Roy Palmer Bell

US Patent:

59172398, Jun 29, 1999

Filed:

Apr 7, 1997

Appl. No.:

8/835228

Inventors:

Roy Bell - Gilbert AZ
Kin Gan - Penang, MY

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2100
H01L 2304

US Classification:

257704

Abstract:

A method for pressing an identification mark into a ceramic lid of an integrated circuit package. The method includes the steps of mixing an oxide material with a binder to create a powder. The powder is then placed into a mold and pressed into a substrate with a press. The bottom of the press has raised or recessed portions arranged in the pattern of an identification mark. The raised or recessed portions press the mark into the powder when the powder is pressed into a substrate. The substrate is then removed from the mold and heated to harden the powder into a ceramic lid. The recessed or raised indicia are relatively deep and wide so that it is difficult to remove the mark with known grinding or laser techniques.

US Patent:

58214550, Oct 13, 1998

Filed:

Jan 29, 1997

Appl. No.:

8/790577

Inventors:

Tetsuya Yamamoto - Mine, JP
Hideyuki Yoshino - Ube, JP
Akihiro Hidaka - Yoshiki-gun, JP
Roy Bell - Gilbert AZ
Rusli Othman - Kedah, MY

Assignee:

Sumitomo Metal (SMI) Electronics Devices, Inc. - Yamaguchi
Intel Corporation - Santa Clara CA

International Classification:

H05K 500

US Classification:

174 521

Abstract:

A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the peripheral side of a ceramic plate. The solder layer has a portion of an increased solder thickness and a portion of a reduced solder thickness extending along the peripheral direction. When sealing the semiconductor package, a gas confined within the inside of the semiconductor chip mounting site of the package substrate may be discharged from the semiconductor package for realizing hermetic sealing.