Robert J May from Ridgefield, WA, age 89

Us Patents

Faraday Rotator Interconnect As A Through-Via Configuration In A Patch Architecture
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US Patent:

20220187548, Jun 16, 2022
Filed:

Dec 15, 2020
Appl. No.:

17/122340
Inventors:

- Santa Clara CA, US
Divya PRATAP - Hillsboro OR, US
Hiroki TANAKA - Chandler AZ, US
Nitin DESHPANDE - Chandler AZ, US
Omkar KARHADE - Chandler AZ, US
Robert Alan MAY - Chandler AZ, US
Sri Ranga Sai BOYAPATI - Chandler AZ, US
Srinivas V. PIETAMBARAM - Chandler AZ, US
Xiaoqian LI - Chandler AZ, US
Sai VADLAMANI - Gilbert AZ, US
Jeremy ECTON - Gilbert AZ, US
International Classification:

G02B 6/42
G02F 1/01
G02F 1/09
Abstract:

Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.

Microelectronic Component Having Molded Regions With Through-Mold Vias
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US Patent:

20220181262, Jun 9, 2022
Filed:

Feb 22, 2022
Appl. No.:

17/677130
Inventors:

- Santa Clara CA, US
Ram Viswanath - Phoenix AZ, US
Xavier Francois Brun - Hillsboro OR, US
Tarek A. Ibrahim - Mesa AZ, US
Jason M. Gamba - Gilbert AZ, US
Manish Dubey - Chandler AZ, US
Robert Alan May - Chandler AZ, US
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 23/538
H01L 23/367
H01L 23/31
H01L 23/00
Abstract:

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic component may include a substrate having a first face and an opposing second face, wherein the substrate includes a through-substrate via (TSV); a first mold material region at the first face, wherein the first mold material region includes a first through-mold via (TMV) conductively coupled to the TSV; and a second mold material region at the second face, wherein the second mold material region includes a second TMV conductively coupled to the TSV.

First Layer Interconnect First On Carrier Approach For Emib Patch
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US Patent:

20230027030, Jan 26, 2023
Filed:

Sep 30, 2022
Appl. No.:

17/958296
Inventors:

- Santa Clara CA, US
Xiaoying GUO - Phoenix AZ, US
Aleksandar ALEKSOV - Chandler AZ, US
Steve S. CHO - Chandler AZ, US
Leonel ARANA - Phoenix AZ, US
Robert MAY - Chandler AZ, US
Gang DUAN - Chandler AZ, US
International Classification:

H01L 23/00
Abstract:

A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. A first solder resist (SR) layer is formed on the first side of the core, wherein the first SR layer comprises a first layer interconnect (FLI) and has a first set of one or more microbumps thereon to bond to one or more logic die. A second solder resist (SR) layer is formed on the second side of the core, wherein the second SR layer has a second set of one or more microbumps thereon to bond with a substrate. One or more bridge dies includes a respective sets of bumps, wherein the one or more bridge dies is disposed flipped over within the core such that the respective sets of bumps face downward and connect to the first set of one or more microbumps in the FLI.

First Layer Interconnect First On Carrier Approach For Emib Patch
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US Patent:

20210343673, Nov 4, 2021
Filed:

Jul 2, 2021
Appl. No.:

17/366469
Inventors:

- Santa Clara CA, US
Xiaoying GUO - Phoenix AZ, US
Aleksandar ALEKSOV - Chandler AZ, US
Steve S. CHO - Chandler AZ, US
Leonel ARANA - Phoenix AZ, US
Robert MAY - Chandler AZ, US
Gang DUAN - Chandler AZ, US
International Classification:

H01L 23/00
Abstract:

A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. A first solder resist (SR) layer is formed on the first side of the core, wherein the first SR layer comprises a first layer interconnect (FLI) and has a first set of one or more microbumps thereon to bond to one or more logic die. A second solder resist (SR) layer is formed on the second side of the core, wherein the second SR layer has a second set of one or more microbumps thereon to bond with a substrate. One or more bridge dies includes a respective sets of bumps, wherein the one or more bridge dies is disposed flipped over within the core such that the respective sets of bumps face downward and connect to the first set of one or more microbumps in the FLI.

Embedded Die Architecture And Method Of Making
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US Patent:

20210305108, Sep 30, 2021
Filed:

Mar 27, 2020
Appl. No.:

16/832851
Inventors:

Robert L. Sankman - Phoenix AZ, US
Rahul N. Manepalli - Chandler AZ, US
Robert Alan May - Chandler AZ, US
Srinivas Venkata Ramanuja Pietambaram - Chandler AZ, US
Bharat P. Penmecha - Chandler AZ, US
International Classification:

H01L 23/15
H01L 25/065
H01L 23/538
H01L 23/31
H01L 21/48
Abstract:

Various examples provide a semiconductor patch. The patch includes a glass core having first and second opposed major surfaces extending in an x-y direction. The patch further includes a conductive via extending from the first major surface to the second major surface substantially in a z-direction. The patch further includes a bridge die embedded in a dielectric material in communication with the conductive via. The patch further includes an overmold at least partially encasing the glass core.

Microelectronic Component Having Molded Regions With Through-Mold Vias
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US Patent:

20210305162, Sep 30, 2021
Filed:

Mar 25, 2020
Appl. No.:

16/829396
Inventors:

- Santa Clara CA, US
Ram Viswanath - Phoenix AZ, US
Xavier Francois Brun - Hillsboro OR, US
Tarek A. Ibrahim - Mesa AZ, US
Jason M. Gamba - Gilbert AZ, US
Manish Dubey - Chandler AZ, US
Robert Alan May - Chandler AZ, US
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 23/538
H01L 23/367
H01L 23/31
H01L 23/00
Abstract:

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic component may include a substrate having a first face and an opposing second face, wherein the substrate includes a through-substrate via (TSV); a first mold material region at the first face, wherein the first mold material region includes a first through-mold via (TMV) conductively coupled to the TSV; and a second mold material region at the second face, wherein the second mold material region includes a second TMV conductively coupled to the TSV.

First Layer Interconnect First On Carrier Approach For Emib Patch
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US Patent:

20200286847, Sep 10, 2020
Filed:

Jan 12, 2018
Appl. No.:

16/646084
Inventors:

- Santa Clara CA, US
Xiaoying GUO - Phoenix AZ, US
Aleksandar ALEKSOV - Chandler AZ, US
Steve S. CHO - Chandler AZ, US
Leonel ARANA - Phoenix AZ, US
Robert MAY - Chandler AZ, US
Gang DUAN - Chandler AZ, US
International Classification:

H01L 23/00
Abstract:

A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. Forming a first solder resist (SR) layer on the first side of the core, wherein the first SR layer comprises a first layer interconnect (FLI) and has a first set of one or more microbumps thereon to bond to one or more logic die. Forming a second solder resist (SR) layer on the second side of the core, wherein the second SR layer has a second set of one or more microbumps thereon to bond with a substrate. One or more bridge dies includes a respective sets of bumps, wherein the one or more bridge dies is disposed flipped over within the core such that the respective sets of bumps face downward and connect to the first set of one or more microbumps in the FLI.

Medicine Doctors

Robert C. May

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Specialties:

Nephrology

Work:

Dialysis Clinic Inc
205 Vly Vw Dr, West Plains, MO 65775
(417)2571683 (phone), (417)2577920 (fax)

Ozarks Community Hospital Evergreen Clinic
1540 E Evergreen St, Springfield, MO 65803
(417)8862747 (phone), (417)8232981 (fax)

Education:

Medical School
University of Chicago Pritzker School of Medicine
Graduated: 1978

Procedures:

Dialysis Procedures
Electrocardiogram (EKG or ECG)
Vaccine Administration

Conditions:

Acute Bronchitis
Acute Pharyngitis
Acute Renal Failure
Acute Sinusitis
Anemia

Languages:

English

Description:

Dr. May graduated from the University of Chicago Pritzker School of Medicine in 1978. He works in West Plains, MO and 1 other location and specializes in Nephrology. Dr. May is affiliated with Mercy Hospital Springfield and Ozarks Community Hospital.

Robert T. May

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Specialties:

Emergency Medicine

Work:

De Gara Physicians Group
50 N Perry St, Pontiac, MI 48342
(248)3385000 (phone), (248)3385129 (fax)

Education:

Medical School
Michigan State University College of Osteopathic Medicine
Graduated: 1997

Procedures:

Vaccine Administration
Arthrocentesis

Conditions:

Abnormal Vaginal Bleeding
Acute Bronchitis
Acute Conjunctivitis
Acute Pancreatitis
Acute Renal Failure

Languages:

English

Description:

Dr. May graduated from the Michigan State University College of Osteopathic Medicine in 1997. He works in Pontiac, MI and specializes in Emergency Medicine. Dr. May is affiliated with Mclaren Oakland.

Robert K. May

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Specialties:

Family Medicine

Work:

Central Ohio Nutrition Center
1904 Bethel Rd, Columbus, OH 43220
(614)4511910 (phone), (614)4511960 (fax)

Education:

Medical School
Ohio State University College of Medicine
Graduated: 1976

Procedures:

Allergen Immunotherapy
Arthrocentesis
Cardiac Stress Test
Destruction of Benign/Premalignant Skin Lesions
Electrocardiogram (EKG or ECG)
Nutrition Therapy
Pulmonary Function Tests
Skin Tags Removal
Vaccine Administration

Conditions:

Acne
Diabetes Mellitus (DM)
Disorders of Lipoid Metabolism
Fractures, Dislocations, Derangement, and Sprains
Gastroesophageal Reflux Disease (GERD)

Languages:

English

Description:

Dr. May graduated from the Ohio State University College of Medicine in 1976. He works in Columbus, OH and specializes in Family Medicine.

Robert Lewis May

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Specialties:

Radiology
Thoracic Surgery
Cardiothoracic Vascular Surgery

Education:

Case Western Reserve University(1963)

Robert Henry May

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Specialties:

Orthopaedic Surgery

Education:

University of Arkansas(1968)

Name / Title

Company / Classification

Phones & Addresses

Robert May
Chief Executive

May,robert
Groceries and Related Products

8412 W. Foothill Dr, Peoria, AZ 85382

Robert S May
Executive Officer

Prudential N.w. Realty
Real Estate Agents and Managers

4700 42Nd Avenue Sw #600, Seattle, WA 98116

Robert S. May
Governing Person

Foxborough Energy Company, LLC
Oil/Gas Exploration Services

(405)2863526

Robert May
Manager, Plant Manager

Solvay Chemicals, Inc
Mfg Industrial Inorganic Chemicals Mfg Alkalies/Chlorine · Other Chemical Merchant Whols

3500 Industrial Way, Longview, WA 98632
PO Box 2099, Longview, WA 98632
(360)4251114, (360)4250291

Robert O May
Incorporator

DOWNTOWN IMPROVEMENT ASSOCIATION OF GREENVILLE, MISSISSIPPI, INC

Robert May
Incorporator

FOURTH DISTRICT (CENTRAL MISSISSIPPI) DENTAL SOCIETY

Robert R. May

MAYFIELD AIRSTRIP LLC

Robert J May

IRELAND - MAY LTD

License Records

Robert R May

License #:

578 - Expired

Issued Date:

Jan 1, 1974

Expiration Date:

Jun 30, 2008

Type:

Psychologist

Robert Bertrand May Md

License #:

7750 - Expired

Category:

Medicine

Issued Date:

Mar 16, 1938

Effective Date:

Nov 13, 1981

Type:

Physician

Robert F May

License #:

NA043366A - Expired

Category:

Real Estate Commission

Type:

Associate Broker (AB)-Standard

Robert Charles May

Address:

16768 W Mckinley St, Goodyear, AZ 85338

License #:

A1219276

Category:

Airmen

Lawyers & Attorneys

Robert S. May, Portland OR - Lawyer

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Office:

Smith Freed & Eberhard PC
111 S.w. Fifth Avenue, Suite 4300, Portland, OR 97204

Phone:

(503)2272424 (Phone), (503)2272535 (Fax)

Specialties:

First Party Insurance
Business Litigation
Personal Injury
Construction Law
Products Liability

Memberships:

Multnomah, Oregon and Washington State Bar Associations
State Bar of Texas
Oregon Association of Defense Counsel
Washington Defense Trial Lawyers Association
Defense Research Institute.

ISLN:

916287472

Admitted:

1998, Oregon and Texas (Inactive)
2005, Washington
U.S. District Court, District of Oregon
U.S. District Court, Eastern and Western Districts of Washington

University:

University of Rochester (B.A., Economics
Certification in Management Studies in Computer Information Systems/Finance, 1990)

Law School:

Willamette University College of Law, J.D., 1997

Links:

Site

Robert May, Portland OR - Lawyer

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Address:

Smith Freed & Eberhard P.C.
111 Sw 5Th Avenue Suite 4300, Portland, OR 97204
(503)2272424

Licenses:

Oregon - Active 1998
Washington - Active 2005
Texas - Not Eligible To Practice In Texas 1998

Education:

Willamette University College of Law
Degree - JD - Juris Doctor - Law
Graduated - 1997
University of Rochester
Degree - BA - Bachelor of Arts - Economics
Graduated - 1990

Specialties:

Insurance - 25%
Defective / Dangerous Products - 25%
Personal Injury - 25%
Business - 25%

Associations:

Defense Research Institute - Member
Multnomah Bar Association - Member
Multnomah Bar Association, Equality Committee - Past Member
Oregon Association of Defense Counsel - Member
Oregon State Bar - Member
State Bar of Texas - Member (inactive)
Washington State Bar Association - Member

Robert R May - Lawyer

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Address:

May Cruz Consultores
(442)4973737 (Office)

Licenses:

Dist. of Columbia - Active 1994

Robert Selden May, Portland OR - Lawyer

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Address:

Smith Freed & Eberhard, PC
111 Sw 5Th Ave Ste 4300, Portland, OR 97204
(503)2272424 (Office)

Licenses:

Idaho - Authorized to practice law 2013

Robert A. May - Lawyer

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Licenses:

Virginia - Authorized to practice law 2009

Specialties:

Criminal Defense - 70%
Speeding / Traffic Ticket - 15%
DUI / DWI - 15%

Robert May - Lawyer

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Office:

Cleary Gottlieb Steen & Hamilton LLP

Specialties:

Administrative Law
Litigation

ISLN:

919852134

Admitted:

1985

University:

University of North Carolina, B.A., 2004

Law School:

Columbia University School of Law, J.D., 2007

Robert May - Lawyer

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Specialties:

Criminal Defense
Speeding & Traffic Ticket
DUI & DWI
Criminal Defense

ISLN:

1000634614

Admitted:

2009

Robert May - Lawyer

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Office:

Juge, Napolitano, Guilbeau, Ruli, Frieman & Whiteley

ISLN:

901423465

Admitted:

1991

University:

Loyola University, 1991; University of New Orleans, B.A., 1984

Wikipedia References

Robert May

About:

Born:

08 January 1938 • Sydney, Australia

Work:

Position:

Member of Academia Europaea • President • Prime Minister • Chairman

Company:

Harvard University faculty • Princeton University faculty • University of Sydney faculty

Education:

Academic degree:

Academics of Imperial College London • Member of the United States National Academy of Sciences • MA • Professor

Studied at:

Sydney Boys High School • University of Sydney

Area of science:

Theoretical physics • Demography

Skills & Activities:

Ascribed status:

Fellow of the Australian Academy of Science

Award:

Australian Knight • Companion of the Order of Australia • Recipient of the Copley Medal • Prize • Balzan Prize • Crafoord Prize

Skill:

Scientific • Technological

Preference:

Independent • Religion • Christianity • Mate

Real Estate Brokers

Robert May, Lethbridge MT Realtor and Mortgage Expert

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Specialties:

Buyer's Agent
Listing Agent
Refinancing
Mortgage Planning

Work:

Canada First Mortgage
2811 13 Ave South
(403)3303039 (Office)

Experience:

20 years

Description:

Lethbridge mortgage and real estate expert available to help with all aspects of Lethbridge and Southern Alberta real estate transacions. As a Lethbridge Realtor and Lethbridge mortgage broker, my focus is entirely upon obtaining the best possible outcomes to your real estate goals. A great property, a fair price, phenomenal interest rates, and confidential service are just the beginning. Lethbridgerealestateblog.com LethbridgeLoans.com

Links:

Site
Blog