Robert L Hardesty

US Patent:

6543678, Apr 8, 2003

Filed:

Sep 29, 1997

Appl. No.:

08/939762

Inventors:

John L. Emmons - Los Altos CA
Robert Hardesty - San Ramon CA

Assignee:

The Peregrine Falcon Corporation - Pleasanton CA

International Classification:

B23K 119

US Classification:

22826251, 2282625, 2282621, 228214, 2282629

Abstract:

A method for brazing beryllium-aluminum alloy members to form a beryllium-aluminum alloy assembly and coating the beryllium-aluminum alloy assembly in which an aluminum-silicon based braze alloy is placed between the beryllium-aluminum members at the locations for forming braze joints. The aluminum-silicon based braze alloy is surrounded by a brazing flux comprising aluminum fluoride. The beryllium-aluminum alloy members and the aluminum-silicon based braze alloy are heated to form the beryllium-aluminum alloy assembly. Oxidized surfaces appearing on the beryllium-aluminum alloy members are removed. Thereupon, the beryllium-aluminum alloy assembly is coated by plasma deposition of alumina-titania powder.

US Patent:

6779713, Aug 24, 2004

Filed:

Apr 8, 2003

Appl. No.:

10/409889

Inventors:

John L. Emmons - Los Altos CA
Robert E. Hardesty - San Ramon CA

Assignee:

The Peregrine Falcon Corporation - Pleasanton CA

International Classification:

B23K 119

US Classification:

22826251, 2282621, 2282625, 428654

Abstract:

A method for joining metal parts in which an aluminum rich surface is produced on a first metal part by selective removal of the beryllium component of a beryllium-aluminum alloy, as by said etching. The aluminum rich surface may then be joined to another aluminum rich surface by a brazing.

US Patent:

20090101308, Apr 23, 2009

Filed:

Oct 22, 2007

Appl. No.:

11/876610

Inventors:

Robert E. Hardesty - Danville CA, US

Assignee:

THE PEREGRINE FALCON CORPORATION - Pleasanton CA

International Classification:

F28F 7/00
F28F 3/12

US Classification:

165 804, 165166

Abstract:

A heat pump device and method in which micro-channel embedded pulsating heat pumps are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will become slugs of liquid. Heating of the contents of the micro-channel at an evaporation (heat source) will cause vaporization within the micro-channel and cooling at a heat sink will cause condensation within the micro-channel, acting to both drive fluid flow within the micro-channel and efficiently transfer heat. Such devices could be used in a number of different configuration, including as a stacked set of micro-channel embedded substrates.