Sam P Kim

US Patent:

6825447, Nov 30, 2004

Filed:

Dec 17, 2002

Appl. No.:

10/321289

Inventors:

Sam H. Kim - Fremont CA
Akihiro Hosokawa - Cupertino CA
Dong Choon Suh - Santa Clara CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

F27B 514

US Classification:

219390, 219411, 219405, 118724, 118725, 118 501, 392416, 392418

Abstract:

Embodiments of the invention generally provides an apparatus and method for heating substrates, comprising a heater disposed within a chamber, a plurality of heated supports movably disposed within the chamber to support at least two substrates thereon and a contamination collector disposed in communication with the chamber.

US Patent:

7007919, Mar 7, 2006

Filed:

Apr 17, 2003

Appl. No.:

10/418682

Inventors:

Wendell Blonigan - Union City CA, US
Emanuel Beer - San Jose CA, US
Dongchoon Suh - Santa Clara CA, US
Jaime Munoz - Los Gatos CA, US
Sam H. Kim - Fremont CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

F16K 3/16

US Classification:

251113, 251193

Abstract:

An actuator assembly for a slit valve door is configured to maintain a slit valve in a closed condition notwithstanding a high pressure differential between adjacent chambers that the slit valve isolates from each other. The slit valve door actuator assembly includes an actuator which moves the slit valve door between open and closed positions, and a locking mechanism to keep the slit valve door in a position to seal the slit valve in resistance to high gas pressure against the slit valve door. The locking mechanism may include a hard stop which is selectively movable into position to block retracting movement of the slit valve door.

US Patent:

7440091, Oct 21, 2008

Filed:

Oct 26, 2004

Appl. No.:

10/973116

Inventors:

William A. Bagley - Tokyo, JP
Paohuei Lee - San Jose CA, US
Kyung-Tae Kim - Suwon, KR
Sam-Kyung Kim - Kumi, KR
Toshio Kiyotake - Hyogo, JP
Sam Kim - Fremont CA, US
Takayuki Matsumoto - Santa Clara CA, US
Jonathan Erik Larson - East Palo Alto CA, US
Makoto Inagawa - Palo Alto CA, US
James Hoffman - San Jose CA, US
Billy C. Leung - Sunnyvale CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01N 21/00

US Classification:

3562372

Abstract:

An apparatus and method incorporating at least two sensors that detect the presence of substrate defects, such as breakage or misalignment, along the lengths of at least two parallel edges of a moving substrate. In one embodiment, an apparatus for detecting substrate defects includes a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors. In another embodiment, an apparatus for detecting substrate defects includes a robot having a substrate support surface, and a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate during substrate transfer on the substrate support surface. In another embodiment, a method of continuously detecting substrate defects includes positioning at least two sensors to continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors, and transmitting a signal from each of the at least two sensors to a controller that continuously monitors the signals from the at least two sensors to detect the presence of a substrate defect.

US Patent:

7834994, Nov 16, 2010

Filed:

Oct 21, 2008

Appl. No.:

12/255629

Inventors:

William A. Bagley - Tokyo, JP
Paohuei Lee - San Jose CA, US
Kyung-Tae Kim - Suwon, KR
Sam-Kyung Kim - Kumi, KR
Toshio Kiyotake - Hyogo, JP
Sam Kim - San Ramon CA, US
Takayuki Matsumoto - Santa Clara CA, US
Jonathan Erik Larson - East Palo Alto CA, US
Makoto Inagawa - Palo Alto CA, US
James Hoffman - San Jose CA, US
Billy C. Leung - Fremont CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01N 21/00

US Classification:

3562372

Abstract:

An apparatus and method incorporating at least two sensors that detect the presence of a substrate is provided. In one embodiment, a method for transferring a substrate in a processing system is described. The method includes positioning a substrate on an end effector in a first chamber, moving the substrate through an opening between the first chamber and a second chamber along a substrate travel path, and sensing opposing sides of the substrate travel path using at least two sensors positioned proximate to the opening, each of the at least two sensors defining a beam path that is directed through opposing edge regions of the substrate when at least a portion of an edge region traverses the beam path.

US Patent:

7845618, Dec 7, 2010

Filed:

Jun 24, 2007

Appl. No.:

11/767518

Inventors:

Sam Hyungsam Kim - San Ramon CA, US
William N. Sterling - Santa Clara CA, US
Paul Brown - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

F16K 1/16

US Classification:

251303, 251177, 251333

Abstract:

Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member coupled to an actuator by a ball joint. The ball joint is configured to allow movement of the door member relative to the lever arm around a center of the ball joint. In one embodiment, a sealing face of the elongated door is curved. In another embodiment, the chamber is one of a chemical vapor deposition chamber, a load lock chamber, a metrology chamber, a thermal processing chamber, or a physical vapor disposition chamber, a load lock chamber, a substrate transfer chamber or a vacuum chamber.

US Patent:

8430961, Apr 30, 2013

Filed:

Sep 5, 2008

Appl. No.:

12/205363

Inventors:

Beom Soo Park - San Jose CA, US
Young Jin Choi - Santa Clara CA, US
Robin L. Tiner - Santa Cruz CA, US
Sam H. Kim - San Ramon CA, US
Soo Young Choi - Fremont CA, US
John M. White - Hayward CA, US
Dong-Kil Yim - Seongnam-si, KR

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 16/00
H01L 21/306

US Classification:

118715, 15634531, 15634532

Abstract:

The present invention generally comprises a method and an apparatus for guiding the flow of processing gases away from chamber walls and slit valve opening. By controlling the flow path of the process gases within a processing chamber, undesirable deposition upon chamber walls and within slit valve openings may be reduced. By reducing deposition in slit valve openings, flaking may be reduced. By reducing deposition on chamber walls, the time between chamber cleaning may be increased. Thus, guiding the flow of processing gases within the processing chamber may increase substrate throughput.

US Patent:

20090083953, Apr 2, 2009

Filed:

Aug 27, 2008

Appl. No.:

12/199456

Inventors:

Sam H. KIM - San Ramon CA, US
Beom Soo PARK - San Jose CA, US
William N. STERLING - Santa Clara CA, US

International Classification:

A44B 21/00

US Classification:

24460

Abstract:

Embodiments described herein relate to a clamp mechanism for a backing plate disposed in a PECVD chamber, comprising an upper clamp portion fixed to an interior portion of a chamber lid, and a lower clamp portion in sliding contact with the upper clamp portion and the backing plate, wherein the lower clamp portion comprises at least one fastener disposed through the lower clamp portion and the chamber lid, the at least one fastener comprising an adjustment member, and wherein rotation of the adjustment member causes lateral movement and compression to the backing plate.

US Patent:

20110126405, Jun 2, 2011

Filed:

Sep 28, 2010

Appl. No.:

12/892892

Inventors:

Jonghoon Baek - San Jose CA, US
Beom Soo Park - San Jose CA, US
Sam Hyungsam Kim - San Ramon CA, US

International Classification:

H01R 43/00
H01L 21/02

US Classification:

29825, 15634534, 118723 E

Abstract:

An electrical ground () of an RF impedance matching network () is connected to a connection area () on the grounded chamber cover () of a plasma chamber. The connection area is offset away from the center of the chamber cover toward a workpiece passageway (). Alternatively, an RF power supply () has an electrically grounded output () that is connected to a connection area () on the chamber cover having such offset. Alternatively, an RF transmission line () has an electrically grounded conductor () that is connected between a grounded output of an RF power supply and a connection area () on the chamber cover having such offset.