Robert A Tremmel

US Patent:

20110114498, May 19, 2011

Filed:

Nov 18, 2009

Appl. No.:

12/620746

Inventors:

Robert A. Tremmel - Brownstown MI, US

International Classification:

C25D 3/12

US Classification:

205280

Abstract:

A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfate ions; b) a soluble salt of chloroacetic acid, acetic acid, glycol acid or proprionic acid; and d) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. It does not contain coumarin but produces desirable leveling characteristics. The bath requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

US Patent:

20110155582, Jun 30, 2011

Filed:

Mar 9, 2011

Appl. No.:

13/043783

Inventors:

Robert A. Tremmel - Brownstown MI, US

International Classification:

C25D 3/12

US Classification:

205280, 205271

Abstract:

A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacefic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarin and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

US Patent:

39946940, Nov 30, 1976

Filed:

Mar 3, 1975

Appl. No.:

5/554843

Inventors:

Richard John Clauss - Allen Park MI
Robert Arnold Tremmel - Woodhaven MI

Assignee:

Oxy Metal Industries Corporation - Warren MI

International Classification:

B23P 300

US Classification:

29194

Abstract:

Substantially improved results by way of durability and appearance are accomplished by electrodepositing upon a metallic substrate a plurality of layers of a nickel-iron alloy, the lowermost of which has a relatively high iron content and the uppermost a relatively lower iron content, upon which is electrochemically bonded a nickel layer and an upper layer of microdiscontinuous chromium or equivalent decorative finishing material.

US Patent:

44419694, Apr 10, 1984

Filed:

Mar 29, 1982

Appl. No.:

6/362940

Inventors:

Robert A. Tremmel - Woodhaven MI

Assignee:

OMI International Corporation - Warren MI

International Classification:

C25D 318

US Classification:

204 49

Abstract:

A process and electroplating bath for use in electrodepositing nickel on a base where the electroplating bath includes a coumarin compound and an aryl hydroxy carboxylic acid compound, such as salicylic acid, present in a combined amount effective to provide a ductile, self-leveling nickel deposit. The bath may further include hexyne diol and/or a material selected from the group consisting of primary acetylenic alcohols and adducts of primary acetylenic alcohols, as well as mixtures thereof. It has been found that excellent leveling and physical properties can be maintained utilizing such a bath, while at the same time, the usual coumarin concentration level can be reduced significantly and process life can be dramatically extended. In addition, additives such as butyne diol, and/or aldehydes such as formaldehyde and chloral hydrate may be utilized. It has also been found that corrosion resistance is substantially improved utilizing the process and electroplating bath of the present invention.

US Patent:

44119615, Oct 25, 1983

Filed:

Sep 28, 1981

Appl. No.:

6/305887

Inventors:

Robert A. Tremmel - Woodhaven MI

Assignee:

Occidental Chemical Corporation - Warren MI

International Classification:

B32B 1501
C25D 304
C25D 312
C25D 356

US Classification:

428613

Abstract:

A composite electroplated article and process for making same comprising a body having a plurality of adherent electroplates of controlled thickness and composition thereon. The first layer comprises a nickel-iron alloy containing about 15 to about 50 percent by weight iron; the second layer comprises a nickel-containing plate of a sulfur content of about 0. 02 to about 0. 5 percent by weight; the third layer comprises a nickel-iron alloy containing about 5 to about 19 percent by weight iron but less iron than the first layer. Optionally, a decorative chromium outer layer is applied to the surface of the third layer, and preferably, an intervening nickel plate is interposed between the third layer and outer chromium layer of a type selected to induce micro-discontinuities in the outer chromium layer.

US Patent:

44668651, Aug 21, 1984

Filed:

Jan 11, 1982

Appl. No.:

6/338751

Inventors:

Thaddeus W. Tomaszewski - Dearborn MI
Robert A. Tremmel - Woodhaven MI
Larry T. Rudolph - Rochester MI

Assignee:

OMI International Corporation - Warren MI

International Classification:

C25D 306

US Classification:

204 51

Abstract:

A process for electrodepositing chromium on a conductive substrate employing an electrolyte containing trivalent chromium ions, a complexing agent, and hydrogen ions to provide an acidic pH in which a conductive substrate to be electroplated is immersed in the electrolyte and is cathodically charged and current is passed between the substrate and an anode at least a portion of the surfaces of which is comprised of ferrite whereby the formation of detrimental hexavalent chromium ions in the electrolyte is inhibited and the stability of the pH of the electrolyte is improved.

US Patent:

45212821, Jun 4, 1985

Filed:

Jul 11, 1984

Appl. No.:

6/627715

Inventors:

Robert A. Tremmel - Woodhaven MI

Assignee:

OMI International Corporation - Warren MI

International Classification:

C25D 338

US Classification:

204 52R

Abstract:

An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing agent present in an amount sufficient to complex an effective amount of the copper ions present, a bath soluble and compatible buffering agent present in an amount sufficient to stabilize the pH of the electrolyte, hydroxyl and/or hydrogen ions present in an amount to provide a pH of about 6 to about 10. 5, and sulfamic acid and the bath soluble and compatible salts thereof present in an amount effective to increase the anode efficiency during the electrodeposition of copper from said electrolyte. The electrolyte can optionally, but preferably further contain ammonium ions in combination with the sulfamic acid constituent to further enhance the anode efficiency and a wetting agent present in an amount up to about 2 g/l. The process for electrodepositing copper employing the foregoing electrolyte is performed employing a combination of insoluble anodes and soluble copper anodes adjusted to attain replenishment of the copper ions consumed by the oxidation and dissolving of the copper anode.

US Patent:

46996966, Oct 13, 1987

Filed:

Apr 15, 1986

Appl. No.:

6/850465

Inventors:

Daniel J. Combs - Sterling Heights MI
Sylvia Martin - Utica MI
Robert A. Tremmel - Woodhaven MI
Kenneth D. Snell - Rochester MI
Masaaki Kamitani - Tokyo, JP
Ryoichi Kimizuka - Kanagawa, JP
Takaaki Koga - Kanagawa, JP

Assignee:

OMI International Corporation - Warren MI
Ebara-Udylite Co., Ltd. - Tokyo

International Classification:

C25D 322
C25D 356

US Classification:

204 442

Abstract:

An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent of a class selected from the group consisting of (a) aromatic sulfonic acids, (b) aromatic sulfonamides, sulfonimides and mixed carboxamides/sulfonamides, (c) acetylene alcohols as well as the bath soluble and compatible salts and mixtures thereof. The invention further encompasses the process for electrodepositing a zinc-nickel alloy employing the aforementioned electrolyte.