Sam K Lee

Address:

6352 Rockshire St, Alexandria, VA 22315

VIN:

JTEGD21A870164513

Make:

TOYOTA

Model:

HIGHLANDER

Year:

2007

US Patent:

20190345624, Nov 14, 2019

Filed:

May 9, 2019

Appl. No.:

16/407421

Inventors:

- Santa Clara CA, US
Paul McHugh - Kalispell MT, US
Sam Lee - Kalispell MT, US
Kyle M. Hanson - Kalispell MT, US
Marvin L. Bernt - Whitefish MT, US
Bioh Kim - Andover MA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 5/22
C25D 5/08
C25D 3/30
C25D 3/38

Abstract:

Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operation and a second bath configured to maintain an anolyte during operation. The system may include a catholyte tank fluidly coupled with the first bath of the two-bath electroplating chamber. The system may also include a contaminant retrieval system configured to remove contaminant ions from the catholyte.

US Patent:

20190301049, Oct 3, 2019

Filed:

Mar 29, 2019

Appl. No.:

16/370265

Inventors:

- Santa Clara CA, US
Greg Wilson - Kalispell MT, US
Andrew Anten - Whitefish MT, US
Richard W. Plavidal - Kalispell MT, US
Eric J. Bergman - Kalispell MT, US
Tricia Youngbull - Kalispell MT, US
Timothy Gale Stolt - Kalispell MT, US
Sam Lee - Kalispell MT, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C25D 21/08
C25D 5/48
C25D 7/12
H01L 21/02
H01L 21/288

Abstract:

Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing frame may include a rim extending circumferentially about an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel. The electroplating apparatus may also include a rinsing assembly including a splash guard that is translatable from a recessed first position to a second position extending at least partially across an access to the plating bath vessel. The rinsing assembly may also include a fluid nozzle extending from the rinsing frame.

US Patent:

20180005881, Jan 4, 2018

Filed:

Jul 1, 2016

Appl. No.:

15/200836

Inventors:

- Santa Clara CA, US
Sam LEE - Kalispell MT, US
Charles SHARBONO - Whitefish MT, US
Marvin Louis BERNT - Kalispell MT, US
Guan Huei SEE - Singapore, SG
Arvind SUNDARRAJAN - Singapore, SG

International Classification:

H01L 21/768
H01L 23/522
H01L 23/532

Abstract:

A method of processing a semiconductor substrate includes: immersing a substrate in a first bath, wherein the substrate comprises a barrier layer, a conductive seed layer, and a patterned photoresist layer defining an opening; providing a first electric current between the conductive seed layer and a first anode disposed in electrical contact with the first bath to deposit a conductive material within the opening; stripping the patterned photoresist layer; immersing the substrate in a second bath; providing a second electric current that is a reverse of the first electric current between the conductive seed layer plus the conductive material and a second anode disposed in electrical contact with the second bath; etching the conductive seed layer from atop a field region of the barrier layer; and etching the barrier layer from atop a field region of the substrate.

US Patent:

20160333492, Nov 17, 2016

Filed:

May 13, 2015

Appl. No.:

14/711639

Inventors:

- Santa Clara CA, US
Charles Sharbono - Whitefish MT, US
Sam K. Lee - Kalispell MT, US

International Classification:

C25D 5/08
C25D 7/00
C25D 5/02

Abstract:

A method for electrochemically processing a microfeature workpiece includes contacting the first surface of the microfeature workpiece with a plating electrolyte in a plating chamber, wherein the plating electrolyte includes at least one metal ion, flowing the plating electrolyte from a first plating electrolyte inlet at the first end of the workpiece to a second plating electrolyte outlet at the second end of the workpiece across the center point of the workpiece, and electrochemically depositing the at least one metal ion onto the first surface of the workpiece. Another method for electrochemically processing a microfeature workpiece includes contacting a first surface of the microfeature workpiece with a plating electrolyte having at least one metal ion, heating the second surface of the workpiece using a heating method, and electrochemically depositing the at least one metal ion onto the first surface of the workpiece.

US Patent:

20140262804, Sep 18, 2014

Filed:

Mar 14, 2013

Appl. No.:

13/828463

Inventors:

- Santa Clara CA, US
Sam K. Lee - Kalispell MT, US

Assignee:

APPLIED Materials, Inc. - Santa Clara CA

International Classification:

C25D 21/02
C25D 7/12

US Classification:

205157, 204274

Abstract:

In electroplating a wafer, the front and/or back side of the wafer is heated or cooled during processing. The wafer may be in contact with a backing plate of an electroplating processor. The backing plate may be heated via electrical heaters, by radiant heaters, or via a heated liquid or gas. The backing plate may alternatively be cooled using electric coolers or cooled liquid or gas. The heated or cooled backing plate then heats or cools the back side of the wafer largely via conduction.