Robert F Mcdevitt

US Patent:

20200108755, Apr 9, 2020

Filed:

Oct 4, 2018

Appl. No.:

16/152225

Inventors:

- Chicago IL, US
Robert Francis McDevitt - Seattle WA, US

International Classification:

B60N 2/66
A47C 7/44
B64D 11/06

Abstract:

Seatback support structures may allow a user to selectively adjust the effective stiffness of a seat, between a plurality of settings, to increase individualized comfort for the user. A plurality of stabilizing members may be cantilevered with respect to a base member, with the amount of deflection of the stabilizing members in response to a given load being variable via a stiffness adjustment mechanism of the seatback support structure. Said stiffness adjustment mechanism may include a linkage that is mechanically moved with respect to the stabilizing members to adjust the weight distribution amongst the stabilizing members, thereby adjusting the effective stiffness of the seatback support structure. Such seatback support structures may be configured to operate substantially irrespective to changes in air pressure, and may be incorporated into any number of passenger seats, such as on aircraft, trains, and other vehicles. Methods of forming such seatback support structures are also disclosed.

US Patent:

20200010745, Jan 9, 2020

Filed:

Sep 13, 2019

Appl. No.:

16/570935

Inventors:

- Chicago IL, US
James Daniel Whitt - Renton WA, US
Erdal Bayseckin - Renton WA, US
Robert Francis McDevitt - Seattle WA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

C09J 167/00
C09J 5/00
C09J 175/04
C09J 163/00

Abstract:

A method of applying an adhesive to a non-planar surface. The method includes providing a segmented film adhesive. The segmented film adhesive comprises: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments. The segmented film adhesive is positioned on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface. The liner is removed from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend.

US Patent:

20180112108, Apr 26, 2018

Filed:

Oct 20, 2016

Appl. No.:

15/299020

Inventors:

- Chicago IL, US
James Daniel Whitt - Renton WA, US
Erdal Bayseckin - Renton WA, US
Robert Francis McDevitt - Seattle WA, US

International Classification:

C09J 7/02
C09J 5/00
C09J 175/04
C09J 163/00
C09J 167/00

Abstract:

A segmented film adhesive comprises a liner having a first major surface and a second major surface opposing the first major surface. An adhesive layer is on the liner. The adhesive layer comprises a plurality of contiguous, discrete adhesive segments on the first major surface of the liner.

US Patent:

20170320250, Nov 9, 2017

Filed:

Jul 26, 2017

Appl. No.:

15/659829

Inventors:

- Chicago IL, US
David E. Sterling - Seattle WA, US
Robert F. McDevitt - Seattle WA, US
Randall A. Rogers - Auburn WA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

B29C 45/73
B29C 45/14
C08G 4/00
B29K 71/00
B29C 45/14
B29L 31/00
B29C 45/00

Abstract:

A method for molding amorphous polyether ether ketone including steps of preparing a molten mass including polyether ether ketone, cooling a mold assembly to a temperature of at most about 200 F., and injecting the molten mass into the cooled mold assembly.

US Patent:

20170320251, Nov 9, 2017

Filed:

Jul 26, 2017

Appl. No.:

15/659894

Inventors:

- Chicago IL, US
David E. Sterling - Seattle WA, US
Robert F. McDevitt - Seattle WA, US
Randall A. Rogers - Auburn WA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

B29C 45/73
B29C 45/14
C08G 4/00
B29K 71/00
B29C 45/14
B29L 31/00
B29C 45/00

Abstract:

A method for molding amorphous polyether ether ketone including steps of preparing a molten mass including polyether ether ketone, cooling a mold assembly to a temperature of at most about 200 F., and injecting the molten mass into the cooled mold assembly.

US Patent:

20160096302, Apr 7, 2016

Filed:

Oct 6, 2014

Appl. No.:

14/506816

Inventors:

- Chicago IL, US
David E. Sterling - Seattle WA, US
Robert F. McDevitt - Seattle WA, US
Randall A. Rogers - Auburn WA, US

International Classification:

B29C 45/73
C08G 4/00

Abstract:

A method for molding amorphous polyether ether ketone including steps of preparing a molten mass including polyether ether ketone, cooling a mold assembly to a temperature of at most about 200 F., and injecting the molten mass into the cooled mold assembly.