Robert L Curtis

Address:

908 Lemontree Ct, Arlington, TX 76017

Phone:

(817)4664048

VIN:

KNAFE161X75006898

Make:

KIA

Model:

SPECTRA

Year:

2007

US Patent:

7117929, Oct 10, 2006

Filed:

Oct 27, 2004

Appl. No.:

10/976033

Inventors:

Robert Curtis - Allen TX, US
Brent A. Boudreaux - Highland Village TX, US
Christian L. Belady - McKinney TX, US
Eric C. Peterson - McKinney TX, US
Shaun L. Harris - McKinney TX, US

Assignee:

Hewlett-Packard Development Company, LP. - Houston TX

International Classification:

F28F 7/00

US Classification:

165 803, 165185

Abstract:

A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.

US Patent:

7286352, Oct 23, 2007

Filed:

Apr 15, 2005

Appl. No.:

11/107187

Inventors:

Robert B. Curtis - Allen TX, US
Roy Mehdi Zeighami - Mckinney TX, US
Christian L. Belady - mckinney TX, US
Brent A. Boudreaux - Highland Village TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 7/20
F28F 7/00

US Classification:

361697, 165 803

Abstract:

Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base.

US Patent:

7599761, Oct 6, 2009

Filed:

Jan 19, 2005

Appl. No.:

11/038723

Inventors:

Wade D. Vinson - Magnolla TX, US
Robert B. Curtis - Allen TX, US
David W. Sherrod - Tomball TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G05D 23/00

US Classification:

700300, 700299, 361698

Abstract:

Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.

US Patent:

20080074841, Mar 27, 2008

Filed:

Sep 26, 2006

Appl. No.:

11/526993

Inventors:

Robert Boyd Curtis - Allen TX, US
Robert W. Skoog - Plano TX, US
Christian L. Belady - McKinney TX, US
Jeffrey N. Metcalf - Frisco TX, US

International Classification:

H05K 7/20

US Classification:

361695

Abstract:

An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.

US Patent:

20110209855, Sep 1, 2011

Filed:

Oct 31, 2008

Appl. No.:

13/126439

Inventors:

Eric Peterson - Mckinney TX, US
Robert Boyd Curtis - Richardson TX, US

International Classification:

F28D 15/04
B23P 19/00

US Classification:

16510426, 294262

Abstract:

A component cooling system comprising a heat spreader configured to contact the top surfaces of components mounted on a component board . A heat pipe is attached to the top side of the heat spreader . A pair of cooling manifolds , where each cooling manifold comprises a body having a channel formed in the body and running from a first end of the body to a second end of the body . A fluid inlet attached to the body and coupled to the channel . A fluid outlet attached to the second end of the body and coupled to the channel . At least one heat pipe clamp movable between an open position and a closed position, the heat pipe clamp configured to hold one end of a heat pipe to the top side of the body when in the closed position.