Robert B Carl

US Patent:

50329537, Jul 16, 1991

Filed:

Aug 15, 1990

Appl. No.:

7/567601

Inventors:

Robert L. Carl - San Diego CA
Ka K. Wai - San Diego CA
Jose L. V. Ortega - Tijuana, MX

Assignee:

Pulse Engineering, Inc. - San Diego CA

International Classification:

H05K 500
H01L 2302

US Classification:

361394

Abstract:

A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and protects the electronic component. The outer ends of the leads extend adjacent a tapered lower edge of the housing. The housing further has projections for engaging the upper surface of a printed circuit board to maintain the housing in a stable upright orientation with the outer ends of the leads in physical contact with corresponding solder pads on the printed circuit board during solder re-flow. The tapered edge of the housing is configured to permit subsequent inspection of a plurality of resulting solder joints for acceptable whetting.