Robert J Sheppard

US Patent:

6734552, May 11, 2004

Filed:

Jul 11, 2001

Appl. No.:

09/902878

Inventors:

Edward G. Combs - Foster CA
Robert P. Sheppard - Red Bluff CA
Tai Wai Pun - Tin Shui Wai, HK
Hau Wan Ng - Tuen Mun, HK
Chun Ho Fan - Sham Tseng, HK
Neil Robert McLellen - Mid Levels, HK

Assignee:

ASAT Limited - Tsuen Wan

International Classification:

H01L 2310

US Classification:

257707, 257713, 257717, 257720, 257796, 361688, 361704, 361707, 361709, 361710

Abstract:

In one aspect, the present invention relates to an integrated circuit package includes a scmiconductor die electrically connected to a substrate, a heat sink having a top and a side portion, the heat sink further including an extending finger when viewed from a top of the package, the extending finger including the side portion of the heat sink, a thermally conductive element thermally coupled with an interposed between both the semiconductor die and the heat sink, wherein the thermally conductive element does not directly contact the semiconductor die, and an encapsulant material encapsulating the thermally conductive element and the heat sink such that the top portion and the side portion of the heat sink are exposed to the surroundings of the package.

US Patent:

7015072, Mar 21, 2006

Filed:

Mar 18, 2004

Appl. No.:

10/803782

Inventors:

Edward G. Combs - Foster CA, US
Robert P. Sheppard - Red Bluff CA, US
Tai Wai Pun - Tin Shui Wai, HK
Hau Wang Ng - Tuen Mun, HK
Chun Ho Fan - Sham Tseng, HK
Neil Robert McLellen - Mid Levels, HK

Assignee:

ASAT Limited - Hong Kong

International Classification:

H01L 21/48
H01L 23/10
H05K 7/20

US Classification:

438122, 257707, 257713, 257717, 257720, 361707, 361709, 361710

Abstract:

In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, wherein the assembly includes a heat sink and a thermally conductive element. This aspect further includes resting the assembly on the carrier such that the thermally conductive element does not directly contact the semiconductor die, and encapsulating the thermally conductive element and the heat sink such that a portion of the heat sink is exposed to the surroundings of the package.

US Patent:

20010030355, Oct 18, 2001

Filed:

Feb 26, 2001

Appl. No.:

09/793367

Inventors:

Neil Mclellan - Hong Kong, HK
Nelson Fan - Sham Tseng, HK
Robert Sheppard - Red Bluff CA, US

International Classification:

H01L021/44
H01L021/48
H01L021/50
H01L023/495
H01L023/28

US Classification:

257/666000, 438/123000, 257/668000, 257/673000, 257/676000, 257/787000, 438/124000, 438/127000

Abstract:

Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.

US Patent:

20060223237, Oct 5, 2006

Filed:

Mar 6, 2006

Appl. No.:

11/367708

Inventors:

Edward Combs - Foster CA, US
Robert Sheppard - Red Bluff CA, US
Tai Pun - Hong Kong, HK
Hau Ng - Hong Kong, HK
Chan Fan - Hong Kong, HK
Neil McLellan - Hong Kong, HK

International Classification:

H01L 21/00

US Classification:

438122000

Abstract:

The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.