Robert T Hirahara

US Patent:

8320099, Nov 27, 2012

Filed:

Nov 15, 2011

Appl. No.:

13/297203

Inventors:

Robert T. Hirahara - San Jose CA, US
Vijay D. Parkhe - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/683
H01T 23/00

US Classification:

361234, 279128

Abstract:

The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.

US Patent:

8464594, Jun 18, 2013

Filed:

Mar 4, 2011

Appl. No.:

13/041293

Inventors:

Kadthala R. Narendrnath - San Jose CA, US
Ashish Bhatnagar - Fremont CA, US
Daniel L. Martin - Cupertino CA, US
Robert T. Hirahara - San Jose CA, US
Gangadhar Sheelavant - Guledgudd, IN

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01F 1/00

US Classification:

73861

Abstract:

A gas nozzle measurement apparatus comprises a controllable gas source to provide across a gas plate having gas nozzles, a flow of gas at a constant pressure or constant flow rate, and a sensor plate sized to cover an area comprising at least a portion of the front face of the gas plate. The sensor plate comprises gas flow sensors arranged in locations that correspond to positions of individual gas nozzles of the gas nozzles of the gas plate such that each gas flow sensor can measure a pressure, flow rate, density, or velocity of a gas stream passing through the individual gas nozzle that faces the gas flow sensor, and generate a signal indicative of, or display, the pressure, flow rate, density, or velocity of the gas stream passing through the individual gas nozzle.

US Patent:

20080190364, Aug 14, 2008

Filed:

Feb 13, 2007

Appl. No.:

11/674669

Inventors:

Christopher Richard Mahon - San Bruno CA, US
Abhijit Desai - Fremont CA, US
Robert T. Hirahara - San Jose CA, US

International Classification:

B05C 13/00
C23C 16/00

US Classification:

118500, 118728, 134 11

Abstract:

A substrate support assembly supports a substrate in a process zone of a process chamber. The substrate support assembly has a support block having an electrode and an arm to hold the support block in the process chamber, the arm having a channel therethrough. The arm has a first clamp to attach to the support block and a second clamp to attach to a chamber component. A silicon cover lock comprising an annular disc shaped and sized to seat in the arm beneath the first clamp to cover and seal off the electrical conductors from the chamber environment.

US Patent:

20090184093, Jul 23, 2009

Filed:

Jan 21, 2008

Appl. No.:

12/017285

Inventors:

ABHI DESAI - Fremont CA, US
Robert T. Hirahara - San Jose CA, US
Calvin Augason - Los Altos CA, US

International Classification:

B23K 11/00
H05B 3/68

US Classification:

2191171, 2194431

Abstract:

An aluminum heated substrate support suitable for use in high temperature substrate processing systems and method for fabricating the same are provided. In one embodiment, an aluminum heated substrate support can include an aluminum body, a stem coupled to the body and a heating element disposed in the body. The body has an average grain size less than about 250 μm. In some embodiments, the stem to body joint is a fully penetrated lap weld that promotes service life of the substrate support.

US Patent:

20100061032, Mar 11, 2010

Filed:

Sep 5, 2008

Appl. No.:

12/205428

Inventors:

Robert T. Hirahara - San Jose CA, US
Vijay D. Parkhe - San Jose CA, US

International Classification:

H01L 21/683

US Classification:

361234

Abstract:

The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.

US Patent:

20200194290, Jun 18, 2020

Filed:

Dec 4, 2019

Appl. No.:

16/702994

Inventors:

- Santa Clara CA, US
Robert Hirahara - San Jose CA, US
Govinda Raj - Santa Clara CA, US

International Classification:

H01L 21/67
H01J 37/32
H01L 21/683

Abstract:

Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.

US Patent:

20200103294, Apr 2, 2020

Filed:

Sep 10, 2019

Appl. No.:

16/566409

Inventors:

- Santa Clara CA, US
Govinda Raj - Santa Clara CA, US
Robert Hirahara - San Jose CA, US

International Classification:

G01L 1/04
H01L 21/683
G01L 1/16

Abstract:

Embodiments disclosed herein include a method of measuring the chucking force of an electrostatic chuck. In an embodiment, the method comprises placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors, and applying a chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck, and processing a plurality of wafers on the electrostatic chuck. In an embodiment, the method further comprises placing the sensor wafer onto the electrostatic chuck, and applying the chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a second chucking force profile of the electrostatic chuck.

US Patent:

20190206712, Jul 4, 2019

Filed:

Mar 5, 2019

Appl. No.:

16/293437

Inventors:

- Santa Clara CA, US
Jim Zhongyi HE - San Jose CA, US
Ramesh GOPALAN - Fremont CA, US
Robert T. HIRAHARA - San Jose CA, US
Govinda RAJ - Santa Clara CA, US

International Classification:

H01L 21/683
H01J 37/32

Abstract:

Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a substrate include simultaneously increasing a voltage applied to a chucking electrode embedded in the ESC substrate support and a backside gas pressure in a backside volume disposed between the substrate and the substrate support to chuck the substrate and reversing the process to de-chuck the substrate.