Robert S Chen

US Patent:

6660975, Dec 9, 2003

Filed:

Aug 16, 2002

Appl. No.:

10/223226

Inventors:

Albert Wang - Moraga CA
Robert Chen - El Sobrante CA

Assignee:

Matrix Integrated Systems, Inc. - Richmond CA

International Classification:

H05B 368

US Classification:

2194441, 296101

Abstract:

Methods and structures are provided for extremely flat wafer chucks, allowing close thermal contact uniformly across a semiconductor processing substrate. An upper and a lower section are tightly fit to one another with flat inner surfaces in face-to-face contact. The sections also define at least one groove therebetween. The two sections have asymmetrical thickness, but the groove defined therebetween is correspondingly asymmetrical such that the groove is centered in the assembled chuck. A heater element, such as a resistive heater, is placed within the groove with some clearance prior to assembling the upper and lower sections. After assembly and tightening, the chuck is thermally cycled above the normal operating temperature prior to secondary machining, thus assuring flatness that is maintained during high temperature operation.

US Patent:

6915335, Jul 5, 2005

Filed:

Sep 17, 2001

Appl. No.:

09/955004

Inventors:

Ming Chi Chen - Union City CA, US
Robert Chen - Fremont CA, US
Sanjoy Dey - Fremont CA, US
James Everett Grishaw - Santa Clara CA, US
Mick Henniger - Buchanan Dam TX, US

Assignee:

Cisco Technology, Inc. - San Jose CA

International Classification:

G06F015/16

US Classification:

709213, 709250, 709229, 710 8, 710 10, 710 11, 710 15

Abstract:

A method and apparatus for implementing host management of an intelligent daughtercard utilizes a high-speed serial link and a defined plurality of serial protocol commands to provide high bandwidth control path for management of daughtercard memory and application specific initialization and/or configuration changes.

US Patent:

7572647, Aug 11, 2009

Filed:

Feb 2, 2007

Appl. No.:

11/670728

Inventors:

Robert Chen - Fremont CA, US
Canfeng Lai - Fremont CA, US
Xinglong Chen - San Jose CA, US
Weiyi Luo - Fremont CA, US
Zhong Qiang Hua - Saratoga CA, US
Siqing Lu - San Jose CA, US
Muhammad Rasheed - Fremont CA, US
Qiwei Liang - Fremont CA, US
Dmitry Lubomirsky - Cupertino CA, US
Ellie Y. Yieh - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/00

US Classification:

438 5, 438788, 257E21528, 257E21478, 427 9, 42725523

Abstract:

A coil is provided for use in a semiconductor processing system to generate a plasma with a magnetic field in a chamber. The coil comprises a first coil segment, a second coil segment and an internal balance capacitor. The first coils segment has a first end and a second end. The first end of the coil segment is adapted to connect to a power source. The second coil segment has a first and second end. The second end of the first coil segment is adapted to connect to an external balance capacitor. The internal balance capacitor is connected in series between the second end of the first coil segment and the first end of the second coil segment. The internal balance capacitor and the coil segments are adapted to provide a voltage peak along the first coil segment substantially aligned with a virtual ground along the second coil segment.

US Patent:

7789993, Sep 7, 2010

Filed:

Feb 2, 2007

Appl. No.:

11/670662

Inventors:

Robert Chen - Fremont CA, US
Canfeng Lai - Fremont CA, US
Xinglong Chen - San Jose CA, US
Weiyi Luo - Fremont CA, US
Zhong Qiang Hua - Saratoga CA, US
Siqing Lu - San Jose CA, US
Muhammad Rasheed - Fremont CA, US
Qiwei Liang - Fremont CA, US
Dmitry Lubomirsky - Cupertino CA, US
Ellie Y. Yieh - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 16/00
H01L 21/306

US Classification:

15634548, 118723 I, 118723 AN, 31511151

Abstract:

A coil is provided for use in a semiconductor processing system to generate a plasma with a magnetic field in a chamber. The coil comprises a first coil segment, a second coil segment and an internal balance capacitor. The first coils segment has a first end and a second end. The first end of the coil segment is adapted to connect to a power source. The second coil segment has a first and second end. The second end of the first coil segment is adapted to connect to an external balance capacitor. The internal balance capacitor is connected in series between the second end of the first coil segment and the first end of the second coil segment. The internal balance capacitor and the coil segments are adapted to provide a voltage peak along the first coil segment substantially aligned with a virtual ground along the second coil segment.

US Patent:

7952982, May 31, 2011

Filed:

Jun 30, 2008

Appl. No.:

12/215992

Inventors:

Robert Chen - San Francisco CA, US
Qing Ma - San Jose CA, US
Valluri Rao - Saratoga CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G11B 9/00

US Classification:

369126

Abstract:

A data storage medium includes a piezoelectric film () having a surface () including a halogen. In one embodiment, the halogen exists in an atomic concentration of at least approximately 10 percent. The result is a hydrophobic surface conducive to long-lasting scanning probe tips, low contamination, and stable surface charge. A data storage device incorporating the data storage medium includes an enclosure () containing the data storage medium and an adjacent scanning probe () wherein the enclosure has a relative humidity of at least approximately 40 percent and at least a portion of the scanning probe is coated with a layer of water.

US Patent:

20010035403, Nov 1, 2001

Filed:

Dec 27, 2000

Appl. No.:

09/749241

Inventors:

Albert Wang - Moraga CA, US
Robert Chen - El Sobrante CA, US

International Classification:

H05B003/74

US Classification:

219/444100, 219/468100

Abstract:

Methods and structures are provided for extremely flat wafer chucks, allowing close thermal contact uniformly across a semiconductor processing substrate. An upper and a lower section are tightly fit to one another with flat inner surfaces in face-to-face contact. The sections also define at least one groove therebetween. The two sections have asymmetrical thickness, but the groove defined therebetween is correspondingly asymmetrical such that the groove is centered in the assembled chuck. A heater element, such as a resistive heater, is placed within the groove with some clearance prior to assembling the upper and lower sections. After assembly and tightening, the chuck is thermally cycled above the normal operating temperature prior to secondary machining, thus assuring flatness that is maintained during high temperature operation.

US Patent:

20080188090, Aug 7, 2008

Filed:

Feb 2, 2007

Appl. No.:

11/670701

Inventors:

Robert Chen - Fremont CA, US
Canfeng Lai - Fremont CA, US
Xinglong Chen - San Jose CA, US
Weiyi Luo - Fremont CA, US
Zhong Qiang Hua - Saratoga CA, US
Siqing Lu - San Jose CA, US
Muhammad Rasheed - Fremont CA, US
Qiwei Liang - Fremont CA, US
Dmitry Lubomirsky - Cupertino CA, US
Ellie Y. Yieh - San Jose CA, US

Assignee:

APPLIED MATERIALS, INC. - Santa Clara CA

International Classification:

H01L 21/31
C23C 16/452

US Classification:

438778, 118723 R, 257E2124

Abstract:

A coil is provided for use in a semiconductor processing system to generate a plasma with a magnetic field in a chamber. The coil comprises a first coil segment, a second coil segment and an internal balance capacitor. The first coils segment has a first end and a second end. The first end of the coil segment is adapted to connect to a power source. The second coil segment has a first and second end. The second end of the first coil segment is adapted to connect to an external balance capacitor. The internal balance capacitor is connected in series between the second end of the first coil segment and the first end of the second coil segment. The internal balance capacitor and the coil segments are adapted to provide a voltage peak along the first coil segment substantially aligned with a virtual ground along the second coil segment.

US Patent:

20210306762, Sep 30, 2021

Filed:

Mar 22, 2021

Appl. No.:

17/208154

Inventors:

- San Francisco CA, US
Robert Chen - San Francisco CA, US

International Classification:

H04R 19/04
G10L 15/22
H04R 1/08
H04R 1/10
H04R 1/14

Abstract:

An interactive system can utilize microtechnology (e.g., a micro-electromechanical system (MEMS)), such as miniaturized microphone (e.g., a bone-conducting microphone), audio output device, microprocessor, and signal conversion and propagation means to create a personal area network (PAN) for a user. The system can include a voice input device (e.g., worn on one or more teeth of the user) that outputs a near-field magnetic induction (NFMI) signal based on a whisper input by the user. The NFMI signal is either detected by the user's mobile device, or converted into a wireless signal (e.g., a Bluetooth RF signal) detectable by the user's mobile device, for receiving voice commands (e.g., to provide personal assistant services) via a designated application running on the mobile device.