Robert A Conte

US Patent:

6571187, May 27, 2003

Filed:

Feb 9, 2000

Appl. No.:

09/500661

Inventors:

Robert A. Conte - Manalapan NJ

Assignee:

Avaya Technology Corp. - Basking Ridge NJ

International Classification:

G01D 1800

US Classification:

702 85, 324601

Abstract:

A calibration procedure for correcting two port frequency measurements. Calibration standards are initially connected to port one of a network analyzer and individually measured. This process is repeated with port two of the analyzer. A jumper which is used to bridge ports one and two is then connected to port one. At the far end of the jumper, three references are sequentially connected and the combination of the jumper and the terminations are measured. The raw data measured thus far is then processed to extract the two port electrical parameters of the jumper. The measured jumper is then bridged between ports one and two, and a series of measurements are made. Using the known electrical characteristics of the jumper, an intervening network is completely characterized and the measured S and actual S parameters of any device to be tested are relayed.

US Patent:

6647357, Nov 11, 2003

Filed:

Feb 7, 2000

Appl. No.:

09/499208

Inventors:

Robert A. Conte - Manalapan NJ

Assignee:

Avaya Technology Corp. - Basking Ridge NJ

International Classification:

G06F 1900

US Classification:

702189, 702 85, 324638

Abstract:

A method for correcting reciprocity error in two port network measurements, in which an iterative algorithm is used to obtain an optimal symmetric matrix approximation to a measured 2Ã2 reciprocal network. The algorithm smooths measured data to obtain a low noise floor on measurements related to mode conversion in cables and connecting hardware. A geometric interpretation is used to approximate a measured data vector with the closest vector which satisfies the reciprocity constraint. An initial point in the constraint surface (reciprocity manifold) is located, and another point which is a better approximation of the measured data vector which satisfies the reciprocity constraint is generated. By repeating this process, the closest point in the manifold is quickly located. This closest point defines a reciprocal matrix which can be used to estimate the actual device under test (DUT) parameters.

US Patent:

7831468, Nov 9, 2010

Filed:

Mar 10, 2003

Appl. No.:

10/386201

Inventors:

Robert V. Conte - Purchase NY, US
Gerard A. Garofolo - Katonah NY, US

International Classification:

G06Q 30/00

US Classification:

705 141, 705 1417

Abstract:

A system for customizing benefits to be made available from benefit providers to financial account holders through their account providers, wherein a promotional enterprise gathers and segments appropriate information in a central server system for use by participant groups, including financial account holders, their account providers, benefit providers, and credit bureaus. Appropriate information is gathered on account holders, with permission, regarding their marketing practices and cross-selling and up-selling mechanisms using their purchasing patterns and behavior. This information is stored in the server system for use in offering account holders enhanced benefit selections in accordance with specific rules that generate free upgrades, fee-based offers, and other cross-sell/up-sell promotions based on the account holders' interests, and which afford product profit opportunity and other pre-determined factors to the participant groups. A knowledge base of account holders is provided tied in directly to both automated and live on-line account holder services and can afford management tools for reporting, measuring, and evaluating suggestions to an account holder's complete portfolio.

US Patent:

20150237724, Aug 20, 2015

Filed:

Feb 18, 2014

Appl. No.:

14/183492

Inventors:

- Deer Park NY, US
Manhong Zhao - New Hyde Park NY, US
Robert Conte - West Babylon NY, US

Assignee:

RSM Electron Power, Inc. - Deer Park NY

International Classification:

H05K 1/03
H01B 13/00
H01B 1/02

Abstract:

The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.