Sang Eon Kim

US Patent:

6399462, Jun 4, 2002

Filed:

Jun 30, 1997

Appl. No.:

08/885046

Inventors:

Krishnaswamy Ramkumar - San Jose CA
Sang S. Kim - Laguna Hills CA
Sharmin Sadoughi - Cupertino CA
Pamela Trammel - San Jose CA
Avner Shelem - San Jose CA

Assignee:

Cypress Semiconductor Corporation - San Jose CA

International Classification:

H01L 2176

US Classification:

438439, 438297, 438424, 438425

Abstract:

A method of forming a field oxide or isolation region in a semiconductor die. A nitride layer (over an oxide layer disposed over a substrate) is patterned and subsequently etched so that the nitride layer has a nearly vertical sidewall. The oxide layer and the substrate in the isolation region are etched to form a recess in the substrate having a sloped surface with respect to the nearly vertical sidewall of the nitride layer. A field oxide is then grown in the recess using a high pressure, dry oxidizing atmosphere. The sloped sidewall of the substrate effectively moves the face of the exposed substrate away from the edge of the nitride layer sidewall. Compared to non-sloped techniques, the oxidation appears to start with a built-in offset from the patterned etch. This leads to a reduction of oxide encroachment and a nearly non-existent birds beak. The desirable range of slopes for the substrate sidewall is approximately 50Â-80Â with respect to a nearly planar surface of the substrate in the recess.

US Patent:

7300303, Nov 27, 2007

Filed:

Sep 26, 2005

Appl. No.:

11/235394

Inventors:

Peter Kirkpatrick - San Francisco CA, US
Joshua Oen - Fremont CA, US
Sang Kim - Fremont CA, US
Marc Epitaux - Sunnyvale CA, US
Colm Hunt - Sunnyvale CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 12/24

US Classification:

439492, 439 67

Abstract:

An apparatus comprising a spring retainer attachable to a printed circuit board and a spring having a fixed end attached to the spring retainer and a free end that contacts and exerts a force on the printed circuit board when the spring retainer is attached to the printed circuit board. A process comprising attaching a clamp to a printed circuit board, the clamp comprising a spring retainer and a spring having a fixed end attached to the spring retainer and a free end that is in contact with, and exerts a force on, the printed circuit board; and inserting a flexible circuit with one or more electrical contact pads thereon between the spring and the printed circuit board such that the electrical contact pads of the flexible circuit are pressed by the spring against corresponding electrical contact pads on the printed circuit board.

US Patent:

8203805, Jun 19, 2012

Filed:

Mar 5, 2009

Appl. No.:

12/398909

Inventors:

Weidong Huang - San Jose CA, US
Sang Hoon Kim - Berkeley CA, US
Charles M. Mate - San Jose CA, US

Assignee:

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

International Classification:

G11B 5/60

US Classification:

3602354, 360 75, G9B 5229, G9B 21003

Abstract:

A method and apparatus for controlling lubrication in hard disk drives. Hard disk drives often include lubrication on the disks to protect the disks from incidental contact with the head slider. Embodiments of the invention include lubrication control recesses on the air bearing surface (ABS) of the head slider. The recesses reduce air stagnation on the ABS and/or store excess lubrication that migrates from the disk to the head slider. By reducing build-up of lubrication and storing excess lubrication, the lubrication control recesses avoid failure that may occur as a result of the lubrication interfering with the ABS or the read/write elements of the head.

US Patent:

8529776, Sep 10, 2013

Filed:

Jul 25, 2011

Appl. No.:

13/190378

Inventors:

Kyeong Tae Lee - Los Gatos CA, US
Sang Wook Kim - Palo Alto CA, US
Daehee Weon - Cupertino CA, US
Sang-jun Choi - Santa Clara CA, US
Jahyong Kuh - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C03C 15/00

US Classification:

216 41, 438570, 438583, 438706, 438710, 438737

Abstract:

A layer stack over a substrate is etched using a photoresist pattern deposited on the layer stack as a first mask. The photoresist pattern is in-situ cured using plasma. At least a portion of the photoresist pattern can be modified by curing. In one embodiment, silicon by-products are formed on the photoresist pattern from the plasma. In another embodiment, a carbon from the plasma is embedded into the photoresist pattern. In yet another embodiment, the plasma produces an ultraviolet light to cure the photoresist pattern. The cured photoresist pattern is slimmed. The layer stack is etched using the slimmed photoresist pattern as a second mask.

US Patent:

20130319614, Dec 5, 2013

Filed:

Aug 6, 2013

Appl. No.:

13/960760

Inventors:

Sang Wook Kim - Palo Alto CA, US
Daehee Weon - Cupertino CA, US
Sang-jun Choi - Santa Clara CA, US
Jahyong Kuh - San Jose CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/02

US Classification:

15634524

Abstract:

A layer stack over a substrate is etched using a photoresist pattern deposited on the layer stack as a first mask. The photoresist pattern is in-situ cured using plasma. At least a portion of the photoresist pattern can be modified by curing. In one embodiment, silicon by-products are formed on the photoresist pattern from the plasma. In another embodiment, a carbon from the plasma is embedded into the photoresist pattern. In yet another embodiment, the plasma produces an ultraviolet light to cure the photoresist pattern. The cured photoresist pattern is slimmed. The layer stack is etched using the slimmed photoresist pattern as a second mask.

US Patent:

20140042406, Feb 13, 2014

Filed:

Jul 1, 2013

Appl. No.:

13/932834

Inventors:

Chieh-Wei Chen - Cupertino CA, US
Dinesh C. Mathew - Fremont CA, US
Paul S. Drzaic - Morgan Hill CA, US
Sang Ha Kim - Dublin CA, US
Silvio Grespan - Shanghai, CN
John Z. Zhong - Cupertino CA, US
Jean-Pierre Guillou - San Francisco CA, US
Kuo-Hua Sung - San Jose CA, US
Young Bae Park - San Jose CA, US
Vasudha Gupta - Cupertino CA, US

International Classification:

H01L 27/32

US Classification:

257 40, 438 34, 257 91

Abstract:

An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.

US Patent:

20140071354, Mar 13, 2014

Filed:

Jul 12, 2013

Appl. No.:

13/941377

Inventors:

Sang Ha Kim - Dublin CA, US
Hsing Han Ho - Santa Clara CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

G06F 1/16
B32B 38/00

US Classification:

349 12, 156295, 1562755, 1565831, 1563809, 156350

Abstract:

Methods for controlling deformation of laminated display assemblies are described. The laminated display assemblies can include flexible layers. In some embodiments, the flexible layers are sensor layers. Methods involving the use of a thermal press and ultra violet (UV) curing procedure are described. In one embodiment, a thermal press method can be performed by placing a laminated display assembly including the flexible substrate, an ink layer, an adhesive, and a cover on a temperature controlled fixture. A mechanical press can apply pressure to the top of the laminated display assembly. The mechanical press can remove any planar deformity of the flexible layer and can redistribute portions of the adhesive. Following the mechanical pressing, the laminated display assembly can be exposed to UV light to cure the adhesive and thereby fix in place the planar state of the laminated display assembly.

US Patent:

20220329906, Oct 13, 2022

Filed:

Apr 22, 2022

Appl. No.:

17/726858

Inventors:

- San Jose CA, US
Sang Mo Kim - Pleasanton CA, US
Edison Lin - Los Altos Hills CA, US
Milan Patel - Santa Clara CA, US

International Classification:

H04N 21/458
H04N 21/431
H04N 21/435
H04N 21/472
H04N 21/8541

Abstract:

Systems and methods are provided herein for providing a storyline based media content. At least two storylines may be identified, each storyline specifying an order of providing a plurality of episodes from a plurality of interrelated series. Identifiers of the plurality of episodes are displayed. Then identifiers of a first set of the plurality of episodes that are relevant to the first storyline are In graphically modified to indicate relevance to the first storyline. Identifiers of a second set of the plurality of episodes that are relevant to the second storyline are also graphically modified to indicate relevance to the second storyline. A first and second storyline identifier are generating for display to enable storyline selection. The interrelated series are then provided to a user device in the order specified by the selected storyline.