Robert Conte

US Patent:

7831468, Nov 9, 2010

Filed:

Mar 10, 2003

Appl. No.:

10/386201

Inventors:

Robert V. Conte - Purchase NY, US
Gerard A. Garofolo - Katonah NY, US

International Classification:

G06Q 30/00

US Classification:

705 141, 705 1417

Abstract:

A system for customizing benefits to be made available from benefit providers to financial account holders through their account providers, wherein a promotional enterprise gathers and segments appropriate information in a central server system for use by participant groups, including financial account holders, their account providers, benefit providers, and credit bureaus. Appropriate information is gathered on account holders, with permission, regarding their marketing practices and cross-selling and up-selling mechanisms using their purchasing patterns and behavior. This information is stored in the server system for use in offering account holders enhanced benefit selections in accordance with specific rules that generate free upgrades, fee-based offers, and other cross-sell/up-sell promotions based on the account holders' interests, and which afford product profit opportunity and other pre-determined factors to the participant groups. A knowledge base of account holders is provided tied in directly to both automated and live on-line account holder services and can afford management tools for reporting, measuring, and evaluating suggestions to an account holder's complete portfolio.

US Patent:

20150237724, Aug 20, 2015

Filed:

Feb 18, 2014

Appl. No.:

14/183492

Inventors:

- Deer Park NY, US
Manhong Zhao - New Hyde Park NY, US
Robert Conte - West Babylon NY, US

Assignee:

RSM Electron Power, Inc. - Deer Park NY

International Classification:

H05K 1/03
H01B 13/00
H01B 1/02

Abstract:

The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.