Robert E Truesdale

US Patent:

56448996, Jul 8, 1997

Filed:

Dec 26, 1995

Appl. No.:

8/578134

Inventors:

Robert Truesdale - Dripping Springs TX

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B65B 3550

US Classification:

53447

Abstract:

Airtight ESD-protected containers (42) are used to transport semiconductor components (12). A reclosable lid (44) snaps onto the rectangular container (42) to provide the airtight environment. The shape of the container allows stacking of multiple containers inside a larger outer box for shipping to the customer site. Both the lid and the container are reusable which provides cost savings spread over their useful life. Transporting semiconductor components in this manner does not use small cardboard boxes or dry-pack bags.