deposited on, and lattice matched to, a substrate.
  • Method Of Forming Current-Injecting/Tunneling Light-Emitting Device

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  • US Patent:
    20110244609, Oct 6, 2011
  • Filed:
    Nov 30, 2010
  • Appl. No.:
    12/956640
  • Inventors:
    Robbie J. Jorgenson - San Diego CA, US
    David J. King - Eagan MN, US
  • Assignee:
    LIGHTWAVE PHOTONICS, INC. - Encinitas CA
  • International Classification:
    H01L 33/60
    H01L 21/20
  • US Classification:
    438 29, 438478, 257E3306, 257E2109
  • Abstract:
    An apparatus and method for making same. Some embodiments include a light-emitting device having a light-emitting active region; a tunneling-barrier (TB) structure facing adjacent the active region; a TB grown-epitaxial-metal-mirror (TB-GEMM) structure facing adjacent the TB structure, wherein the TB-GEMM structure includes at least one metal is substantially lattice matched to the active region; and a conductivity-type III-nitride crystal structure adjacent facing the active region opposite the TB structure. In some embodiments, the active region includes an MQW structure. In some embodiments, the TB-GEMM includes an alloy composition such that metal current injectors have a Fermi energy potential substantially equal to the sub-band minimum energy potential of the MQW. Some embodiments further include a second mirror (optionally a GEMM) to form an optical cavity between the second mirror and the TB-GEMM structure. In some embodiments, at least one of the GEMM is deposited on, and lattice matched to, a substrate.
  • Iii-Nitride Light-Emitting Devices With Reflective Engineered Growth Templates And Manufacturing Method

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  • US Patent:
    20130056777, Mar 7, 2013
  • Filed:
    Aug 28, 2012
  • Appl. No.:
    13/597130
  • Inventors:
    Robbie J. Jorgenson - Richfield MN, US
  • Assignee:
    LIGHTWAVE PHOTONICS, INC. - Encinitas CA
  • International Classification:
    H01L 33/60
    H01L 33/32
  • US Classification:
    257 98, 257103, 257E33072, 257E33023
  • Abstract:
    A light emitter includes a first mirror that is an epitaxially grown metal mirror, a second mirror, and an active region that is epitaxially grown such that the active region is positioned at or close to, at least, one antinode between the first mirror and the second mirror.
  • Materials, Structures, And Methods For Optical And Electrical Iii-Nitride Semiconductor Devices

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  • US Patent:
    20140008660, Jan 9, 2014
  • Filed:
    Mar 14, 2013
  • Appl. No.:
    13/831350
  • Inventors:
    LIGHTWAVE PHOTONICS, INC. - , US
    Robbie J. Jorgenson - Richfield MN, US
  • Assignee:
    LIGHTWAVE PHOTONICS, INC. - Encinitas CA
  • International Classification:
    H01L 29/20
  • US Classification:
    257 76
  • Abstract:
    The present invention provides materials, structures, and methods for III-nitride-based devices, including epitaxial and non-epitaxial structures useful for III-nitride devices including light emitting devices, laser diodes, transistors, detectors, sensors, and the like. In some embodiments, the present invention provides metallo-semiconductor and/or metallo-dielectric devices, structures, materials and methods of forming metallo-semiconductor and/or metallo-dielectric material structures for use in semiconductor devices, and more particularly for use in III-nitride based semiconductor devices. In some embodiments, the present invention includes materials, structures, and methods for improving the crystal quality of epitaxial materials grown on non-native substrates. In some embodiments, the present invention provides materials, structures, devices, and methods for acoustic wave devices and technology, including epitaxial and non-epitaxial piezoelectric materials and structures useful for acoustic wave devices. In some embodiments, the present invention provides metal-base transistor devices, structures, materials and methods of forming metal-base transistor material structures for use in semiconductor devices.
  • Method And System For Group Iiia Nitride Growth

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  • US Patent:
    20210296113, Sep 23, 2021
  • Filed:
    Dec 28, 2020
  • Appl. No.:
    17/135046
  • Inventors:
    Robbie J. Jorgenson - Minneapolis MN, US
  • International Classification:
    H01L 21/02
  • Abstract:
    A system and method for growing a gallium nitride (GaN) structure that includes providing a template; and growing at least a first GaN layer on the template using a first sputtering process, wherein the first sputtering process includes: controlling a temperature of a sputtering target, and modulating between a gallium-rich condition and a gallium-lean condition, wherein the gallium-rich condition includes a gallium-to-nitrogen ratio having a first value that is greater than and wherein the gallium-lean condition includes the gallium-to-nitrogen ratio having a second value that is less than the first value. Some embodiments include a load lock configured to load a substrate wafer into the system and remove the GaN structure from the system; and a plurality of deposition chambers, wherein the plurality of deposition chambers includes a GaN-deposition chamber configured to grow at least the first GaN layer on a template that includes the substrate wafer.
  • Materials And Structures For Optical And Electrical Iii-Nitride Semiconductor Devices And Methods

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  • US Patent:
    20210296516, Sep 23, 2021
  • Filed:
    Dec 28, 2020
  • Appl. No.:
    17/135012
  • Inventors:
    Robbie J. Jorgenson - Minneapolis MN, US
  • International Classification:
    H01L 31/0304
    G02B 6/122
    B82Y 20/00
    H01L 33/00
    H01L 33/32
    H01L 21/02
    H01L 41/187
    H01L 29/20
    H01L 31/0232
    H01L 31/0352
    H01L 31/18
    H01L 33/06
    H01L 33/10
  • Abstract:
    The present invention provides materials, structures, and methods for III-nitride-based devices, including epitaxial and non-epitaxial structures useful for III-nitride devices including light emitting devices, laser diodes, transistors, detectors, sensors, and the like. In some embodiments, the present invention provides metallo-semiconductor and/or metallo-dielectric devices, structures, materials and methods of forming metallo-semiconductor and/or metallo-dielectric material structures for use in semiconductor devices, and more particularly for use in III-nitride based semiconductor devices. In some embodiments, the present invention includes materials, structures, and methods for improving the crystal quality of epitaxial materials grown on non-native substrates. In some embodiments, the present invention provides materials, structures, devices, and methods for acoustic wave devices and technology, including epitaxial and non-epitaxial piezoelectric materials and structures useful for acoustic wave devices. In some embodiments, the present invention provides metal-base transistor devices, structures, materials and methods of forming metal-base transistor material structures for use in semiconductor devices.

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