Hsing-Chien Ma - Fremont CA, US Scott R. Chegwidden - Mountain View CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G03F 1/00
US Classification:
430 5
Abstract:
A composite extreme ultraviolet light (EUV) mask absorber structure and method are disclosed to address the structural and processing requirements of EUV lithography. A first mask absorber layer anisotropically etched with minimal etch bias at a relatively fast etch rate, is combined with a highly-selective second mask absorber layer, to produce a mask absorber with desirable hybrid performance properties.
Hsing-Chien Ma - Fremont CA, US Scott Chegwidden - Mountain View CA, US
International Classification:
C03C025/68
US Classification:
216/054000
Abstract:
A composite extreme ultraviolet light (EUV) mask absorber structure and method are disclosed to address the structural and processing requirements of EUV lithography. A first mask absorber layer anisotropically etched with minimal etch bias at a relatively fast etch rate, is combined with a highly-selective second mask absorber layer, to produce a mask absorber with desirable hybrid performance properties.
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