Robert M Fleming

US Patent:

57915229, Aug 11, 1998

Filed:

Nov 30, 1995

Appl. No.:

8/565021

Inventors:

William Lee - Trumbull CT
John J. Corrigan - Washington CT
George T. Bertram - Newtown CT
Robert N. Fleming - New Milford CT

Assignee:

Sealed Air Corporation - Saddle Brook NJ

International Classification:

B67D 560

US Classification:

2221455

Abstract:

A dispenser for dispensing foamable compositions includes a first module comprising a first housing, a fluid flow fitting in the first housing, a shutoff valve in the first housing and in fluid communication with the fluid flow fitting. The dispenser further includes a second module comprising: a second housing, a valving chamber in the second housing for receiving fluid from the shutoff valve and the fluid flow fitting; and an attachment for securing the first and second modules to one another with the valving chamber in fluid communication with the shutoff valve and the fluid flow fitting so that foam precursors can travel from the foam fittings to the valving chamber, and be dispensed from the chamber to form foam.

US Patent:

52098150, May 11, 1993

Filed:

Jun 6, 1991

Appl. No.:

7/711224

Inventors:

Robert J. Fleming - Hopewell Junction NY
Margaret J. Lawson - Newburgh NY
Edward J. Leonard - Fishkill NY
Bryan N. Rhoads - Pine Bush NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2100

US Classification:

156629

Abstract:

A method of forming patterned film onto a substrate includes the steps of: depositing a polyether sulfone release layer 50; depositing a photoresist underlayer 52; patterning a predetermined film pattern through the underlayer 52 and the polyether sulfone layer 50; depositing a film layer 60 onto the wafer, thereby forming a patterned film 62 on the substrate 10; weakening the mechanical bonding strength to the polyether sulfone release layer 50 by immersing it in NMP; stripping off layers 54 and 60 by applying an adhesive backed tape 64 to the top of the film layer and applying a pulling force; and, removing the polyether sulfone release layer 50 by immersing the wafer in a NMP bath.