Robert Paul Bryan

US Patent:

6799902, Oct 5, 2004

Filed:

Dec 26, 2000

Appl. No.:

09/749283

Inventors:

Gene R. Anderson - Albuquerque NM
Marcelino G. Armendariz - Albuquerque NM
Johnny R. F. Baca - Albuquerque NM
Robert P. Bryan - Albuquerque NM
Richard F. Carson - Albuquerque NM
Dahwey Chu - Albuquerque NM
Frederick B. McCormick - Albuquerque NM
David W. Peterson - Sandia Park NM
Gary D. Peterson - Albuquerque NM
Cathleen A. Reber - Corrales NM
Bill H. Reysen - Lafayette CO

Assignee:

Emcore Corporation - Somerset NJ

International Classification:

G02B 636

US Classification:

385 89, 385 88, 385 14

Abstract:

An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

US Patent:

6863444, Mar 8, 2005

Filed:

Dec 26, 2000

Appl. No.:

09/749285

Inventors:

Gene R. Anderson - Albuquerque NM, US
Marcelino G. Armendariz - Albuquerque NM, US
Johnny R.F. Baca - Albuquerque NM, US
Robert P. Bryan - Albuquerque NM, US
Richard F. Carson - Albuquerque NM, US
Frederick B. McCormick - Albuquerque NM, US
Gregory V. Miller - Kansas City MO, US
David W. Peterson - Sandia Park NM, US
Terrance T. Smith - Albuquerque NM, US

Assignee:

EMCORE Corporation - Somerset NJ

International Classification:

G02B006/36

US Classification:

385 53

Abstract:

This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.

US Patent:

6867377, Mar 15, 2005

Filed:

Dec 26, 2000

Appl. No.:

09/749281

Inventors:

Gene R. Anderson - Albuquerque NM, US
Marcelino G. Armendariz - Albuquerque NM, US
Robert P. Bryan - Albuquerque NM, US
Richard F. Carson - Albuquerque NM, US
Frederick B. McCormick - Albuquerque NM, US
David W. Peterson - Sandia Park NM, US
Gary D. Peterson - Albuquerque NM, US
Bill H. Reysen - Lafayette CO, US

Assignee:

EMCORE Corporation - Somerset NJ

International Classification:

H05K001/00

US Classification:

174254, 385 88

Abstract:

This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board.

US Patent:

6905260, Jun 14, 2005

Filed:

Dec 26, 2000

Appl. No.:

09/749287

Inventors:

Gene R. Anderson - Albuquerque NM, US
Marcelino G. Armendariz - Albuquerque NM, US
Robert P. Bryan - Albuquerque NM, US
Richard F. Carson - Albuquerque NM, US
Dahwey Chu - Albuquerque NM, US
Rachel Knudsen Giunta - Albuquerque NM, US
Robert T. Mitchell - Albuquerque NM, US
Frederick B. McCormick - Albuquerque NM, US
David W. Peterson - Sandia Park NM, US
Merideth A. Rising - Santa Fe NM, US
Cathleen A. Reber - Corrales NM, US
Bill H. Reysen - Lafayette CO, US

Assignee:

Emcore Corporation - Somerset NJ

International Classification:

G02B006/36

US Classification:

385 91, 385 89, 385 88, 385 92

Abstract:

A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser. The first non-opaque material may be a UV optical adhesive that provides an optical path and mechanical stability.

US Patent:

7021836, Apr 4, 2006

Filed:

Dec 26, 2000

Appl. No.:

09/749282

Inventors:

Gene R. Anderson - Albuquerque NM, US
Marcelino G. Armendariz - Albuquerque NM, US
Richard F. Carson - Albuquerque NM, US
Robert P. Bryan - Albuquerque NM, US
Shanalyn Adair Kemme - Albuquerque NM, US
Frederick B. McCormick - Albuquerque NM, US
David W. Peterson - Sandia Park NM, US

Assignee:

Emcore Corporation - Somerset NJ

International Classification:

G02B 6/42

US Classification:

385 89, 385 48

Abstract:

An apparatus and method of attenuating and/or conditioning optical energy for an optical transmitter, receiver or transceiver module is disclosed. An apparatus for attenuating the optical output of an optoelectronic connector including: a mounting surface; an array of optoelectronic devices having at least a first end; an array of optical elements having at least a first end; the first end of the array of optical elements optically aligned with the first end of the array of optoelectronic devices; an optical path extending from the first end of the array of optoelectronic devices and ending at a second end of the array of optical elements; and an attenuator in the optical path for attenuating the optical energy emitted from the array of optoelectronic devices. Alternatively, a conditioner may be adapted in the optical path for conditioning the optical energy emitted from the array of optoelectronic devices.

US Patent:

20020122637, Sep 5, 2002

Filed:

Dec 26, 2000

Appl. No.:

09/749284

Inventors:

Gene Anderson - Albuquerque NM, US
Marcelino Armendariz - Albuquerque NM, US
Robert Bryan - Albuquerque NM, US
Richard Carson - Albuquerque NM, US
Dahwey Chu - Albuquerque NM, US
Frederick McCormick - Albuquerque NM, US
Robert Mitchell - Albuquerque NM, US
David Peterson - Sandia Park NM, US
Bill Reysen - Lafayette CO, US

International Classification:

G02B006/36

US Classification:

385/089000

Abstract:

This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an optoelectronic connector. The optoelectronic connector comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is positioned relative to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the head spreader. Optoelectronic devices may be adapted to the head spreader in such a manner that the devices are accessible through the window in the mounting structure.

US Patent:

20020182848, Dec 5, 2002

Filed:

Jun 1, 2001

Appl. No.:

09/872747

Inventors:

John Joseph - Morgan Hill CA, US
Wenlin Luo - Alburquerque NM, US
Kevin Lear - Ft. Collins CO, US
Robert Bryan - Albuquerque NM, US

International Classification:

H01L021/4763
H01L021/31
H01L021/469

US Classification:

438/623000, 438/759000

Abstract:

This invention relates to a method of improving the fabrication of etched semiconductor devices by using a patterned adhesion promoter layer over a hydrocarbon planarization material. More specifically, the present invention improves the bonding of a metal interconnect layer to a hydrocarbon planarization material, such as polyimide, by inserting an adhesion promotion layer, such as silicon nitride, between the hydrocarbon planarization material and the metal interconnect layer. A process for improving the fabrication of etched semiconductor devices, comprises the steps of: (1) depositing a hydrocarbon planarization material over a substrate; (2) depositing an adhesion promoter over the hydrocarbon planarization material; (3) defining a first mask and etching back the adhesion promoter so as to form an adhesion promoter pad over a portion of the hydrocarbon planarization material; and (4) depositing a first metal over the adhesion promoter pad.

US Patent:

20030057363, Mar 27, 2003

Filed:

Dec 26, 2000

Appl. No.:

09/749286

Inventors:

Gene Anderson - Albuquerque NM, US
Marcelino Armendariz - Albuquerque NM, US
Robert Bryan - Albuquerque NM, US
Richard Carson - Albuquerque NM, US
Edwin Duckett - Albuquerque NM, US
Shanalyn Kemme - Albuquerque NM, US
Frederick McCormick - Albuquerque NM, US
John Nevers - Albuquerque NM, US
David Peterson - Sandia Park NM, US

International Classification:

G02F001/01
G01J001/42

US Classification:

250/227110

Abstract:

An optical power control system is provided that may be used in connection with an optical transmitter, receiver or transceiver module. The optical power control system comprises: (1) an array of optoelectronic devices; (2) an array of optical elements; (3) the array of optical elements optically aligned to the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; (4) a light-receiving device; and (5) a reflector proximate to the array of optical elements, the reflector optically orientated with the array of optoelectronic devices and the light-receiving device such that some emission from at least one optoelectronic device is reflected on at least a portion of the light-receiving device. The optical elements may be optical fibers and may be packaged in a ferrule. The light-receiving device may be a photo-detector or a light pipe. A feedback loop connects the light-receiving device to the array of optoelectronic devices so as to adjust the output of the array of optoelectronic devices in response to the emission detected by the light-receiving device. The reflector scatters the emission from the optoelectronic device, and it may be adapted to a bottom surface of a ferrule. In another embodiment, optical resin is dispensed proximate to the array of optoelectronic devices and light-receiving device. Emission from at least one optoelectronic device is reflected onto the light-receiving device by the optical resin.

Address:

1721 Chamisa Rd NE, Rio Rancho, NM 87144

Phone:

(505)8912541

VIN:

1J8GN58KX8W120408

Make:

JEEP

Model:

LIBERTY

Year:

2008