Ronald Richard Fuller

Address:

1860 S Lindsay Rd, Gilbert, AZ 85295

VIN:

5TFUW5F15AX140678

Make:

TOYOTA

Model:

TUNDRA

Year:

2010

US Patent:

6369678, Apr 9, 2002

Filed:

Jun 12, 2000

Appl. No.:

09/592085

Inventors:

Warren Leroy Seely - Chandler AZ
Ronald Dee Fuller - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01P 308

US Classification:

333246, 333247

Abstract:

An RF assembly ( ) operating at a predetermined wavelength of and having a ground-plane interface ( ) between first and second components ( ) is presented. A bond wire ( ) couples the components ( ) along a bond-wire directrix ( ). The components ( ) have grounding members ( ) establishing substantially coplanar ground planes ( ). The grounding members ( ) are coupled together so as to create a semi-cylindrical slot ( ) having an opening ( ) substantially coincident with the ground planes ( ). The slot has an axis ( ) proximate the bond-wire directrix ( ), and a radius ( ) substantially equal to /2. The slot axis ( ) and the bond-wire directrix ( ) are located within a plane ( ) substantially perpendicular to the ground planes ( ).

US Patent:

6531344, Mar 11, 2003

Filed:

Jul 6, 2000

Appl. No.:

09/611043

Inventors:

Ken Brice-Heames - Mesa AZ
James Landers - Mesa AZ
Ronald Dee Fuller - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2156

US Classification:

438127, 438780, 427 96

Abstract:

A moisture resistant conformal coating ( ) effectively protects high frequency circuits such as gallium arsenide MMICs from humidity and environmental contamination without the performance degradation inherent in conventionally applied conformal coatings. The conformal coating preferably comprises an organic polymer, such as silicone, applied to the MMIC die in a substantially uniform thickness of less than 0. 002 inches, preferably of less than 0. 0015 inches. This is accomplished by applying the organic polymer directly to the surface of the die ( ) in a mixture containing the solid organic polymer diluted with a low surface tension solvent, such as a volatile methyl siloxane.

US Patent:

6775154, Aug 10, 2004

Filed:

Apr 16, 2003

Appl. No.:

10/417739

Inventors:

Warren L. Seely - Chandler AZ
Ronald D. Fuller - Chandler AZ
Robert W. Zienkewicz - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 900

US Classification:

361818, 361816

Abstract:

An electromagnetic baffle arrangement includes a lid ( ) having a trough or air gap ( ) in the side walls of each cavity ( ) of lid ( ). Conductive strips ( ) are applied to a layer of printed circuit board ( ) and each of the legs ( ) of lid ( ). Optionally, to eliminate circulation of electromagnetic signals within air gap ( ) a grounded bolt ( ) may be inserted aperiodically.

US Patent:

48433543, Jun 27, 1989

Filed:

Nov 18, 1988

Appl. No.:

7/273647

Inventors:

Ronald D. Fuller - Mesa AZ
Richard M. Dougherty - Scottsdale AZ
Craig L. Fullerton - Scottsdale AZ
Hugh R. Malone - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01P 122
H01P 115

US Classification:

333 81A

Abstract:

Inductorless bias networks include a bias circuit having a bias return path which is coupled to and biases a variable impedance device in a relatively nonconductive state. Another bias circuit including a FET renders the variable impedance device relatively conductive in response to control signals so that one port is coupled to another port, for instance.

US Patent:

51856549, Feb 9, 1993

Filed:

Nov 27, 1991

Appl. No.:

7/799235

Inventors:

Mark D. Mosher - Scottsdale AZ
Robert Fraser - Tempe AZ
Ronald D. Fuller - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05B 660

US Classification:

257659

Abstract:

An electrostatic RF absorbant circuit carrier assembly (200) is described as having a plastic support structure (100) which consists of an integrally fashioned base (180) and surrounding sidewalls (170) which together form an internal cavity (185). A plurality of conductor paths (125,165) are disposed within the cavity (185). The assembly (200) is completed by a polymeric cover (110) having a surface integrally fashioned to comprise wall members (145) for making contact with conductive paths (165) within the cavity (185). In order to facilitate RF isolation and electrostatic dissipation, the cover (110) is layered with a surface material comprising: a thermosetting matrix system; a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the thermosetting matrix system; and a conductive filler comprising 1 to 4 percent by weight loading of the thermosetting matrix system and the RF absorbing filler.

US Patent:

53264142, Jul 5, 1994

Filed:

Jun 25, 1992

Appl. No.:

7/904319

Inventors:

Mark D. Mosher - Scottsdale AZ
Robert Fraser - Tempe AZ
Ronald D. Fuller - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B32B 3100
H05K 336
H01L 2160

US Classification:

156242

Abstract:

An electrostatic RF absorbant circuit carrier assembly production method including the steps of forming a polymeric support structure having a base and surrounding walls which form an internal cavity from plastic, disposing a plurality of conductor paths within the cavity, forming a polymeric cover having wall members integrally fashioned into a surface thereof, for making contact with conductor paths within the cavity, depositing a layer of surface material on the cover and the cover wall members, said surface material comprising: a thermosetting binder, a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder, such that the surface material absorbs RF energy within a range of 1-60 GHz, and a conductive filler comprising 1 to 4 percent by weight loading of the binder and the RF absorbing filler, such that the surface material has a surface resistivity of 10. sup. 5 -10. sup. 12 ohms/square, and fixing the polymeric cover to the polymeric support structure to cover the cavity and provide said contact between the wall members and the conductive paths, thereby forming a circuit carrier assembly.

US Patent:

59667990, Oct 19, 1999

Filed:

Apr 1, 1997

Appl. No.:

8/831118

Inventors:

Wade Norman Understiller - Mesa AZ
Thomas Andrew Roche - Scottsdale AZ
Ronald Dee Fuller - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01P 1100

US Classification:

29600

Abstract:

A method (60) for molding (67) a component (73) including a free floating insert (11). The method includes steps of providing an insert (11) including one or more weakened regions (23) coupled to a removable leader (20) and molding (67) a moldable compound (25) about the insert (11) and a portion of the removable leader (20). The method (60) further includes a step of pulling (69) on the removable leader (20) to fracture the weakened regions (23) and thereby detach the removable leader (20) from a molded component (73) including the insert (11) therein. The molding step (67) desirably includes a step of injection molding (67) a thermoplastic material (25) about the insert (11) and the portion of the removable leader (20).

US Patent:

59458917, Aug 31, 1999

Filed:

Mar 2, 1998

Appl. No.:

9/032889

Inventors:

Rudy Michael Emrick - Gilbert AZ
Ronald Dee Fuller - Mesa AZ
Wade Norman Understiller - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01P 510

US Classification:

333 26

Abstract:

A waveguide feed is fabricated by first creating a lead frame (10) from a piece of conductive material. The lead frame (10) is shaped by bending arms (22) and probe portions (18) on the lead frame (10) into a desired shape. The lead frame (10) is then placed in a mold and dielectric molding material is added around relevant portions of the lead frame (10). After the dielectric molding material has solidified, excess molding material and extraneous portions of the lead frame (10) are removed from the molded feed assembly. The assembly can then be connectorized and inserted into a waveguide.