Ron Y Zhang

US Patent:

6944025, Sep 13, 2005

Filed:

Aug 19, 2003

Appl. No.:

10/644941

Inventors:

David M. Hockanson - Boulder Creek CA, US
Ron Zhang - Sunnyvale CA, US
George Zacharisen - Santa Clara CA, US
Deviprasad Malladi - Fremont CA, US

Assignee:

Sun Microsystems, Inc. - Santa Clara CA

International Classification:

H05K007/20

US Classification:

361719, 361704, 361818, 174 163, 257706, 257713

Abstract:

An electromagnetic shielding structure is provided for a microprocessor or other electronic device that emits electromagnetic radiation. The structure includes a heat sink with an integrally formed depending skirt, and a conductive, compressible polymer is applied to a bottom surface of the skirt. The bottom surface mounts against a socket carried on a circuit board and is electrically coupled to a ground plane of the circuit board. The socket substantially surrounds the microprocessor in at least two dimensions (e. g. length and width). A shielding structure is formed at least partly by the heat sink, the socket and the ground plane.

US Patent:

7571059, Aug 4, 2009

Filed:

Jun 28, 2006

Appl. No.:

11/477235

Inventors:

Ron Zhang - Sunnyvale CA, US
Bidyut Sen - Milpitas CA, US

Assignee:

Sun Microsystems, Inc. - Santa Clara CA

International Classification:

G01B 3/44

US Classification:

702 34

Abstract:

A mechanism is disclosed for determining an accelerated test for a device. The method comprises calculating an estimated amount of damage that an element of the device would suffer if the device were operated under a set of specified conditions over a certain period of time (e. g. , expected lifetime of the device). The method further comprises determining an accelerated test to which to subject the element in order to cause the element to suffer an actual amount of damage that is approximately equal to the estimated amount of damage. The accelerated test may be an accelerated test cycle, such as an accelerated temperature cycle.

US Patent:

62432648, Jun 5, 2001

Filed:

Aug 30, 1999

Appl. No.:

9/385474

Inventors:

Vernon P. Bollesen - Milpitas CA
Ron Zhang - Sunnyvale CA
James A. Jones - Saratoga CA

Assignee:

Sun Microsystems, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

A heat sink assembly includes a heat sink, a circuit board and an integrated circuit package. The package is located between the heat sink and the circuit board and attached to a die attach area of the circuit board. A heat sink retainer attached to the heat sink has a base section located adjacent to the circuit board directly opposite the die attach area. The retainer presses the heat sink down uniformly on the package. Further, the downward force applied to the heat sink is countered by an equal upward force applied by the base section of the retainer on the circuit board. Since the base section is located directly opposite the die attach area, the upward force is transferred from the base section directly back to the heat sink without imparting any bending force on the circuit board.

US Patent:

20220264759, Aug 18, 2022

Filed:

Nov 19, 2021

Appl. No.:

17/531470

Inventors:

- Aberdeen NJ, US
Ron Zhang - Sunnyvale CA, US
Peter James Pupalaikis - Ramsey NJ, US
Peter Johannes Winzer - Aberdeen NJ, US
Clinton Randy Giles - Watchung NJ, US
Guilhem de Valicourt - Jersey City NJ, US

International Classification:

H05K 7/14
H05K 7/20

Abstract:

An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45 to 90. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.

US Patent:

20230043794, Feb 9, 2023

Filed:

Apr 22, 2022

Appl. No.:

17/727317

Inventors:

- Aberdeen NJ, US
Ron Zhang - Sunnyvale CA, US

International Classification:

F21V 8/00
G02B 6/42
G02B 6/26
H04B 10/50

Abstract:

A system includes a housing including a front panel, a rear panel, an upper panel, and a lower panel. The system includes a first circuit board or substrate, at least one data processor coupled to the first circuit board or substrate and configured to process data, and at least one optical module coupled to the first circuit board or substrate. Each optical module is configured to perform at least one of (i) convert input optical signals to electrical signals that are provided to the at least one data processor, or (ii) convert electrical signals received from the at least one data processor to output optical signals. The system includes at least one inlet fan mounted near the front panel and configured to increase an air flow across a surface of at least one of (i) the at least one data processor, (ii) a heat dissipating device thermally coupled to the at least one data processor, (iii) the at least one optical module, or (iv) a heat dissipating device thermally coupled to the at least one optical module. The system includes at least one laser module configured to provide optical power to the at least one optical module.

US Patent:

20210349272, Nov 11, 2021

Filed:

Dec 17, 2020

Appl. No.:

17/125314

Inventors:

- Shenzhen, CN
Hindrik Bulthuis - Apeldoorn, NL
Ramsey Selim - Edinburgh, GB
Andrew Grant - Linlithgow Bridge, GB
Lucas Soldano - Milan, IT
Owen Shea - Edinburgh, GB
Josef Wendland - Newark CA, US
Jamie Stokes - Linlithgow, GB
Suresh Rangarajan - Pleasanton CA, US
Josh Oen - Newark CA, US
Ron Zhang - Newark CA, US
Rob Kalman - Newark CA, US
Drew Lundsten - Newark CA, US

International Classification:

G02B 6/42
H04B 10/40

Abstract:

An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.

US Patent:

20210208778, Jul 8, 2021

Filed:

Jun 29, 2017

Appl. No.:

16/075604

Inventors:

- Spring TX, US
Ron ZHANG - Palo Alto CA, US
Scott RAWLINGS - Fort Collins CO, US
Bruce BLAHO - Fort Collins CO, US
Monji JABORI - Houston TX, US

Assignee:

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. - Houston TX

International Classification:

G06F 3/0488
G06F 9/451
G09G 3/20

Abstract:

A display device having a contiguous planar display is operable in a selectable mode in which the planar display has a first area functioning as a primary display and a second area coplanar with and smaller than the first area functioning as a secondary display separate from the primary display. A computing device is to operate the display device in the selectable mode by using the first area of the planar display as a primary graphical user interface (GUI) area and by using the second area of the planar display in the selectable mode as a secondary GUI area isolated from the primary GUI area.

US Patent:

20200386956, Dec 10, 2020

Filed:

Dec 20, 2019

Appl. No.:

16/723949

Inventors:

- Shenzhen, CN
Hendrick Bulthuis - Newark CA, US
Ramsey Selim - Edinburgh, GB
Andrew Grant - Linlithgow Bridge, GB
Lucas Soldano - Milan, IT
Owen Shea - Edinburgh, GB
Josef Wendland - Newark CA, US
Jamie Stokes - Linlithgow, GB
Suresh Rangarajan - Pleasanton CA, US
Josh Oen - Newark CA, US
Ron Zhang - Newark CA, US
Rob Kalman - Newark CA, US
Drew Lundsten - Newark CA, US

International Classification:

G02B 6/42
H04B 10/40

Abstract:

An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.