Ross L Armstrong

US Patent:

20150013941, Jan 15, 2015

Filed:

Jul 10, 2013

Appl. No.:

13/938560

Inventors:

- Tempe AZ, US
Ross ARMSTRONG - Phoenix AZ, US

International Classification:

H05K 7/20

US Classification:

16510421

Abstract:

An electronics chassis heat-pipe conduction cooling system includes a first chassis wall having multiple heat transfer sleeves defining multiple first chassis slots. A cabinet bottom chassis wall has multiple second chassis slots. A cabinet second chassis wall has multiple heat transfer sleeves defining multiple third chassis slots. Multiple first heat-pipes each have a vertical leg received in one of the first chassis slots and a horizontal leg received in one of the second chassis slots. Multiple second heat-pipes each have a vertical leg received in one of the third chassis slots and a horizontal leg received in one of the second chassis slots. A cold plate in direct contact with the cabinet bottom chassis wall completes a conduction cooling path including the vertical leg of the first and second heat-pipes through the horizontal leg of the first and second heat-pipes and the bottom chassis wall.