Robert S Carson

US Patent:

55652611, Oct 15, 1996

Filed:

Oct 31, 1994

Appl. No.:

8/331465

Inventors:

Robert T. Carson - Lantana FL
Lisa Reckleben - Boynton Beach FL
Arnold W. Hogrefe - Ft. Lauderdale FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23B 900

US Classification:

428209

Abstract:

A selective call receiver (900) includes a ceramic substrate (820) for conveying an electrical signal. The ceramic substrate (820) has at least one solder pad which includes a solder pad area (110) of an electrical conductor (120) on the ceramic substrate and a solder wettable layer (210). The electrical conductor (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad area (110). The solder wettable layer (210) includes at least 50% indium by weight. A circuit device (410) has at least one circuit terminal which is soldered to the at least one solder pad of the ceramic substrate (820) for electrical interconnection to another circuit device (410) in the selective call receiver (900).

US Patent:

61376906, Oct 24, 2000

Filed:

Aug 18, 1997

Appl. No.:

8/916714

Inventors:

Robert Thomas Carson - Lantana FL
Arnold William Hogrefe - Boynton Beach FL
Frank Juskey - Chandler AZ

Assignee:

Motorola - Schaumburg IL

International Classification:

H05K 118

US Classification:

361779

Abstract:

An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at least one of the solder terminations of the one or more electronic components (18) and the printed circuit traces (14, 16) of the printed circuit substrate (12) has a secondary finish produced by application of an electrolessly deposited nickel film (26) containing phosphorus which is further plated with gold (28). An indium-tin-lead solder paste (22) is utilized in a soldering process to attached the one or more electronics components (18) to the printed circuit traces (14,16) on the printed circuit board (12), such that the indium-tin-lead solder (22) provides improved solder joint integrity with the secondary finish. The electronic components (18) include semiconductor devices such as ball grid arrays (1000) and flip-chip integrated circuits (1010).

US Patent:

44250282, Jan 10, 1984

Filed:

Dec 28, 1981

Appl. No.:

6/334682

Inventors:

Ralph J. Gagnon - Chico CA
Robert T. Carson - Fullerton CA

Assignee:

Hughes Aircraft Company - El Segundo CA

International Classification:

G02F 113

US Classification:

350337

Abstract:

A full color high contrast image projection system with oil coupled dichroics and a single projection lens is disclosed. The invention includes a unitary optical tank in which a prepolarizer and dichroic separators are mounted in fixed alignment relative to a main polarizing prism. The prepolarizer acts on the incident light from a source to polarize the green light and reflect the S component out of the system. The red and blue components are transmitted unchanged. The main polarizer is mounted at a 90. degree. twist relative to the prepolarizer so that it reflects the green light to a first light valve via a first dichroic separator. The polarized red and blue components are transmitted to second and third light valves via a second dichroic separator. The light valves modulate the polarization state of incident light before returning it to the second beamsplitter. The second beamsplitter then recombines the individual beams into a single output beam.

US Patent:

54631904, Oct 31, 1995

Filed:

Apr 4, 1994

Appl. No.:

8/223413

Inventors:

Robert T. Carson - Boynton Beach FL
Arnold W. Hogrefe - Ft. Lauderdale FL
Frank J. Juskey - Coral Springs FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 100

US Classification:

174259

Abstract:

A conductive adhesive (120) for electrically and mechanically bonding circuit terminals (105) includes a polymer (121) having a predetermined curing temperature range, a first conductive particulate material (125) suspendable in the polymer (121) for providing substantially uniform conductivity throughout the conductive adhesive (120), and a second conductive particulate material (130) suspendable in the polymer (121) for metallurgically bonding together particles of the first particulate material (125). The first conductive particulate material (125) provides substantially uniform conductivity throughout the conductive adhesive (120) and includes metallic particles having a melting point above the curing temperature of the polymer. The second conductive particulate material (130) welds together particles of the first particulate material (125) and includes metallic particles having a melting point within the curing temperature range of the polymer (121).

US Patent:

55435831, Aug 6, 1996

Filed:

Oct 12, 1995

Appl. No.:

8/542122

Inventors:

Robert T. Carson - Lantana FL
Lisa Reckleben - Boynton Beach FL
Arnold W. Hogrefe - Ft. Lauderdale FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 109

US Classification:

174257

Abstract:

A solder pad for mechanically and electrically coupling solder terminals (420) of electronic devices (410) to a non-conductive ceramic substrate (130) includes a solder pad portion (110) of a conductive runner (120) and a solder wettable layer (210). The solder pad portion (110) of the conductive runner (120) is on the non-conductive ceramic substrate (130). The conductive runner (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad portion (110). The solder wettable layer (210) includes at least 50% indium by weight.

US Patent:

57058555, Jan 6, 1998

Filed:

Sep 6, 1996

Appl. No.:

8/709421

Inventors:

Robert Thomas Carson - Lantana FL
Lisa Reckleben - Boynton Beach FL
Dawn He Zhong - Lake Worth FL
Arnold William Hogrefe - Ft. Lauderdale FL
Scott Lawrence Joslin - Boca Raton FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2348
H05K 702

US Classification:

257737

Abstract:

An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).