Robert Einar Nielsen

Address:

6824 W Kirkwood Ct, Boise, ID 83709

VIN:

3FAHP0JA5AR352083

Make:

FORD

Model:

FUSION

Year:

2010

US Patent:

56064730, Feb 25, 1997

Filed:

Sep 21, 1995

Appl. No.:

8/531395

Inventors:

Kent J. Forbord - St. Louis Park MN
Brian W. Sudman - Eden Prairie MN
John S. Putnam - Excelsior MN
Robert J. Nielsen - Eden Prairie MN

Assignee:

Seagate Technology, Inc. - Scotts Valley CA

International Classification:

G11B 512

US Classification:

360 9701

Abstract:

An electrical circuit package including disk drive operation and control circuitry is formed in multiple layers, including a compliant circuitry layer coextensive with the package, and additional conductive and dielectric layers to form relatively stiff circuit panels bonded to the compliant layer and spaced apart from one another. Portions of the compliant layer, between confronting edges of adjacent circuit panels, provide compliant joinder segments. Each joinder segment electrically couples its associated pair of circuit panels, and structurally couples the panels in a manner that permits a selective, non-coplanar orientation of the panels relative to each other. Thus, the panels are electrically and structurally coupled in a manner that facilitates testing the circuit package as a single unit, followed by installation of the package to a disk drive housing with the circuit panels integral with the housing and in the desired non-coplanar arrangement. The non-coplanar arrangement increases area available for supporting semiconductor components. Selectively arranging the components over the available panel surface area facilitates heat dissipation.

US Patent:

59825782, Nov 9, 1999

Filed:

Dec 13, 1996

Appl. No.:

8/766524

Inventors:

Kent J. Forbord - St. Louis Park MN
Brian W. Sudman - Eden Prairie MN
John S. Putnam - Excelsior MN
Robert J. Nielsen - Eden Prairie MN

Assignee:

Seagate Technology, Inc.

International Classification:

G11B 5012

US Classification:

360 9701

Abstract:

An electrical circuit package including disk drive operation and control circuitry is formed in multiple layers, including a compliant circuitry layer coextensive with the package, and additional conductive and dielectric layers to form relatively stiff circuit panels bonded to the compliant layer and spaced apart from one another. Portions of the compliant layer, between confronting edges of adjacent circuit panels, provide compliant joinder segments. Each joinder segment electrically couples its associated pair of circuit panels, and structurally couples the panels in a manner that permits a selective, non-coplanar orientation of the panels relative to each other. Thus, the panels are electrically and structurally coupled in a manner that facilitates testing the circuit package as a single unit, followed by installation of the package to a disk drive housing with the circuit panels integral with the housing and in the desired non-coplanar arrangement. The non-coplanar arrangement increases area available for supporting semiconductor components. Selectively arranging the components over the available panel surface area facilitates heat dissipation.