Roger A Graham

US Patent:

8258473, Sep 4, 2012

Filed:

Mar 17, 2011

Appl. No.:

13/050561

Inventors:

Frederick F. Shaapur - Scottsdale AZ, US
Roger J. Graham - Scottsdale AZ, US

Assignee:

Nanotem, Inc. - Scottsdale AZ

International Classification:

H01J 37/244
H01J 37/20

US Classification:

250307, 250311, 25044011, 25044211, 25049221

Abstract:

A method and apparatus for in-situ lift-out rapid preparation of TEM samples. The invention uses adhesives and/or spring-loaded locking-clips in order to place multiple TEM-ready sample membranes on a single TEM support grid and eliminates the use of standard FIB-assisted metal deposition as a bonding scheme. Therefore, the invention circumvents the problem of sputtering from metal deposition steps and also increases overall productivity by allowing for multiple samples to be produced without opening the FIB/SEM vacuum chamber.

US Patent:

6188068, Feb 13, 2001

Filed:

Jun 10, 1998

Appl. No.:

9/095313

Inventors:

Frederick F. Shaapur - Scottsdale AZ
Roger J. Graham - Phoenix AZ

International Classification:

G01N 128

US Classification:

250307

Abstract:

A method of examining a specimen comprising the steps of providing transmission electron microscope apparatus, mounting a specimen in a vacuum chamber of focused ion beam apparatus, isolating a site of the specimen with the focused ion beam apparatus in the vacuum chamber, and with the site located in the vacuum chamber, examining the site with the transmission electron microscope apparatus.

US Patent:

20170330201, Nov 16, 2017

Filed:

May 5, 2017

Appl. No.:

15/588016

Inventors:

- Scottsdale AZ, US
Roger J. Graham - Scottsdale AZ, US

International Classification:

G06Q 30/00
H01J 37/28
G06F 21/85

Abstract:

A physical inspection forensic methodology with an inherent reliable fallback option based on the extraction of quantifiable intrinsic manufacturer-specific process signatures present superficially and/or within the electronic component. The methodology will seek to extract such signatures cost-effectively through a tiered application of the most expedited and least intrusive approaches.