Samuel Y Choi

US Patent:

20070159465, Jul 12, 2007

Filed:

Jan 10, 2006

Appl. No.:

11/328214

Inventors:

Samuel Choi - La Palma CA, US

International Classification:

G06F 3/02

US Classification:

345168000

Abstract:

A keyboard for an information processing machine, such as personal computer, is designed so that each alphanumeric key has a rectangular upper surface of 17 mm to 20 mm in width and 20 mm to 25 mm in length. The distance between the upper surfaces of each key is set as 6 to 10 mm. These sizes are bigger than an average key board to allow an easy operation by a user with bigger body. The keyboard has actuators thereon arranged in a conventional keyboard distribution. But, the whole keyboard set is separated into two pieces of equal size and has apparently different configuration. One upper corner of each piece of the keyboard is pivotally connected to one end of a metal arm with a pivot joint. The other ends of two metal arms are connected each other via another pivot joint. This configuration enables a user adjusting the angle and span between the two pieces of a keyboard to maintain a more comfortable position than using conventional keyboard. A document to be typed can be placed between the two pieces of the keyboard of the current application.

US Patent:

20140070362, Mar 13, 2014

Filed:

Nov 13, 2013

Appl. No.:

14/079232

Inventors:

Kaushik CHANDA - Santa Clara CA, US
Samuel S. CHOI - Fishkill NY, US
Ronald G. FILIPPI - Wappingers Falls NY, US
Stephan GRUNOW - Poughkeepsie NY, US
Naftali E. LUSTIG - Croton on Hudson NY, US
Andrew H. SIMON - Fishkill NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H01L 23/525
H01L 21/768

US Classification:

257529, 438601

Abstract:

E-fuse structures in back end of the line (BEOL) interconnects and methods of manufacture are provided. The method includes forming an interconnect via in a substrate in alignment with a first underlying metal wire and forming an e-fuse via in the substrate, exposing a second underlying metal wire. The method further includes forming a defect with the second underlying metal wire and filling the interconnect via with metal and in contact with the first underlying metal wire thereby forming an interconnect structure. The method further includes filling the e-fuse via with the metal and in contact with the defect and the second underlying metal wire thereby forming an e-fuse structure.

US Patent:

20150235946, Aug 20, 2015

Filed:

May 4, 2015

Appl. No.:

14/702794

Inventors:

- Armonk NY, US
Kaushik Chanda - San Jose CA, US
Samuel S. Choi - Hopewell Junction NY, US
Ronald G. Filippi - Wappingers Falls NY, US
Stephan Grunow - Poughkeepsie NY, US
Naftali E. Lustig - Croton on Hudson NY, US
Andrew H. Simon - Fishkill NY, US

International Classification:

H01L 23/525
H01L 23/522

Abstract:

A metal fuse structure using redundant vias. The redundant vias are formed on one metal level in a stacked via metal fuse structure to force failures to occur in the metal level that does not have the redundant vias. The metal fuse structure includes: a first dielectric layer having a metal feature; a second dielectric layer having a first metal connector embedded therein; and a third dielectric layer having a second metal connector embedded therein. The metal connectors include at least one via and one line, and at least one metal connector has at least two vias.