Robert L Rohr

US Patent:

45682771, Feb 4, 1986

Filed:

Dec 20, 1983

Appl. No.:

6/563434

Inventors:

Robert D. MacInnes - West Redding CT
Carlos C. Periu - Boca Raton FL
Robert L. Rohr - Scarsdale NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

F27B 302
H05B 100
B23K 3102

US Classification:

432120

Abstract:

An improved apparatus and method are disclosed for heating objects, such as electronic chips being bonded to substrates, in which a copper heat exchanger element (12) comprises a circuitous interior passage (26) through which gases pass from a source (30) to be heated by a heater (74) to a desired temperature and to be cleansed of unwanted oxygen by catalytic reaction, prior to entering a furnace chamber (22) heated from below by the heat exchanger element (12) and from above by a further heater (72) and copper plate (60), whereby essentially uniform gas temperature, acceptably low oxygen concentration and fast cycling times are provided in the furnace chamber (22). See FIG. 1.

US Patent:

51540223, Oct 13, 1992

Filed:

Jun 21, 1991

Appl. No.:

7/718733

Inventors:

Pedro A. Chalco - Yorktown Heights NY
Harry D. Euler - Brookfield CT
Robert L. Rohr - Scarsdale NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B24B 100

US Classification:

51281R

Abstract:

A method and apparatus is disclosed for machining very fine, smooth cuts and grooves on minute surfaces such as single point bonding tips. The invention accurately aligns the axis of a reciprocating cutting wire in the direction of reciprocating motion and permits precise positioning and repositioning of the cutting wire on a work surface. The apparatus allows an unobstructed view of the wire in proximity to the workpiece during the alignment, positioning, repositioning, and cutting operations.

US Patent:

40471861, Sep 6, 1977

Filed:

Jan 26, 1976

Appl. No.:

5/652280

Inventors:

Arthur Harry Kendall - Franklin Lakes NJ
Robert Lewis Rohr - Scarsdale NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01D 1518
B23P 1500

US Classification:

346140R

Abstract:

A pre-aimed nozzle device comprises a nozzle block with an orifice wafer attached thereto. The nozzle block has an aiming surface. The orifice wafer comprises an annular orifice element retained in the body of the wafer in a manner whereby the orifice element and wafer are bonded to the nozzle block with the opening of the orifice element perpendicular to the aiming surface. The orifice wafer is made by encapsulating a straight section of glass tubing in a block of ceramic. The block is machined with precision external location surfaces. A groove is machined into the block with internal location surfaces parallel with the external location surfaces. After potting of the tube in the groove with solder glass, the wafer block is cut along planes perpendicular to the external location surfaces to obtain annular orifice elements precisely aimed relative to the wafer body.