Sangmin M Lee

US Patent:

7064432, Jun 20, 2006

Filed:

Jul 26, 2001

Appl. No.:

10/333199

Inventors:

Sangmin Lee - Rancho Palos Verdes CA, US
Michael Gurvitch - Stony Brook NY, US
Serge Luryi - Setauket NY, US

Assignee:

The Research Foundation of State University of New York - Stony Brook NY

International Classification:

H01L 23/48

US Classification:

257737, 438613

Abstract:

An anisotropically conductive layer “ACL” () for mechanical and electrical bonding of two circuit containing structures, such as a flip chip and carrier is disclosed. The ACL is formed of a rigid insulating substrate () or membrane () with a top and bottom planar surfaces formed with a plurality of pins therein. The pins extend beyond the top and bottom surfaces so that a portion of each pin is exposed. The pins provide electrical connection between contact terminals or pads of the flip chip and carrier and additionally provide mechanical support between the flip chip and carrier so that the flip chip can under go post-bonding processing without substantial deformation or breaking. A method of electrically and mechanically bonding the flip chip and carrier and a method of making a semiconductor device using the ACL is also disclosed.