Sabina J Houle from Pinedale, AZ, age 61

Carbon-Carbon And/Or Metal-Carbon Fiber Composite Heat Spreader
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US Patent:

6469381, Oct 22, 2002
Filed:

Sep 29, 2000
Appl. No.:

09/670923
Inventors:

Sabina J. Houle - Phoenix AZ
Paul A. Koning - Chandler AZ
Greg M. Chrysler - Chandler AZ
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2310
US Classification:

257707, 257704, 257706
Abstract:

A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

Electronic Assembly Having A Wetting Layer On A Thermally Conductive Heat Spreader
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US Patent:

6504242, Jan 7, 2003
Filed:

Nov 15, 2001
Appl. No.:

09/990622
Inventors:

Carl L. Deppisch - Phoenix AZ
Sabina J. Houle - Phoenix AZ
Thomas J. Fitzgerald - Phoenix AZ
Kristopher E. Dayton - Phoenix AZ
Fay Hua - San Jose CA
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2310
US Classification:

257707, 257714, 257706
Abstract:

An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.

Method To Compensate For Stress Between Heat Spreader And Thermal Interface Material
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US Patent:

6748350, Jun 8, 2004
Filed:

Sep 27, 2001
Appl. No.:

09/963438
Inventors:

Christopher L. Rumer - Chandler AZ
Sabina J. Houle - Phoenix AZ
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

G06G 748
US Classification:

703 9, 703 1, 703 5, 703 12, 438118, 438122, 257706, 257709, 361704, 361709, 361705, 374 43, 374 44, 374 57
Abstract:

A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identification of location(s) of high tensile and/or shear stress so that additional thermal interface material may be deposited between the integrated heat spreader and a die in corresponding locations. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.

Heat Spreader With Down Set Leg Attachment Feature
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US Patent:

6756669, Jun 29, 2004
Filed:

Apr 5, 2002
Appl. No.:

10/118220
Inventors:

Sabina J. Houle - Phoenix AZ
Nick Labanok - Phoenix AZ
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2310
US Classification:

257706, 257625, 257707, 257712, 257796, 438 22, 438 24
Abstract:

Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a substrate and a secondary device to the heat spreader, are disclosed.

Apparatus And Method For Containing Excess Thermal Interface Material
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US Patent:

6773963, Aug 10, 2004
Filed:

Jan 16, 2002
Appl. No.:

10/053370
Inventors:

Sabina J. Houle - Chandler AZ
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2144
US Classification:

438122, 438119, 257707, 257719, 257712
Abstract:

A semiconductor package is provided. The semiconductor package includes a semiconductor device supported by a substrate. The package also includes a heat spreader having a surface divided into a central area and a channel. The channel is recessed relative to said die area. The package also includes a thermal interface material layer disposed between the semiconductor device and the surface of the heat spreader to provide thermal conductivity between the semiconductor device and the heat spreader.

Carbon-Carbon And/Or Metal-Carbon Fiber Composite Heat Spreaders
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US Patent:

6837306, Jan 4, 2005
Filed:

Sep 18, 2001
Appl. No.:

09/955889
Inventors:

Sabina J. Houle - Phoenix AZ, US
Paul A. Koning - Chandler AZ, US
Greg M. Chrysler - Chandler AZ, US
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H05K 720
US Classification:

165185, 4282974, 4282991
Abstract:

A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

Integrated Heat Spreader Package For Heat Transfer And For Bond Line Thickness Control And Process Of Making
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US Patent:

6867978, Mar 15, 2005
Filed:

Oct 8, 2002
Appl. No.:

10/266996
Inventors:

Kris J. Whittenburg - Tempe AZ, US
Fay Hua - San Jose CA, US
Carl L. Deppisch - Phoenix AZ, US
Sabina J. Houle - Phoenix AZ, US
Peter Brandenburger - Chandler AZ, US
Kim L. Phillippe - Phoenix AZ, US
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H05K007/20
US Classification:

361719, 361714, 361704, 257713
Abstract:

A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

Integrated Heat Spreader With Downset Edge, And Method Of Making Same
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US Patent:

6882535, Apr 19, 2005
Filed:

Mar 31, 2003
Appl. No.:

10/405055
Inventors:

Nick Labanok - Phoenix AZ, US
Sabina J. Houle - Phoenix AZ, US
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H05K007/20
US Classification:

361704, 361709, 361719, 257706, 165185
Abstract:

A downset edge integrated heat spreader is disclosed. The downset edge can be formed to an industrially accepted flatness with a single stamping operation. The downset edge can provide a surface for fastening the downset edge integrated heat spreader to a mounting substrate. The downset edge can also provide a component recess for mounting a component near a processor, but on the mounting substrate. The downset edge can also provide a warp and bend resistant structure during ordinary field use.

Sabina J Houle